Johnson Matthey Electronics, Inc.

Johnson Matthey Inc.

Honeywell International Inc.

Alan Grieve

Nancy E Iwamoto

Xiao-Qi Zhou

Shao Wei Li

Henry Wevick

Jesse L Pedigo

Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Long and short-chain cycloaliphatic epoxy resin, cyanate ester and Lewis and Bronsted catalysts

Long and short-chain cycloaliphatic epoxy resins with cyanate ester

A via fill formulation including electrically and/or thermally conductive particulate filler, or non-conductive, electrically conductive polymer and a resin vehicle.

Via fill formulations which are electrically and/or thermally conductive, or non-conductive

Method of applying a die attach adhesive

Described is an adhesive composition suitable for bonding a semiconductor device to a substrate comprising about 60-90 wt. % particulate silver; about 10-40 wt. % of an adhesive material comprising at least one nonelectrically conductive organic compound; and a filler comprising at least one electrically conductive organic compound capable of forming a conductivity bridge between silver particles. The adhesive composition may additionally include at least one curing catalyst for the adhesive material, a flexibilizer to render the composition more flexible, a surfactant to facilitate contact with a substrate and/or a material to aid in adjusting the rheology of the composition.

Adhesive composition for bonding a semiconductor device

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El Cajon, CA, United States of America

Alan Grieve