Raytheon Company

Hughes Aircraft Company

W. R. Grace Co.-conn.

Hughes Electronics Corporation

Alan L Kovacs

Kurt S Ketola

Jacques F Linder

Michael Richard Ehlert

Matthew H Peter

Haim Feigenbaum

Christopher M Schreiber

John W Lau

Jack H Enloe

William A Vitriol

Bao Q Le

Gary W Johnson

Helen Congleton

Clifford L Shock, Jr

Gerald P Chernicky

Robert G Fleeger

Gary A Dreyer

Kenneth G Maish

A frame structure for a T/R tile module configured to transmit and receive electromagnetic radiation over a predetermined portion of the electromagnetic spectrum is provided. The frame component comprises at least one frame component formed as a single piece from a synthetic resin dielectric material. The frame component is configured to support a plurality of electrical connectors, and has a thin film coating configured to provide a ground connection and electromagnetic shield when the frame structure is incorporated into a transmit/receive module. A portion of the frame component is configured to interface with a portion of a T/R module when the frame component is incorporated into the T/R module, and the synthetic resin dielectric material provides the frame component with a range of compressibility that enables the frame component to provide the module with an effective ground connection over that range of compressibility.

Dielectric interconnect frame incorporating EMI shield and hydrogen absorber for tile T/R modules

A thin film hydrogen getter and EMI shielding are provided for protecting GaAs circuitry sealed in an hermetic package. The thin film getter comprises a multilayer metal film that is deposited by vacuum evaporation techniques onto a conductive metal, such as aluminum or copper, that serves as the EMI shielding. The conductive layer is first formed on an interior surface. The multilayer hydrogen getter film comprises (1) a titanium film and (2) a palladium film that is deposited on the titanium film. Both the titanium and the palladium are deposited during the same coating process run, thereby preventing the titanium from being oxidized. The palladium continues to prevent the titanium from being oxidized once the getter is exposed to the atmosphere. However, hydrogen is easily able to diffuse through the palladium into the titanium where it is chemically bound up, since palladium is highly permeable to hydrogen.

Multilayer thin film hydrogen getter and internal signal EMI shield for complex three dimensional electronic package components

A hermetically sealed microelectronic package that uses a thermal barrier or interposer between a cover and an aluminum nitride substrate. A solder interface is disposed on an aluminum nitride substrate, and the thermal barrier is disposed on the solder interface. The cover is attached to the solder interface using a solder seal that solders the cover to the interposer to produce a hermetically sealed package. The thermal barrier or interposer permits low cost, low temperature soldering of metal covers to metallized aluminum nitride substrate and is compatible with volume production processing.

Using a thermal barrier to provide a hermetic seal surface on aluminum

Microwave apparatus, such as microwave power dividers or combiners, having an adjustable terminating resistor. The present invention allows adjusting or trimming of the resistor and pretesting of substrates on which the apparatus is formed prior to installation of expensive integrated circuit components. The microwave power divider or combiner has a central contact disposed at a midpoint of the terminating resistor. This central contact is thus disposed at the midpoint of the terminating resistor and is coupled to a test point. Outer edges of the central contact are constructed to be parallel to inner edges of impedance paths or traces over which the terminating resistor lies so that each section of the terminating resistor has substantially the same resistance value.

Microwave power dividers and combiners having an adjustable terminating

A Multi-Chip-Module or MCM (66) is mounted on a supporting motherboard (64). A plurality of first contact pads (99) are formed on the module (66) adjacent to its peripheral edge for interconnection with microelectronic components (70,72,74,76,78) mounted on the module (66). Second contact pads (94) are formed on the motherboard (64) adjacent to respective first contact pads (99). A flexible cable (96) includes controlled impedance microstrip or stripline conductor (98) with first and second gold dots (100,102) at their ends. A frame (104) resiliently presses the first and second gold dots (100, 102) into connection with respective first and second contacts (99,94) for interconnection thereof. The components (70, 72,74,76,78) on the module (66) can be hermetically sealed by a cover (80), and the module (66) and cable (96) can be hermetically sealed by a first resilient ring (112) which is compressed between the frame (104) and the cover (80), and a second resilient ring (114) which is compressed between the frame (104) and the motherboard (64). Alternatively, the cover (80) and the first ring (112) can be replaced by a cover (104a) which is integral with a frame (104'). An alternative connector (136) includes a flexible cable (146) which extends around an edge of a frame (144) to enable vertical stacking of MCMs (164) and/or backplanes (138) in any combination.

Connector assembly for microelectronic multi-chip-module

A lid (2) for an electronic circuit housing (4) has inner (24) and outer (22) laminated layers that are formed from two different materials, joined to each other and bowed outward from the housing (4) so that the inner layer (24) is under tensile bending stress at the interface between the layers, and the outer layer (22) is under compressive bending stress at the interface. This forms a pre-stress on the lid that resists external loads, and causes the lid to deflect under loading in a linear, predictable and recoverable fashion. The lid is preferably formed by thermal bonding of two materials having different coefficients of thermal expansion, with the bow forming as the materials cool. In one example two different metals are used, and in another a metal is bonded to a glass-ceramic tape.

Pre-stressed laminated lid for electronic circuit package

Hermetic package designs for HDMI substrates are discussed. The designs for a hermetically sealed, perimeter-leaded package may have the following features:

Ceramic electronic package design

An integrated circuit package includes a rectangular base, and a continuous sidewall which extends upwardly from the periphery of the base. Microelectronic circuit components are mounted on the base in a cavity defined within the sidewall. A domed lid includes a resilient central domed portion which arches above the cavity. A peripheral edge portion of the lid extends downwardly into the cavity by a small distance, adjacent to the inner surface of the sidewall. A lip extends outwardly from the edge portion and is sealingly welded at its periphery to the upper surface of the sidewall. The joint between the lip and edge portion is resilient and acts as a hinge, such that when a force or pressure is applied to the domed portion, the edge portion rotates about the hinge into abutment with the inner surface of the sidewall. This transfers a major component of the applied force to the sidewall, and resists deflection of the domed portion into the cavity.

Growing community of inventors

Long Beach, CA, United States of America

Alan L Kovacs