Infineon Technologies Ag

Siemens Aktiengesellschaft

Avago Technologies Fiber IP (singapore) Pte. Ltd

Albert Auburger

Horst Theuss

Jochen Dangelmaier

Stefan Paulus

Bernd Stadler

Hans Hurt

Josef Hirtreiter

Jean Schmitt

Klaus Elian

Robert Aigner

Bernd Waidhas

Werner Weber

Nikolaus W Schunk

Joachim Reill

Frank Daeche

Gerhard Kuhn

Martin Weigert

Michael Weber

Helmut Wietschorke

Josef Wittl

Thomas Herndl

Rudolf Lehner

Jens Krause

Cyrus Ghahremani

Andreas Meckes

Markus Wicke

Thomas Lichtenegger

Martin Petz

Frank Weberpals

Terje Skog

Joachim Weitzel

Uwe Schindler

Alfred Gottlieb

Jurgen Winterer

Guenter Ehrler

Frank Klose

Peter Gattinger

Volker Geungerich

The invention relates to a semiconductor component () comprising a semiconductor chip () configured as a wafer level package, a magnetic field sensor () being integrated into said semiconductor chip.

Semiconductor component comprising magnetic field sensor

A method for producing a component and device including a component is disclosed. A basic substrate having paper as substrate material is provided, at least one integrated circuit is applied to the basic substrate, the at least one integrated circuit applied on the basic substrate is enveloped with an encapsulant, and at least parts of the basic substrate are removed from the at least one enveloped integrated circuit.

Method for producing a component and device comprising a component

A module including a micro-electro-mechanical microphone is disclosed. One embodiment provides a substrate having a trough-shaped depression and a micro-electro-mechanical microphone. The micro-electro-mechanical microphone is mounted into the trough-shaped depression of the substrate.

Module including a micro-electro-mechanical microphone

Method for producing a component and device having a component

The invention relates to a device comprising a sensor chip and a structure housing the sensor chip. The structure is covered by a mold compound and is fabricated from a ceramic or a glass material.

Electrical device with covering

A sensor device. One embodiment provides a first sensor having a first sensor surface. The first sensor surface is exposed to allow sensing of a first variable. A second sensor has a second sensor surface. The second sensor surface is sealed to inhibit sensing of the first variable, and a mold material is embedded the first and second sensors.

Sensor device including two sensors embedded in a mold material

A device for detecting a measured quantity has a sensor chip for detecting the measured quantity, a supply for providing a power supply, and an injection-molded enclosure for accommodating the sensor chip and the supply, the injection-molded enclosure including integrated conductive traces providing an electrical connection between the sensor chip and the supply.

Sensor component and method for producing a sensor component

A chip carrier includes a first surface and a second surface that opposes the first surface. The chip carrier acts as a heat sink for semiconductor chips arranged on it. A first recess is provided in the first surface, and a second recess is provided in the second surface. First and second semiconductor chips are respectively received in the first and second recesses.

Chip carrier and system including a chip carrier and semiconductor chips

An optocoupler, for converting optical signals into electrical signals and vice versa, includes a package with a jack connector for receiving an optical waveguide. On a lower side of the package, surface-mountable outer contacts are arranged on an interconnection film. A mounting position for semiconductor chips, including one optical semiconductor chip and one application-specific semiconductor chip, is provided in the package on the optical axis of the optical waveguide. The optical semiconductor chip is aligned with the optical axis inside the package. The outer contacts are arranged outside the package on the flexible interconnection film. Between the mounting position and the outer contacts, the interconnection film includes a curved region which is embedded in the package material such that the surface-mountable outer contacts on the lower side of the package are freely accessible.

Optocoupler for converting optical signals into electrical signals and vice versa

A method for producing an optical or electronic module provided with a plastic package including: providing at least one optical or electronic component, the component having an operative region, via which it is in operative connection with the surroundings in the finished module, encapsulating the component with at least one polymer compound to form the plastic package, before or after the encapsulation, ascertaining the position of the component by direct measurement of the position of the component, aligning the component with respect to a device for partially removing the polymer compound or alignment of such a device with respect to the component, the alignment taking place with allowance for the ascertained position of the component, and partial removal of the polymer compound from the outside such that the polymer compound between the operative region and the outer side of the plastic package is at least partially removed.

Method for producing an optical or electronic module provided with a plastic package

A sensor component used to measure a magnetic field strength is disclosed. In one embodiment, the sensor component contains a plurality of leads and a sensor semiconductor chip, which measures the magnetic field strength. The sensor semiconductor chip has pads on its active upper side. These pads are connected electrically to the leads. The sensor component also contains a magnet, which is attached to the leads. The sensor semiconductor chip is arranged on an upper side of the magnet. The sensor component also has a first mold compound which shares a common boundary with the sensor semiconductor chip and surrounds the sensor semiconductor chip, the magnet and parts of the lead.

Integrated magnetic sensor component

An electronic device can include a top side with circuit structures. The circuit structures form the bottom region of a cavity. Each cavity can be surrounded by a cavity frame made of plastic and can have a cavity cover made of semiconductor material.

Electronic device with cavity and a method for producing the same

An electronic sensor device has at least one sensor component, which bears on a bearing base of a rewiring structure. Contact areas of the sensor component are electrically conductively connected to contact pads of the rewiring structure. External contact areas of the rewiring structure are led outward from a housing for the electrical contact-connection of the electronic sensor device. A method is also described for producing the electronic sensor device.

Electronic sensor device and method for producing the electronic sensor device

A radio-frequency power component and a radio-frequency power module, as well as to methods for producing them are encompassed. The radio-frequency power component has a semiconductor chip that is suitable for flip chip mounting. The semiconductor chip has an active upper face that produces power losses. This active upper face is covered by an electrically isolating layer leaving free contact surfaces, with a heat-dissipating metal layer being applied to its upper face. The metal layer directly dissipates the heat losses from the active semiconductor structures.

Radio-frequency power component, radio-frequency power module, method for producing a radio-frequency power component, and method for producing a radio-frequency power module

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Regenstauf, Germany

Albert Auburger