Tel Fsi, Inc.

Texas Instruments Corporation

Fsi International, Inc.

Tel Manufacturing and Engineering of America, Inc.

Alan Dee Rose

Jimmy D Collins

Tracy A Gast

David P DeKraker

James M Eppes

Jeffrey M Lauerhaas

Kader Mekias

Samuel A Cooper

David Dekraker

Jeffery W Butterbaugh

Roger A Robbins

David W Buck

Richard E Williamson

Christina Ann Rathman

Michael Gruenhagen

Donald E Brown

Robert M Kennedy, Iii

Darian D Carr

Stephen G Hanson

Techniques herein pertain to apparatus embodiments and methods for treating the surface of a microelectronic substrate, and in particular for removing objects from the microelectronic substrate using fluid treatment sprays such as cryogenic fluid sprays. The apparatus embodiments and methods described herein further include techniques for monitoring and/or controlling treatment processes for removing particles from surfaces of a microelectronic substrate. The techniques allow using image analysis techniques to monitor characteristics of spray nozzle(s) (e.g., frost formation on the nozzle surface) and using the resultant image information of the nozzle to take corrective action if frost or another nozzle condition is detected.

System and method for monitoring treatment of microelectronic substrates with fluid sprays such as cryogenic fluid sprays

The present invention provides a tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like.

Method and apparatus for treating a workpiece with arrays of nozzles

The disclosure relates to systems and methods for detecting when a microelectronic substrate is no longer properly secured or lost from a rotating chuck. A microelectronic substrate may be secured to a rotating chuck that may rotate the substrate when exposing the substrate to the chemicals during a treatment in a process chamber. The rotating chuck may include one or more detectors to detect the position of a gripping mechanism that secure the microelectronic substrate. The detectors may generate an electrical signal that correlates to the position of the microelectronic substrate. When the electrical signal(s) exceed a threshold the system may stop rotating the chuck to prevent additional damage to the process chamber.

Detection of lost wafer from spinning chuck

Strategies for tool designs and their uses wherein the tools can operate in either closed or open modes of operation. The tools easily transition between open and closed modes on demand. According to one general strategy, environmentally controlled pathway(s) couple the ambient to one or more process chambers. Air amplification capabilities upstream from the process chamber(s) allow substantial flows of air to be introduced into the process chamber(s) on demand. Alternatively, the fluid pathways are easily closed, such as by simple valve actuation, to block egress to the ambient through these pathways. Alternative flows of nonambient fluids can then be introduced into the process chamber(s) via pathways that are at least partially in common with the pathways used for ambient air introduction. In other strategies, gap(s) between moveable components are sealed at least with flowing gas curtains rather than by relying only upon direct physical contact for sealing.

Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation

Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids

Apparatuses, and related methods, for processing a workpiece that include a particular barrier structure that can overlie and cover a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular movable member that can be positioned over and moved relative to a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular ceiling structure that can overlie a processing chamber. Nozzle devices, and related methods, that include a particular annular body. Nozzle devices, and related methods, that include a particular first, second, and third nozzle structure.

The present invention provides methods of removing liquid from a barrier structure in the context of treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like.

Method of removing liquid from a barrier structure

Tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like. The invention provides an approach for rapid, efficient rinsing of wetted surface(s), and is particularly advantageous when used to rinse the lower surface of moveable barrier structures such as a barrier plate that overlies a workpiece being treated in such a manner to define a tapering flow channel over the workpiece. Rather than spray rinsing liquid onto the surface in a manner that generates undue splashing, droplet, or mist generation, the liquid is flowingly dispensed, preferably under laminar flow conditions, onto a surface that is in fluid communication with the surface to be rinsed. A smooth, uniform wetting and sheeting action results to accomplish rinsing with a significantly reduced risk of generating particle contamination.

Rinsing methodologies for barrier plate and venturi containment systems in tools used to process microelectronic workpieces with one or more treatment fluids, and related apparatuses

Apparatuses, and related methods, for processing a workpiece that include particular baffle members or duct structures having an inlet proximal to an outer periphery of a workpiece and/or workpiece support.

Compact duct system incorporating moveable and nestable baffles for use in tools used to process microelectronic workpieces with one or more treatment fluids

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Wylie, TX, United States of America

Alan Dee Rose