Intel Corporation

Other

Alan C McAllister

Fay Hua

Hong Xie

Gregorio R Murtagian

Ting Zhong

Tozer J Bandorawalla

Kelly Eakins

Wade W Hezeltine

Amit Abraham

Rick Canham

Attachments for gloves or fingers is provided that allows for easier removal of grass clippings from the underside of a lawnmower deck. The attachments assist wearers and protecting the hands of wearers when cleaning and digging. The attachments may be installed on a dove with fingerstalls via a sleeve that fits over the fingerstalls and a tip that extends distally from the sleeve. Each tip may include a scraper attached such that the wearer can exert leverage on the scrapers to assist with cleaning or digging.

Hand worn debris removal device

Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.

Solder contacts for socket assemblies

A land grid array (LGA) socket uses a series of inclined engagement features to transfer a lateral load into a normal load to retain the LGA package in the socket. The number and position of the engagement features along the side of the socket permits a more uniform transfer of load to the solder ball array as compared to current mechanisms.

Method of placing a chip assembly in a socket housing

Sliding package retention device for LGA sockets

Manufacturers test printed circuit boards (PCB) to ensure that all components have been soldered to the correctly. Some tests cause the boards to deflect, which can damage component-to-board interfaces (i.e., solder joints) or components. Embodiments of the present invention measure the amount of PCB deflection before, during, and after the PCB is subject to mechanical load using photoelectric amplifiers, which send and receive light beams to targets mounted on the PCB surface through optical fibers and lenses mounted in a head assembly. The intensity of received light beams are proportional to analog voltages output by the photoelectric amplifiers and to the distance between the head assemblies and the targets. A data acquisition system converts the analog voltages to digital voltages and a software interface correlates the digital voltages to PCB deflection/displacement. A GUI displays deflection before, during, and after the PCB is subject to mechanical load.

Board deflection metrology using photoelectric amplifiers

Growing community of inventors

Portland, OR, United States of America

Alan C McAllister