Intel Corporation

Templex Technology, Inc.

Alan E Johnson

Anders Grunnet-Jepsen

John N Sweetser

Eric S Maniloff

Thomas W Mossberg

Michael J Munroe

Pierre St Hilaire

Edward P Donlon

Tsung-Ein Tsai

Matthew Miller

Frank D Braun

Eric Maniloff

Anders Grunnet-Jepson

Alan E Lucero

Shasi Raval

Lap Van Hoang

In one embodiment, a stack device comprising a film interposer of a polyimide film material, for example, is assembled. In accordance with one embodiment of the present description, a front side of the film interposer is attached to a first element of the stack device, which may be an integrated circuit package, an integrated circuit die, a substrate such as a printed circuit board, or other structure used to fabricate electronic devices. In addition, a back side of the film interposer is attached to a second element which like the first element, may be an integrated circuit package, an integrated circuit die, a substrate such as a printed circuit board, or other structure used to fabricate electronic devices. Other aspects are described.

Film interposer for integrated circuit devices

A microelectronic substrate and a microelectronic package including the substrate and a die bonded thereto. The substrate includes a substrate panel having a die-side surface including a die-attach region; a system of interconnects extending through the substrate panel and adapted to allow a connection of the substrate to external circuitry; and a plurality of solder bumps including: die-attach solder bumps electrically coupled to the system of interconnects and disposed in the die-attach region; and barrier solder bumps isolated from the system of interconnects, the barrier solder bumps being disposed outside of the die-attach region and being adapted to substantially limit a flow of underfill away from the die-attach region.

Substrate including barrier solder bumps to control underfill transgression and microelectronic package including same

In one embodiment, the present invention includes a network hub having an active optical encoder where the network hub is to generate a plurality of addressed optical data signals, each having a common carrier wavelength and a different address corresponding to a network node coupled to the network hub. Other embodiments are described and claimed.

Using active and passive optical components for an optical network

An optical data storage system directs a reference beam and a data beam to a storage material having an inhomogeneous linewidth. The data beam is modulated to contain data to be stored in the storage material. The reference beam and the data beam illuminate storage cells of the storage material, causing data to be stored. The reference beam and the data beam spatially scan the cells and are frequency swept during their respective spatial scans. Data is retrieved from the cells by illuminating the storage material with the reference beam to produce a reconstructed data beam. In an embodiment, the reference beam and the data beam overlap and illuminate the storage cells simultaneously. The reconstructed data beam is detected as a heterodyne signal produced by mixing the reconstructed data beam and the reference beam in a detector.

Spatially-spectrally swept optical memories and addressing methods

Multiple Bragg gratings are fabricated in a single planar lightwave circuit platform. The gratings have nominally identical grating spacing but different center wavelengths, which are produced using controlled photolithographic processes and/or controlled doping to control the effective refractive index of the gratings. The gratings may be spaced closer together than the height of the UV light pattern used to write the gratings.

Method for writing a planar waveguide having gratings of different center wavelengths

An athermal package for fiber photonic devices includes three portions of at least three materials, each having a coefficient of thermal expansion that is different from the other two. In contrast, a conventional athermal packages typically has only two materials. In a typical application, an optical fiber containing a photonic device is attached to the athermal package. The three materials of the athermal package are selected and the three portions as sized to optimize a thermal response of the package to that of the optical fiber.

Athermal package for fiber bragg gratings with compensation for non-linear thermal response

A mounting platform provides support and packaging for one or more fiber Bragg gratings and electronic circuitry (e.g., heaters, coolers, piezoelectric strain providers, temperature and strain sensors, feedback circuitry, control loops), which may be printed on or on the mounting platform, embedded in the mounting platform, or may be an 'off-board' chip solution (e.g., the electronic circuitry may be attached to the mounting platform, but not formed on or defined on the mounting platform). The fiber Bragg gratings are held in close proximity to the electronic circuitry, which applies local and global temperature and/or strain variations to the fiber Bragg gratings to, for example, stabilize and/or tune spectral properties of the fiber Bragg gratings so that spatial variations in the fiber Bragg gratings that result from processing and manufacturing fluctuations and tolerances can be compensated for.

Apparatus and methods for stabilization and control of fiber devices and fiber devices including the same

An optical phased array transmitter/receiver includes a plurality of waveguides each including an optical fiber and a light source coupled to the fibers in the waveguides. At least one grating is coupled to the fiber of each waveguide and at least one phase shifter coupled to the fiber of at least one waveguide. The phase shifter controls a phase profile of light passing through the fiber to control a profile of a laser beam reflected at the grating. The gratings reflect light passing through the fibers outside of the optical coder to form a laser beam shaped and directed by the grating and phase shifters. Further, a detector is coupled to the waveguides that is enabled to receive light reflected off the gratings. Other embodiments are described and claimed.

Optical phased array transmitter/receiver

Optical communication systems include a central station that encodes data transmitted to multiplexing (mux) stations or user stations. The central station also decodes data received from the mux stations or user stations. Encoding and decoding are performed using codes, such as composite codes, that designate sources and destinations for data. The mux stations, user stations, and the central station have address encoders and decoders that use, for example, fiber Bragg gratings to encode or decode optical signals according to a code such as a composite code derived by combining codes from one or more sets of codes. A passive optical network comprises one or more levels of mux stations that use such address decoders and encoders to receive, decode, and encode data for transmission toward a central station or a user station.

Code-based optical networks, methods, and apparatus

A Bragg grating may be written at an arbitrary wavelength without extensive recalibration or reconfiguration of the writing equipment in some embodiments. A pair of writing beams may be used to expose a waveguide. The crossing angles of the writing beams may be adjusted. In one embodiment, circular wedges in each writing beam may be rotated about their axes to alter the crossing angle. In another embodiment, acousto-optic Bragg cells may be utilized to change the writing angle of the writing beams.

Writing waveguides with an arbitrary Bragg wavelength

Communication systems and methods are disclosed that route, detect, and decode encoded optical signals at network nodes based on channel codes assigned to the network nodes. In an example communication system, a network hub includes a channel selector that encodes an optical signal with a channel code assigned to one or more network nodes. The channel selector is configured to encode based on a channel selection signal provided to the channel selector and can include one or more fiber Bragg coders. Code-switched communication systems can include one or more nodes configured in ring, tree, or bus architectures.

Code-switched optical networks

An athermal package for fiber photonic devices includes a ferrule to attach the optical fiber to the package. The ferrule has an opening to receive the optical fiber. The ferule is collapsed to attach the optical fiber to the athermal package. Alternatively, the athermal package uses adhesive bonds disposed in pockets of the package. The pockets have a narrow end and a wide end, with the narrow ends facing each other. The adhesive bonds are disposed in the pockets in contact the narrow ends of the pockets but not with the wide ends. The narrow ends physically confine the adhesive bonds so that if the bonds expand or contract due to environmental conditions (or the curing process), the adhesive either expands or contracts near the wide ends of the pockets. This allows the strain on the optical fiber segment between the bonds to remain substantially constant.

Growing community of inventors

Eugene, OR, United States of America

Alan E Johnson