Alcatel

Compagnie Generale D'electricite

Alcatel Cable

Societe Anonyme Dite Alcatel Alsthom Compagnie Generale D'electricite

Alain Petitbon

Eric Ranchy

Pascal Estop

Stephane Cazabat

Nadia Broqua

Sophie Crouzy

Roland Queriaud

Electronic power module, and electronic power system comprising a

The invention concerns a power electronic module comprising two individual modules (1) each comprising a power electronic component (5) having a contact face (6) mounted on a metallic face (7) of a substrate (8), power connections (11, 13, 20) a metallic heat exchanger (2) mounted on the other face (12) of the substrate (8). In accordance with the invention the two individual modules (1) are face to face, the power electronic component (5) of one individual module (1) facing the power electronic component (5) of the other individual module (1), and separated from each other by at least one spacer (3) comprising control leads (14) for controlling the individual modules (1) and power leads (13) for transmitting power to the individual modules (1) or between individual modules (1).

Power electronic module and power electronic device including such

The invention concerns a method of bonding a diamond substrate to at least one metal substrate. According to the invention:

Method of bonding a diamond substrate to at least one metal substrate

A method of bonding copper to a heat conducting and electrically insulating power electronics substrate made of a non-oxide ceramic selected from AlN, SiC, and BN, the method including the steps of oxidizing the surface of the substrate and then directly bonding copper to the oxidized surface of the substrate, wherein the step of oxidizing the surface of the substrate is performed by irradiating the surface using a laser beam to a thickness in the range 0.1 .mu.m to 3 .mu.m.

Method of bonding copper and a substrate for power electronics and made

A method of fabricating a superconductive flexible conductor having a high critical temperature in which method a deposit of superconductive ceramic is applied to a metal tape of thickness lying in the range 0.1 mm to 1 mm, wherein:

Method of fabricating a superconductive flexible ceramic conductor

A carbon dioxide laser (4) directs a beam (6) onto a ceramic workpiece to be treated (18), which workpiece moves along arrow (20). A carrier gas injector (14) injects a moderate throughput of spheroidized powder of a ceramic material into said beam. After melting and solidifying, the layer (24) after has microcracks which are smaller than they would have been if there had been no projected powder. The method is applicable to the construction of heat engines.

Growing community of inventors

St Arnoult en Yvelines, France

Alain Petitbon