Science Research Laboratory, Inc.

Polaroid Corporation

Science Research Laboratories, Inc.

Aland K Chin

Richard H Chin

Jonah H Jacob

William T Plummer

Peter P Chow

Siamak Forouhar

John W Ford, Jr

Jeffrey E Bisberg

Mehmet Dogan

Arumugam Satyanarayan

Alan Nelson

Maciej Thomas Knapczyk

Methods and systems for reducing SWaP in combinations of laser diode drivers (LDDs) and diode laser pump modules (DPMs) are disclosed.

Methods and systems for reducing size weight and power (SWaP) in high energy laser systems

A cooling device includes a thermally conductive object having an opening configured to receive an optical component, the opening being configured such that the optical component is thermally and optically operationally connected to the thermally conductive and electrically conductive object. One or more cooling components, microchannel coolers in one instance, are also thermally operationally connected to the thermally conductive and electrically conductive object. Methods of use are disclosed.

System and methods for cooling optical components

Systems and methods that accept the emitted radiant power from such a combined diode laser structure (laser bar stack) and efficiently direct essentially all of it into the pump cladding of a double-clad fiber amplifier, such that the radiant power will then be absorbed by a rare-earth doped core in the active fiber.

Method and reflective apparatus for combining high-power laser beams

A method and apparatus transferring high radiant power from a plurality of laser diodes into a single optical fiber with high efficiency, small size, and reduced weight.

Method and apparatus for compact and efficient introduction of high radiant power into an optical fiber

Systems and methods for providing a low stress electrode connection capable of carrying a high electrical current to an edge-emitting device, such as a laser diode are described. Systems and methods for providing mechanisms to allow precise adjustment of the relative position of one heat-sink for an optical edge emitting device relative to an adjacent heat-sink in a stack of heat-sinks are also provided herein.

Methods and systems for providing a low stress electrode connection

A method of attaching a semiconductor component to a heat-sink where the component is first placed onto a heat-sink substrate whose attachment surface comprises a malleable-metal film, a semiconductor component is placed onto the malleable-metal film, and pressure and heat is applied for a predetermined time to the stack including substrate with malleable-metal film and semiconductor component.

Method for bonding of semiconductor component to a substrate

The method of these teachings includes processing a semiconductor structure forming an active waveguide of a semiconductor laser in an environment free of contamination in order to provide contamination free mirror facets at the ends of the active waveguide, and depositing a single crystal passivation layer comprised of a semiconductor whose bandgap exceeds that of the active layer and the waveguide layers and that does not form misfit dislocations with the laser diode semiconductor, the deposition occurring at a temperature at which the semiconductor structure does not degrade.

Passivated semiconductor surfaces

In one embodiment, a process for manufacturing an optical fiber coupler of the invention utilizes a rotating drum that has a sloted portion or stacking slot for receiving multiple lengths of fiber in a stack. A support for the input ends of the fibers is in the form of a block which is secured to the surface of the drum in spaced relation with the slot. The block has a plurality of shallow, parallel spaced apart grooves in parallel alignment with the stacking slot. An end of the fiber is initially threaded preferably into the stacking slot and then sequentially located alternately in vacant grooves in the support. As the drum is rotated, a positioner operates to move the fiber transversely in the direction parallel to the drum axis so as to align the fiber in each respective one of the grooves and the slot for each rotation of the drum. The process continues until all the grooves are all occupied and the stacking slot is filled with a corresponding number of fiber lengths. The stacked output ends of the fibers are secured together by an appropriate adhesive and the input ends of the fibers are likewise secured in the grooves of the block by an appropriate adhesive. The fibers are severed at the input and output ends to allow for removal of one or more devices from the drum. The invention also includes the apparatus for performing the process and the resulting optical fiber coupler.

Method and apparatus for making a fiber optical coupler

There is disclosed a method and apparatus for easily mounting, holding and facilitating the coating of preselected areas of very thin semiconductor samples. The apparatus includes a base adapted for placement in a coating chamber. The base includes a pair of spaced apart supporting arms onto which a plurality of stacked samples can be loaded. A cover is then slidably positioned over the stacked samples to hold the stacked samples in position during coating. The cover in conjunction with the supporting arms define an open sided cavity to enable the samples to be coated. The apparatus also can be used to hold only one sample.

Semiconductor holding fixture and method

A method for providing a dual layer diffusion mask or encapsulation coating for use with III-V compound semiconductors, the dual layer coating comprising an inner layer of silicon which closely matches the coefficient of thermal expansion of the III-V compound semiconductor and an outer layer of silicon nitride which is relatively impermeable to subsequent metallization and for thereafter applying metallized contacts to the III-V compound semiconductor through selectively etched openings in the diffusion mask or encapsulation coating.

Growing community of inventors

Sharon, MA, United States of America

Aland K Chin