Intel Corporation

Alan W Tate

Ming Zhang

Russell S Aoki

Ralph W Jensen

Michael T Crocker

David J Llapitan

Devdatta P Kulkarni

Robin A Steinbrecher

Shanjun Deng

Russell Beauregard

Xiaofeng Shawn Sheng

Chengxue Zhao

Minglei Wang

Andrew F Thompson

Kapil Kane

Congtao Jiang

Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.

Cooling using adjustable thermal coupling

Embodiments herein relate to liquid cooling interfaces for computer memory components. An apparatus for cooling a computer memory component may include a support and a cooling tube coupled with the support, where the cooling tube is to be positioned parallel to a computer memory connector to receive the computer memory component, and the cooling tube is to be removably coupled with a memory component heat spreader associated with the computer memory component. In some embodiments, the support may be a liquid manifold. Other embodiments may be described and/or claimed.

Cooling apparatus for computer memory

Printed circuit board (PCB) structures and methods of assembling them are described herein. In some embodiments, a PCB structure may include a first mounting hole; first, second, and third projections radiating from the first mounting hole; and a second mounting hole adjacent to the third projection. The first and second mounting holes located at opposite ends of the third projection. The second mounting hole to cause an electrical coupling of a bottom integrated circuit (IC) module to a connection structure included in a PCB, and the first mounting hole, the first projection, and the second projection to cause positioning of a top IC module above the bottom IC module and electrical coupling of the top IC module to the connection structure.

Module stacking mechanism with integrated ground

An electronic device may be provided that includes a base portion having an input device, a tablet having a display and a docking connector with a plurality of second electrical connectors, and a docking connector to move relative to the base portion. The docking connector may include a first docking pole to extend from the docking connector and to engage with the docking receptacle, and a plurality of first electrical connectors.

Electronic device having a detachable tablet

In various embodiments, a transparent hinged substrate apparatus integrated into a portable computer may address common deficiencies associated with space limitations on student desktop surfaces. The transparent hinged substrate apparatus may utilize, in some embodiments, a transparent substrate that is positioned between the display side and the keypad side of a portable computer. The transparent hinged substrate apparatus may be movable into multiple positions including one position that covers the keypad side of the portable computer without touching any of the keys of the keypad. Thus, the keypad surface may now be used as a work surface using the same physical space occupied by the portable computer.

Substantially transparent hinged substrate apparatus

An apparatus includes an integrated circuit (IC) package and a heat sink having a base and a plurality of fins extending from the base. The apparatus further includes a plurality of heat pipes. Each heat pipe has a first end and a second end. The first ends of the heat pipes are thermally coupled to the IC package, and the second ends of the heat pipes are thermally coupled to the base of the heat sink to transfer heat from the IC package to the heat sink.

Integrated circuit cooling system including heat pipes and external heat sink

Illustrative embodiments of the present invention include, but are not limited to, a heat sink equipped with a captive socket actuating device designed to facilitate engagement and disengagement of the apparatus to and from an integrated circuit (IC) socket.

Growing community of inventors

Puyallup, WA, United States of America

Alan W Tate