Northrop Grumman Systems Corporation

Northrop Grumman Space & Missions Systems Corp.

Alan Hirschberg

Dean Tran

Mark Kintis

Steven J Mass

Luis M Rochin

Thomas Taoming Chung

Ha K DeMarco

Melissa Fuller

Phillip Hayes

Greg Keller

A method for assembling a bundle cable connector assembly that eliminates bird caging, wire threads extruding through a connector pin, loose wire threads, dielectric shield shrinking, etc. The method includes stripping the wire to create a birdcage preventative zone and an exposed tip with a crimping zone therebetween, and tinning the exposed wire at the birdcage preventative zone and the tip. The method then includes inserting the wire into a connector pin, and crimping the pin to the wire at the crimping zone using heat so that the tinning solder melts. The method then includes mounting the pin to a connector body and mounting a wire-locking device to the connector body to lock the pin to the connector body.

Bundle cable connector assembly, components, tooling and manufacturing method

Ultra-high speed semiconductors that are usually very thin and therefore very fragile still require connection to a circuit board and a heat transfer pathway. Ultra-high speed circuits and semiconductor devices are provided with a carrier plate formed on the backside of a wafer or substrate by a variety of deposition methods. The carrier plate is a series of metal layers, each being selected to enable the attachment of a relatively thick copper carrier plate to the backside of the substrate or wafer.

Eutectic bonding of ultrathin semiconductors

Growing community of inventors

Thousand Oak, CA, United States of America

Alan Hirschberg