Other

Digital Equipment Corporation

Quantum Corporation

Mke-quantum Components Colorado, LLC

Advanced Microsensors, Inc.

Furukawa America, Inc.

Advanced Micriosensors

Furukawa American, Inc.

Alan L Sidman

Hirokazu Tamura

Matthew J Neal

Michael I Mallary

Michelle Martin

Harold B Shukovsky

Akira Mugino

Jiang Zhe

Susan K Fung

Justin C Borski

A Microelectromechanical (MEMS) device and method of fabrication that can minimize derailing of an actuable element of the MEMS device during fabrication can include a MEMS actuator to selectively generate displacement forces to displace an actuable element along a path between sidewalls of a channel. The sidewalls can have stops formed therein that can interact with surfaces on the actuable element to limit displacement of the actuable element during fabrication. One of the sidewalls can be indented to form the stops and the actuable element can have an arm portion that extends between the stops. The sidewalls can be offset to form the stops on spaced apart faces on opposite sides of the channel and the actuable element can be offset between the spaced apart faces to form offset faces in an opposing relationship with the spaced apart faces on the sidewalls. In addition, the actuable element and the sidewalls may be so shaped as to maintain a generally constant width between them.

MEMS devices and methods for inhibiting errant motion of MEMS components

A Microelectromechanical (MEMS) device that can minimize the effects of fabrication tolerances on the operation of the device can include a MEMS electromagnetic actuator to selectively generate displacement forces to displace an actuable element along a path. A cantilever can apply an opposing force to the actuable element to control the amount of displacement. Coil ends of the actuator can be shaped to vary a gap distance between the coil ends, and/or the magnetic portion of the actuable element may be shaped, so as to vary the force applied to the actuable element along the displacement axis. One or more pins located in the deflection path of the cantilever can contact the cantilever at one or more points so as to change the bending resistance of the cantilever. The cross-section of the cantilever can also be varied along its length so as to change the bending resistance of the cantilever.

MEMS actuators

Microelectromechanical (MEMS) devices that use MEMS electromagnetic actuators to selectively generate displacement forces are disclosed herein. According to one exemplary embodiment disclosed herein, a MEMS device may include a substrate having a surface, an actuable element at least partially formed from the substrate, and an electromagnetic actuator disposed on the substrate for selectively applying a first force to the actuable element to displace the actuable element along a path. The actuable element may have a base and an arm coupled to the base. The base may include a portion comprised of a magnetic material. The electromagnetic actuator may comprise an electrically conductive coil, and the path of the actuable element may pass through a coil gap in the coil. The electromagnetic actuator may also comprise a magnetic core about which the electrically conductive coil may be wound.

MEMS devices and methods of manufacture

A process resulting in enhanced pole performance, relative to permalloy poles, in narrow track magnetic devices. A preferred process includes increasing the anisotropy field of the pole material while maintaining an acceptable coercivity level and near zero magnetostriction. One embodiment utilizes a NiCoFe alloy containing 22% cobalt by weight, heat treated in an easy axis magnetic field in a non-oxidizing atmosphere. This process achieves favorable domain structures at narrow pole tip widths.

Magnetic devices with enhanced poles

Process of forming magnetic devices with enhanced poles

A microlithographic resist patterning process which allows generation of very thick, vertically-walled resist patterns which allow for subsequent deposition or etching operations can produce high recording density magnetic thin film heads and other devices requiring high aspect ratios.

Microlithographic method for producing thick, vertically-walled

Recording head to optimize high density recording by reduction of hooks on ends of transitions, the recording head having at least two poles with a gap section inbetween and configured with the second pole and gap section being greater in width than the first pole. Transverse field components are reduced at the head fringes and the transition becomes substantially parallel to gap. The vertical components of the head field are also minimized. Method for producing head with narrow first pole includes planarization of first pole area to receive wider gap layer and wider second pole.

Method of manufacturing a thin film head

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Wellesley, MA, United States of America

Alan L Sidman