Semiconductor Technologies & Instruments Pte. Ltd.

MIT Semiconductor (tian Jin) Co., Ltd

Generic Power Ptd Ltd

Albert Archwamety

Kok Weng Wong

Ajharali Amanullah

Han Cheng Ge

Ruini Cao

Jun Kang Ng

Chee Chye Lee

Hongtu Guo

The present invention includes a system and method for obtaining high-resolution images of objects such as electrical components. The system includes a monochrome camera and three light sources of different wavelengths (e.g. a red light source, a blue light source and a green light source). The camera successively captures a red light image, a blue light image and a green light image of the object. A processor combines the red light image, the blue light image and the green light image into a single high-resolution true color image. Because each image is obtained from an independent light source, the resolution is not limited by the Bayer (RGB) color model. The system is well suited for materials composed of different materials that may react differently to light sources based on its wavelength.

Method of color inspection by using monochrome imaging with multiple wavelengths of light

The present disclosure provides a system and method to convert three-dimensional data into a two-dimensional height displacement map and extract the three-dimensional features and dimensions of a three-dimensional object using a two-dimensional image processing technique. An illumination source of the system scans across the workspace using a line laser and generates a two-dimensional height displacement map of the workspace. The individual pixel location represents an actual workspace sampled location. The pixel gray scale intensity represents the Z displacement height at the pixel location. A processing device processes the features and dimensions within two-dimensional image as a gray scale using two-dimensional image processing such as pattern match, blob, convolution and edge detection.

Methods of inspecting a 3D object using 2D image processing

A method for inspecting a wafer. The method comprises a training process for creating reference images. The training process comprises capturing a number of images of a first wafer of unknown quality, each of the number of images of the first wafer being captured at a predetermined contrast illumination and each of the number of images of the first wafer comprising a plurality of pixels. The training process also comprises determining a plurality of reference intensities for each of the plurality of pixels of each of the number of images of the first wafer, calculating a plurality of statistical parameters for the plurality of reference intensities of each of the plurality of pixels of each of the number of images of the first wafer, and selecting a plurality of reference images from the plurality of images of the first wafer based on the calculated plurality of statistical parameters. The method for inspecting the wafer further comprises capturing an image of a second wafer, the second wafer being of an unknown quality, selecting a first reference image from the plurality of reference images, and comparing the captured image of the second wafer with the first reference image to thereby determine at least one of presence and type of defect on the second wafer.

System and method for inspecting a wafer

Growing community of inventors

Singapore, Singapore

Albert Archwamety