Silicon Graphics, Incorporated

Apple Inc.

Alan D Foster

David P Chengson

Ali Mira

Unmesh Agarwala

John C Manton

Edward C Priest

William L Schmidt

David C Buuck

Mark P August

Greg D McNeil

A support is provided for a component on a substrate to minimize unacceptable bending or displacement. In a preferred embodiment, a suitable amount of a thermoplastic material is injected through a hole in a PCB under the component after the component has been affixed to the PCB. This allows the support material to fill any space between the component and the PCB yet allow for variation in lead height and for thermal expansion of the support material.

Method and apparatus for supporting a component on a substrate

A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed circuit board also has an address line formed therein. A first SRAM is mounted on the first surface of the printed circuit board. The present PIMM is further comprised of a second SRAM mounted on the second surface of the printed circuit board. The second SRAM is mounted on the second surface of the printed circuit board directly opposite the first SRAM mounted on the first surface of the printed circuit board. The first and second SRAMs are coupled to the address line by respective cache buses. A processor is also mounted on the first surface of the printed circuit board, and is coupled to the address line. In one embodiment of the invention, a heat sink is thermally coupled to the processor. The processor has a plurality of contact pads disposed thereon. Electrical connectors extend from the second surface of the printed circuit board. The electrical connectors are electrically coupled to respective contact pads of the processor. In the present PIMM, the electrical connectors are adapted to be removably attached to a mother board. In so doing, the present PIMM is removably attachable to a mother board.

Processor-inclusive memory module

A unitary heat sink including a planar contact portion for contacting the top of an IC. The heat sink is constructed from a material having a thermal conductivity of at least 150 watts per meter Degree Kelvin (W/m.degree.K.) but preferably is constructed from aluminum having a conductivity of 221 (W/m.degree.K.). A number of leg portions extend from the contact portion such that each leg portion has a distal end. The leg portions, being made of the same material as the contact portion, are configured to have a sufficient resiliency such that deformations of the leg portions provide a spring force in the range of 5 to 16 lbs against the top of the IC. A method for dissipating heat from an integrated circuit includes the steps of forming a unitary heat sink from a heat sink material, where the heat sink includes a contact portion and a number of integral, spring leg portions. The method continues with the attachment of an integrated circuit to a printed circuit board, and the attachment of the leg portions of the heat sink to the printed circuit board such that the contact portion of the heat sink is urged towards the heat transfer surface of the integrated circuit with a spring force in the range of 5 to 16 lbs.

Unitary heat sink for integrated circuits

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Los Altos, CA, United States of America

Alan D Foster