Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Commissariat a L'energie Atomique

Alain Gueugnot

Francois Marion

Manuel Fendler

François Marion

Abdenacer Ait-Mani

Alexis Bedoin

Frédéric Berger

A method of assembling a first and a second electronic components includes forming connection elements on an assembly surface of the first component and forming connection elements on an assembly surface of the second component. The method also includes depositing a liquid layer of electrically-insulating curable material on the assembly surface of the first and/or of the second component and arranging the first and second components on each other to place the connection elements of the second component in front of the connection elements of the first component. The method further includes applying a force along a predetermined direction and the first and/or the second components to create electric interconnects each formed of a connection element of the first component and of a connection element of the second component and curing the curable material.

Flip-chip assembly process comprising pre-coating interconnect elements

The invention concerns a method of collective bonding of individual chips on a strained substrate (), which comprises the following steps: functionalised layers () are arranged on a support (), in an adjacent non-contiguous manner, with a space e between two neighboring layers (), a calibrated drop of adhesive () is deposited on each of these functionalised layers, the strained substrate () is transferred onto these drops of adhesive, the parts of the assembly thereby formed are singularized to produce chips () bonded to the surface of strained substrate. The invention also concerns a method of placing under strain a semiconductor reading circuit by a substrate in a material of different coefficient of expansion.

Method of bonding chips on a strained substrate and method of placing under strain a semiconductor reading circuit

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Sassenage, France

Alain Gueugnot