Other

Lockheed Martin Corporation

Alan Ralph Cherrette

Bronson Murray

A spacecraft of a set of spacecraft has an antenna support frame defining square apertures, which are the same size in all spacecraft of the set of spacecraft. The set also includes a plurality of radiating tiles for various operating frequencies. The tiles all have the same dimensions, so that any combination of tiles may be mounted in the apertures of the frames of any spacecraft to form antenna arrays of various sizes, depending upon the customer's requirements. Each tile includes plural beamformers and power amplifiers, and remotely controllable phase shifters and level controls, for ready reconfiguration of the antennas while the spacecraft is in operation. The preferred dimension of each radiating tile is a one-foot square.

Spacecraft with modular communication payload

According to the present invention, a thin, lightweight active phased array antenna panel is provided that efficiently radiates heat and arbitrarily polarized microwave signal power. The active array panel also efficiently reflects solar power so as to minimize solar heating. The active array panel includes a plurality of subarray elements each of which includes a plurality of aperture coupled patch radiators. The exterior surface of the subarray element is covered with silvered second surface mirrors to provide efficient radiation of heat in the presence of sunlight. A microstrip feed network in the subarray element is embedded in a dielectric material with a high thermal conductivity to efficiently distribute heat. The active array further includes an electronics module for each subarray element. The electronics module contains a solid state power amplifier, phase shifter and associated electronics mounted in a housing made of material with high thermal conductivity. Each electronics module and corresponding subarray element are thermally and electrically connected to each other and to a support structure assembly with silver-quartz mirrors bonded to the lower exterior surface. Heat generated by the circuits in the electronics module is conducted through the housing and transferred to the outer surfaces of the subarray element and support structure assemblies where it is radiated into space.

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Plainsboro, NJ, United States of America

Alan Ralph Cherrette