Kemet Electronics Corporation

Alan P Webster

John E McConnell

Lonnie G Jones

John Bultitude

Garry L Renner

Jeffrey W Bell

Abhijit Gurav

Mark R Laps

Reggie Phillips

John E Mcconnell

John Mcconnell

An improved capacitor utilizing stacked MLCC's is provided. The capacitor comprising at least one MLCC sandwiched between a first lead and a second lead. Each lead comprises at least one integral lead crimp.

Multi-layered ceramic capacitor with soft leaded module

An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame.

Coefficient of thermal expansion compensating compliant component

A stacked leaded array is provided wherein the stacked leaded array allows for increased packing density of electronic components. The stacked leaded array has a multiplicity of electronic components in a stacked array. Each electronic component comprises a first termination and a second termination. A multiplicity of first leads are provided wherein each first lead is in electrical contact with at least one first termination. Second leads are in electrical contact with second terminations.

Stacked leaded array

An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.

High aspect ratio stacked MLCC design

A multi-layered ceramic capacitor with at least one chip and with first base metal plates in a parallel spaced apart relationship and second base metal plates in a parallel spaced apart relationship wherein the first plates and second plates are interleaved. A dielectric is between the first base metal plates and said second base metal plates and the dielectric has a first coefficient of thermal expansion. A first termination is in electrical contact with the first plates and a second termination is in electrical contact with the second plates. Lead frames are attached to, and in electrical contact with, the terminations wherein the lead frames have a second coefficient of thermal expansion and the second coefficient of thermal expansion is higher than said first coefficient of thermal expansion. The lead frame is a non-ferrous material.

Growing community of inventors

Simpsonville, SC, United States of America

Alan P Webster