Digital Optics Corporation

Tessera North America, Inc.

Digitaloptics Corporation East

Flir Systems, Incorporated

Teledyne Flir Commercial Systems, Inc.

Other

Flir Systems Trading Belgium Bvba

Tessera North Carolina, Inc.

Digital Opitcs Corporation

Alan D Kathman

Michael R Feldman

William Hudson Welch

Eric G Johnson

Robert Te Kolste

John Barnett Hammond

Charles S Koehler

W Hudson Welch

Brian Harden

James E Morris

Robert Dale Tekolste

Robert D TeKolste

David Ovrutsky

Hongtao Han

Robert Allen Hutchins

Jay Mathews

Todd E Rixman

William J Hall

Hagit Gershtenman-Avsian

Bengt Jervmo

Olof Holmgren

Hans Ostling

Alvaro Cruz Cabrera

Erika Goransson

Bo Dahllof

Stefan Gustavsson

Leif Sommar

Marcel Tremblay

Joseph Kostrzewa

Jeremy Huddleston

Andrey Grinman

Thomas J Suleski

Jack H Schmidt

Adam S Fedor

James E Morris, Jr

Michael D Walters

Bruce A Covington

Robert Russell Boye

Jared D Stack

Jay Brock Matthews

Alvaro A Cruz-Cabrera

Alexander Feldman

Thad Lieb

Harris Miller

Waddie Heyward

Dan S Walker

Jennifer L Plyler

Marc D Himel

Gregory Brady

Stacey Grabiner

Erik G Johnson

Rong Huang

Jared A Faraudo

James Carriere

Gregory Fitzgerald

Michael Magoon

Various techniques are disclosed to provide for reducing undesired reflections in captured images. In one example, a system includes an optical element configured to pass radiation from a scene. The system also includes an imager configured to capture images in response to the scene radiation and reflect at least a portion of the scene radiation to the optical element. The optical element comprises a surface with a convex radius of curvature facing the imager and configured to receive and return the reflected radiation toward the imager in a distribution pattern to reduce a magnitude of the reflected radiation in the captured images. Additional methods, devices, and systems are also provided.

Optical components for ghost image suppression systems and methods

Systems and methods according to one or more embodiments are provided for annealing a chalcogenide lens at an elevated temperature to accelerate release of internal stress within the chalcogenide lens caused during a molding process that formed the chalcogenide lens. In particular, the annealing process includes gradually heating the chalcogenide lens to a dwell temperature, maintaining the chalcogenide lens at the dwell temperature for a predetermined period of time, and gradually cooling the chalcogenide lens from the dwell temperature. The annealing process stabilizes the shape, the effective focal length, and/or the modulation transfer function of the chalcogenide lens. Associated optical assemblies and infrared imaging devices are also described.

Lens systems and methods of manufacture

Aspect ratio modifying imaging systems and methods are provided. In one example, an infrared imaging device includes at least one lens element configured to transmit electromagnetic radiation associated with a portion of a scene. The portion has a first aspect ratio. The electromagnetic radiation includes mid-wave and/or long-wave infrared light. The at least one lens element has a freeform surface having no translational symmetry and no rotational symmetry. The infrared imaging device further includes a detector array configured to receive image data associated with the electromagnetic radiation from the at least one lens element and generate, based on the image data, an image. The image data has a second aspect ratio different from the first aspect ratio. Each of the first and second aspect ratios is a ratio of a size along a first direction and a size along a second direction orthogonal to the first direction.

Aspect ratio modifying imaging systems and methods

An optoelectronic device package includes an optoelectronic device having an active region on a first surface of a substrate, a bond pad area on the first surface that includes at least one contact pad electrically connected to the active region, and a cap having a first cap surface and a second cap surface, the first cap surface being secured to the first surface of the substrate, the cap covering the optoelectronic device. At least one of the cap and the substrate has an angled sidewall extending at an angle relative to an axis parallel to an optical path. The at least one contact pad is exposed by and adjacent to the angled sidewall. An electrical line extends from each of the at least one contact pad along the angled sidewall and to the second cap surface that does not overlap the active region.

Methods for routing electrical interconnections and resultant structures

Camera core

A planar line generator including a first planar surface extending in a first direction, a second planar surface facing the first planar surface, and a beam splitter in front of the second planar surface, the beam splitter configured to output, from light incident thereon, an undeflected beam, a first beam deflected to a first side of the undeflected beam along the first direction, and a second beam deflected to a second side of the undeflected beam along the first direction, wherein the second planar surface includes a line diffuser configured to receive the undeflected beam, and first and second diffusers having a design different from the line diffuser, the first and second diffusers being configured to receive the first and second beams, respectively.

Planar high angle line generator

Optical imaging apparatuses are provided having desired focal properties. An optical imaging apparatus can include at least one wafer level optical element, a spacer, a second wafer comprising a focus compensation standoff, and an electro-optical element. For some apparatuses, the focus compensation standoff may include an electro-optical element mounting surface having a roughness different from at least one other surface of the focus compensation standoff. Also described are methods of producing a plurality of optical imaging apparatuses. Some methods include providing an optical wafer having a first and second optical element, determining a first and second focal point of a first and second optical die; providing a second wafer having a first and second focus compensation standoff; and adjusting the heights of the first and second focus compensation standoffs to position a first and second electro-optical element at or near a first and second focal point, respectively.

Focus compensation for optical elements and applications thereof

A method for transmitting a signal in an optical system includes generating an optical signal along an optical axis for transmission through an optical element, positioning the optical element so that a surface discontinuity is positioned along the optical axis such that the optical signal defines a substantially radially symmetric intensity profile, and launching the optical signal into an input face of an optical fiber such that the intensity profile is substantially null proximate an optical axis associated with the optical fiber.

Optical element and system using the same

An optical device includes a substrate. a non-planar transparent structure on a first surface of the substrate, the non-planar transparent structure being made of a first material, and a molded refractive surface on the first surface of the substrate adjacent the non-planar transparent structure, the molded refractive surface being made of a second material, different from the first material.

Optical device including at least one replicated surface and associated methods

A fanout diffractive optical element having a discrete periodic surface relief structure having a 2-dimensional (x,y) shape is described. The surface relief structure can include a first lobe and a second lobe separated by a waist region having a width less than the first lobe and the second lobe. The 2-dimensional (x,y) shape of surface relief structure can have an inversion center and can lack symmetry about any plane that is normal to the surface relief structure. Also described are apparatuses having a fanout diffractive optical element and methods of producing a plurality of light diffracting orders using a fanout diffractive optical element.

Diffractive optical elements and applications thereof

A selective diffractive optical element includes a first diffractive region having a first design on a first surface of a substrate, and a second diffractive region having a second design on the first surface of the substrate, the first and second designs being different, wherein, by altering a position of a cross-section of an illumination beam, the selective diffractive optical element outputs a desired proportion of the two diffractive patterns aligned along an optical axis of the illumination beam.

Selective diffractive optical element and a system including the same

An optical device includes a transparent substrate, a first replicated refractive surface on a first surface of the substrate in a first material, and a second replicated refractive surface on a second surface, opposite the first surface, and made of a second material, different from the first material. The material and curvature of the first replicated surface and the material and curvature of the second replicated surface may be configured to substantially reduce the chromatic dispersion and/or the thermal sensitivity of the optical device.

Optical device and associated methods

Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

Method for replicating optical elements, particularly on a wafer level, and replicas formed thereby

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Charlotte, NC, United States of America

Alan D Kathman