Gm Global Technolgoy Operations, Inc.

Alan L Barry

David Yuang Tang

Mark D Korich

Douglas S Carlson

Brooks S Mann

Nicholas Hayden Herron

Cindy Chou

A power electronics assembly is provided. A first support member includes a first plurality of conductors. A first plurality of power switching devices are coupled to the first support member. A first capacitor is coupled to the first support member. A second support member includes a second plurality of conductors. A second plurality of power switching devices are coupled to the second support member. A second capacitor is coupled to the second support member. The first and second pluralities of conductors, the first and second pluralities of power switching devices, and the first and second capacitors are electrically connected such that the first plurality of power switching devices is connected in parallel with the first capacitor and the second capacitor and the second plurality of power switching devices is connected in parallel with the second capacitor and the first capacitor.

Low inductance power electronics assembly

A printed circuit board (PCB) ball grid array (BGA) system is provided. In one embodiment, the PCB BGA system includes a PCB, a PCB BGA pad formed on the PCB, a plated through-hole via disposed at least partially through the PCB proximate the PCB BGA pad, and a soldermask disposed over the PCB. The soldermask includes: (i) a BGA pad opening through which the PCB BGA pad is exposed, and (ii) a via opening through which a central portion of the plated through-hole via is exposed. The via opening has an inner diameter that is less than the outer diameter of the plated through-hole via.

Printed circuit board ball grid array system having improved mechanical strength

Growing community of inventors

Torrance, CA, United States of America

Alan L Barry