Analog Devices,inc.

Invensense, Inc.

Alain Valentin Guery

Dipak Sengupta

Shrenik Deliwala

Kieran P Harney

Michael C Coln

David Frank Bolognia

Michael C W Coln

Colin Gerard Lyden

Howard R Samuels

Brian Moss

J Brian Harrington

Gary Carreau

Michael Mueck

Vikram Venkatadri

Evgueni Vladimirovich Ivanov

Mohamed Azize

Robert John Brewer

Bruce E Amazeen

James M Lee

Phillip Nadeau

Camille L Huin

Lejun Hu

Cathal Murphy

David Gerrard Laing

Hari Chauhan

Carlos Calvo

Mario Joseph Freni

Joyce Wu

Amrita Ray Chaudhury

Michael CW Coln

One embodiment is a multi-analyte molecular sensing system designed for implantation in a body of a subject, the sensing system including an implant comprising a flexible substrate having a plurality of electronics systems disposed thereon; a sensor array comprising multiple sensors disposed on the flexible substrate; a sensor protection mechanism for providing selective protection and exposure of one or more of the sensors; a power system for providing power to the electronics systems; a data communication system for communicating with one or more external devices; and a biocompatible housing for protecting the implant.

Subcutaneous biosensor

According to one example configuration, an apparatus enhances functionality of a mobile communication device. The apparatus includes an encasement in which to retain the mobile communication device and supplemental circuitry. The supplemental circuitry is operable to: i) control an optical transmitter in the supplemental circuitry to irradiate matter under test, ii) monitor attributes of an optical signal reflected off the matter under test and received by the optical receiver; and iii) communicate the attributes of the optical signal from the supplemental circuitry to the mobile communication device over a communication link. The supplemental circuitry optionally includes multiple electrodes to further monitor attributes of the matter under test.

Smartphone companion device material sensing and improved phone performance

Low-cost and high-efficiency monolithically integrated nanoscale-based light emitter techniques can be used in, for example, electronic display applications and spectroscopy applications using spectrometers. Using various techniques, a light emitter can include quantum dots (QDs) and can be arranged to emit light in mono-band (e.g., one wavelength) or in broad-band (e.g., more than one wavelength) such as in the visible to mid-infrared range, e.g., from about 365 nm to about 10 &#x3bc;m. The light emitter nanotechnology can be based on a nanoscale wafer manufacturing for displays and spectroscopy applications.

Monolithically integrated nanoemitter light source assembly

A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.

Microphone module with sound pipe

Embodiments of the present disclosure provide code readers for reading codes provided as patterns imprinted on objects. Light interacts with a pattern by e.g. being reflected from or transmitted through the pattern, and at least some of the light that has interacted with the pattern is incident on photosensitive element(s) of one or more photodetectors of a code reader. The code reader employs centroid-measuring photodetector(s), i.e. photodetectors that detect light in such a manner that centroid of a pattern can be obtained directly from the photocurrents generated as a result of the photosensitive elements detecting light incident thereon. The code reader is then configured to process the detected light to determine a centroid of the pattern from the detected light and to decode data encoded in the pattern based on a position of the centroid. Such code readers are substantially less complex than camera-based devices and avoid mechanical scanning.

Simple code reader

A microphone system has a package forming an interior chamber, and a MEMS microphone secured within the interior chamber. The package forms an aperture for permitting acoustic access to the interior of the chamber and thus, the MEMS microphone. The system also has two dies; namely, the system has a primary circuit die within the interior chamber, and an integrated passive device die electrically connected with the primary circuit die. The primary circuit die is electrically connected with the MEMS microphone and has at least one active circuit element.

Microphone system with integrated passive device die

An accurate, cost-efficient temperature sensor may be integrated into an integrated circuit (IC) using common materials as the IC's interconnect metallization. The temperature sensor may include an impedance element having a length of metal made of the interconnect metal, a current source connected between a first set of contacts at opposite ends of the impedance element, and an analog-to-digital converter connected between a second set of contacts at opposite ends of the impedance element. The temperature sensor may exploits the proportional relationship between the metal's resistance and temperature to measure ambient temperature. Alternatively, such a temperature sensor may be used on disposable chemical sensors where the impedance element is made of a common metal as conductors that connect a sensor reactant to sensor contacts. In either case, because the impedance element is formed of a common metal as other interconnect, it is expected to incur low manufacturing costs.

On-chip temperature sensor using interconnect metal

A computed tomography detector module can include a detector element, a frame, and a converter element. The detector element can be configured to detect electromagnetic radiation at a detection plane and output one or more analog detection signals. The frame can connect to the detector element and include a shield portion, parallel to the detection plane, configured to at least partially block X-rays. The converter element can include a substrate having connector and component substrate portions, the connector substrate portion thicker in a direction perpendicular to the detection plane than the component substrate portion and configured to extend through an aperture of the frame, the component substrate portion having at least one substrate surface parallel to the detection plane with one or more electrical components attached thereto. The detector module can optionally include a heat sink, which can have a top surface separated from the component substrate portion and components attached thereto by a separation gap. A computed tomography scanner can include the detector module.

Computed tomography detector module

An amplifier system can include a feedback amplifier circuit having an amplifier, a feedback capacitor connected between an input terminal and an output terminal of the amplifier by at least one first switch, and a reset capacitor connected across the feedback capacitor by at least one second switch and between a pair of reference voltages by at least one third switch. During an input-signal processing phase of operation, a control circuit may close the at least one first switch and open the at least one second switch to electrically connect the feedback capacitor between the input and output terminals to engage feedback processing by the feedback amplifier circuit, and close the third switch to electrically connect the reset capacitor between the first and second voltages to charge the reset capacitor to a selectable voltage difference. During a reset phase of operation, the control circuit may open the at least one third switch, close the at least one second switch and open the at least one first switch to electrically connect the reset capacitor across the feedback capacitor to reset the feedback capacitor using the reset capacitor. The amplifier system can optionally include a plurality of the feedback amplifier circuits.

Reset and resettable circuits

A serial protocol and interface for data transmission from a data transmitterto a data receiverwhere the propagation delay may be up to several clock cycles long and may be varying slowly. The data receiver provides a clock to the data transmitter. A synchronization signal provided by either the receiver or the transmitter initiates a frame of data transmission at a transfer rate controlled by the clock. The synchronization signal coordinates the transmission of a data header followed by a predetermined number of data bits, known as the frame length. The data receiver uses the header bits to determine the times to sample the subsequent data bits. The length of the frame is limited to provide sufficient likelihood the propagation delay line characteristics have not changed enough to cause a bit error. The system resynchronizes at the beginning of each frame.

Serial digital data communication interface for transmitting data bits each having a width of multiple clock cycles

Described is a die having photodetectors provided on a first surface thereof. The die includes an insulative shell member, a conductive shell member and a photodetector conductor. The insulative shell member extends around a periphery of the photodetector receptors and extending through a depth of the semiconductor die. The conductive shell member bridges the insulative shell member and extends through the depth of the semiconductor die. The photodetector conductors are provided on the first surface of the semiconductor die and electrically couple respective photodetectors with a corresponding conductive shell member. Also described is a process for making a semiconductor die and an integrated circuit structure.

Silicon detector and method for constructing silicon detectors

A method of estimating a change of a variable over a measurement window, including the steps of taking multiple samples of the variable during the measurement window, defining a weight to be associated with each sample, the weight varying as a function of position of the sample within the measurement window, processing the samples taking account of their weight to form an estimate of the change in the variable.

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Andover, MA, United States of America

Alain Valentin Guery