Applied Materials, Inc.

Apple Inc.

Alan A Ritchie

Muhammad M Rasheed

Donny Young

Karl M Brown

Keith A Miller

Zhenbin Ge

Ted Tie Guo

Wei Ti Lee

John C Forster

Kirankumar Neelasandra Savandaiah

Adolph Miller Allen

Bernd J Neudecker

Michael Santiago Cox

Richard M Mank

John Pipitone

Thanh X Nguyen

Kathleen Ann Scheible

Uday Pai

Steve H Chiao

Lin Ma

Andrew Basile

Isaac Porras

Ilyoung (Richard) Hong

Vivek G Gupta

Wei W Wang

Daniel John Hoffman

Rongjun Wang

Lara Hawrylchak

Tza-Jing Gung

Ananthkrishna Jupudi

Joung Joo Lee

Umesh M Kelkar

William R Johanson

Xianwei Zhao

Ying Rui

Steve Sansoni

Ryan Hanson

Ryeun Kwan Kim

Korhan Demirkan

Mohd Fadzli Anwar Hassan

Sally Lou

Jenn Yue Wang

Yen-Chih Wang

Hyung Chul Park

Paul M Bayley

Methods and apparatus for physical vapor deposition are provided herein. In some embodiments, a process kit shield for use in a physical vapor deposition chamber may include an electrically conductive body having one or more sidewalls defining a central opening, wherein the body has a ratio of a surface area of inner facing surfaces of the one or more sidewalls to a height of the one or more sidewalls of about 2 to about 3.

Methods and apparatus for reducing sputtering of a grounded shield in a process chamber

Liquid electrolytes for a lithium metal battery comprise an aprotic solvent, an ionic liquid, a lithium salt, 8 mol % to 30 mol % hydrofluoroether and up to 5 mol % additives. A molar ratio of the hydrofluoroether to the lithium salt is 0.22:1 to 0.83:1. The liquid electrolytes achieve at least a 50% improvement in cycle life over conventional electrolytes, extend capacity retention and delay increases in internal resistance.

Liquid electrolyte for lithium metal battery

An electrochemical cell has a cathode having a cathode current collector and a cathode active material, an anode having an anode current collector, lithium metal seed, and an anode cap on the lithium metal seed, a liquid electrolyte, a separator between the cathode active material and the anode active material, and a polymer electrolyte lamination layer bonding the anode to the separator. The polymer electrolyte lamination layer is formulated using a crosslinked polymer, a lithium salt, a plasticizer, and an anode additive. The anode cap and the polymer electrolyte lamination layer work together to produce densely plated lithium metal between the lithium metal seed and the anode cap with little or no external pressure.

Electrochemical cell design with lithium metal anode

An electrochemical cell has a cathode having a cathode current collector and a cathode active material, an anode having an anode current collector and an anode active material comprising lithium metal, a liquid electrolyte, a separator between the cathode active material and the anode active material, and a polymer electrolyte lamination layer bonding the anode to the separator. The polymer electrolyte lamination layer is formulated using a crosslinked polymer, a lithium salt, a plasticizer, and an anode additive.

Polymer electrolyte lamination layer for lithium metal battery

An anode for a lithium metal battery includes a host structure configured to be between an anode current collector and a separator, the host structure having void spaces configured to host metallic lithium during charging, wherein the host structure has a void space of &#x2265;60% and &#x2264;80%. Another anode for a lithium metal battery includes a current collector, a separator, and a host structure between the current collector and the separator, the host structure having void spaces configured to host metallic lithium during charging, wherein the host structure is formed of fibers.

Anode structure for a lithium metal battery

Embodiments of methods for depositing material in features of a substrate have been provided herein. In some embodiments, a method for depositing material in a feature of a substrate includes depositing a material in a feature of a substrate disposed in a process chamber by sputtering a target using a plasma formed from a first gas; and etching the deposited material in the process chamber using a plasma formed from a second gas, different than the first gas, to at least partially reduce overhang of the material in the feature, wherein an atomic mass of the second gas is greater than an atomic mass of the first gas.

Methods for reducing material overhang in a feature of a substrate

A liquid electrolyte for a lithium metal battery comprises 45-65 mol % of an aprotic solvent, 5-15 mol % of an ionic liquid, 28-44 mol % of a lithium salt and up to 5 mol % additives. The aprotic solvent consists of one or more of a linear carbonate and a linear ether and the ionic liquid consists of one or more of PYRFSI, PYRFSI, PYRTFSI, and PYRTFSI. The lithium salt is selected from the group consisting of LiFSI, LiTFSI, and LiBET. The liquid electrolyte can have a flash point of greater than 60&#xb0; C. and a dynamic viscosity of less than 120 mPa&#xb7;s.

Liquid electrolyte for a lithium metal battery

An anode for a lithium metal battery has a current collector formed of a flexible polymer substrate having an anode-facing surface, the polymer substrate formed of a polymer chemically compatible with lithium metal. A current pathway of a first conductive metal is embedded in the polymer substrate and has a terminal end extending from an end of the polymer substrate. Traces of a second conductive metal each have a current collecting portion at the anode-facing surface, the traces in electrical communication with the current pathway. Lithium metal is deposited onto the current collector.

Corrosion resistant current collector for lithium metal anode

An anode for a lithium metal battery includes a current collector, a seed layer deposited onto the current collector, the seed layer comprising a seed material selected to promote electrochemical plating of metallic lithium onto the seed layer, a separator, a host structure between the seed layer and the separator, the host structure having void spaces configured to host metallic lithium during charging, a first adhesion layer bonding the host structure to the seed layer, and a second adhesion layer bonding the host structure to the separator.

Variable geometry process kits for use in semiconductor process chambers have been provided herein. In some embodiments, a process kit for use in a semiconductor process chamber includes: an annular body configured to rest about a periphery of a substrate support; a first ring positioned coaxially with the annular body and supported by the annular body; a second ring positioned coaxially with the first ring and supported by the first ring; and an annular shield comprising a horizontal leg positioned coaxially with the second ring such that a portion of the horizontal leg is aligned with and below portions of the first ring and second ring.

Process kit for deposition and etching

Apparatus for physical vapor deposition are provided herein. In some embodiments, a shield for use in a physical vapor deposition chamber, comprises an annular one-piece body having an inner volume, a top opening and a bottom opening, wherein a bottom of the annular one-piece body includes an inner upwardly extending u-shaped portion, an annular groove formed in an inner wall of the one-piece body, and a plurality of gas distribution vents disposed along the annular feature and formed through the one-piece body, wherein the plurality of gas distribution vents are spaced apart from each other to distribute gases into the inner volume in a desired pattern.

Apparatus for gas injection in a physical vapor deposition chamber

Methods and apparatus for a magnetron assembly are provided herein. In some embodiments, a magnetron assembly includes a first base plate; a second base plate movable with respect to the first base plate between a first position and a second position; an outer magnetic pole in the shape of a loop and comprising an outer magnetic pole section coupled to the first base plate and an outer magnetic pole section coupled to the second base plate; and an inner magnetic pole disposed within the outer magnetic pole, wherein the outer and inner magnetic poles define a closed loop magnetic field, and wherein the closed loop magnetic field is maintained when the second base plate is disposed in both the first position and a second position.

Configurable variable position closed track magnetron

Apparatus for processing substrates are provided herein. In some embodiments, an apparatus includes a process kit comprising a shield having one or more sidewalls configured to surround a first volume, the first volume disposed within an inner volume of a process chamber; and a first ring moveable between a first position, wherein the first ring rests on the shield, and a second position, wherein a gap is formed between an outer surface of the first ring and an inner surface of the one or more sidewalls, wherein a width of the gap is less than about two plasma sheath widths for a plasma formed at a frequency of about 40 MHz or higher and at a pressure of about 140 mTorr or lower.

Process kit with plasma-limiting gap

Methods and apparatus for depositing a metal-containing layer on a substrate are provided herein. In some embodiments, a method of processing a substrate in a physical vapor deposition (PVD) chamber includes applying RF power at a VHF frequency to a target comprising a metal disposed in the PVD chamber above the substrate to form a plasma from a plasma-forming gas; optionally applying a DC power to the target to direct the plasma towards the target; sputtering metal atoms from the target using the plasma while maintaining a first pressure in the PVD chamber sufficient to ionize a predominant portion of the sputtered metal atoms; and controlling the plasma sheath voltage between the plasma and the substrate to form a metal-containing layer having a desired crystal structure and or desired morphology on feature structures.

Crystalline orientation and overhang control in collision based RF plasmas

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Menlo Park, CA, United States of America

Alan A Ritchie