Xerox Corporation

Alain E Perregaux

Josef E Jedlicka

Jagdish C Tandon

Paul Allen Hosier

Joseph F Stephany

Virgil Joseph Hull

Xiao-Fan Feng

Gaurav Sharma

Robert Paul Herloski

Roger Lee Triplett

Ned J Seachman

Kevin Michael Carolan

Joseph P Taillie

LeRoy A Baldwin

John D Hower, Jr

Eugene C Faucz

Andras I Lakatos

Robert Brutovski

Ram S Narang

Stephen C Corona

Gary A Dir

Nicholas J Salatino

Fred F Wilczak, Jr

Kimberly R Page

The present disclosure relates that by modifying chip die dicing methodology to a U-groove profile from a V-groove profile by modifying the second etch step to be a dry etch instead of a wet etch results in a direct cost savings by eliminating a more expensive process step, as well as the need for stripping the developed photoresist layer. Furthermore, going to a U-groove profile accomplishes additional indirect and greater cost savings resulting from increased process throughput, improved yield, and reduced metal layer defects.

Use of a U-groove as an alternative to using a V-groove for protection against dicing induced damage in silicon

A photosensitive imaging device for recording images across the entire visible spectrum includes a set of photosensors which have a peak response around the orange part of the spectrum, about 600 nm. The peak response is obtained by combining responses of, in one case, photosensors associated with a filter which admits red or infrared wavelengths and longer and photosensors associated with a filter which admits orange wavelengths and longer. In another case, the photosensor is structured to attenuate longer wavelengths, which, in combination with a filter which admits orange and longer wavelengths, can simulate a peak behavior around the orange part of the spectrum.

Photosensitive imaging apparatus sensitive to orange light

The present invention generally relates to a digital scanner for scanning images. More specifically, the present invention is directed to a method and apparatus for enhancing the quality of scanned images obtained by filtering out the infrared component of digital data to provide enhanced digital images.

Infrared correction in color scanners

In a photosensitive scanning apparatus, in which a plurality of chips are aligned to form a single linear array of photosensors, gaps of unknown width between photosensors on adjacent chips may have an effect on resulting image quality. A set of simple strategies can be used to overcome the problem. In a first strategy, for each chip, interpolation of output values of the photosensors is used to in effect displace the outputs of the photosensors by a predetermined amount toward a gap; within constraints, the predetermined displacement can be used without actual measurement of any gap width. In a second strategy, an interpolated output of a theoretical &ldquo;phantom photosensor&rdquo; disposed toward the gap is added to the output stream from each chip.

System for compensating for chip-to-chip gap widths in a multi-chip photosensitive scanning array

Geometric configurations for photosites found on photosensitive chips for creating electrical signals from an original image, as would be found, for example, in a digital scanner, copier, facsimile machine, or other document generating or reproducing device. The photosensitive chips are mounted on a substrate to form a photosensitive array in a full width scanner or other photosensitive device. The geometric configurations reduce the Moir&eacute; patterns to provide a higher quality image.

Geometric configurations for photosites for reducing Moir&eacute; patterns

Geometric configurations for photosites found on photosensitive chips for creating electrical signals from an original image, as would be found, for example, in a digital scanner, copier, printer, facsimile machine, or other document generating or reproducing device. The photosensitive chips are mounted on a substrate to form a photosensitive array in a full width scanner or other photosensitive device. The geometric configurations reduce the Moir&eacute; patterns to provide a higher quality image.

Geometric configurations for photosites for reducing moire patterns

A system and method electronically determines an edge of a copy substrate to be printed on. A copy substrate is inserted between a linear light source array and a linear sensor array and a light segment of the linear light source array is illuminated. An edge location of a shadow created by the copy substrate intersecting a light path between the illuminated light segment and the linear sensor array is measured, and a location of the edge of the copy substrate is calculated based on the measured shadow location. A second light segment of the linear light source on an opposite side of an expected copy substrate edge position of the light segment can also be illuminated, and a second edge location of a shadow created by the copy substrate intersecting a light path between the illuminated second light segment and the linear sensor array can be measured wherein this second measurement can be used with the first to calculate a location of the edge of the copy substrate. Alternatively, the calculated location can be used to determine a light segment of the linear light source which corresponds to the calculated location. This determined light source is illuminated and the shadow measured. The new measurement is used to calculate the edge of the copy substrate.

Copy substrate edge electronic registration system for a reprographic system

Copy substrate edge electronic registration system for a reprographic

In a hard-copy scanner in which a set of photosensitive silicon chips are abutted to form a single page-width array of photosensors, the photosites at the critical ends of each chip are specially shaped to ensure an even spacing of all photosites along the array, taking into account imprecisions in the dimensions of individual chips. The special shape of the end photosite is trapezoidal or a variation of trapezoidal.

Geometries for photosites in a photosensitive silicon chip

A color chip construction especially adapted for use in fabricating full width arrays in which the individual chip photosites consisting of a blue, green, and red photodiode shaped and positioned to provide a rectangular photosite with square sides that enhance butting of the color chip with other like color chips to form full width color arrays.

Color array for use in fabricating full width arrays

An optical shield for a liquid crystal dot shutter image bar and fabrication process therefor. In one embodiment, a layer of dye-in-photoresist is formed on the interior surface of one of the glass substrates and over the one or more electrodes thereon. The photoresist layer is exposed through a mask and developed to form an optical shield having the desired configuration of optical apertures and a thickness of 2 to 3 micrometers. Alternate embodiments use two separate dye loaded layers that do not react with each other or dissolve in similar solvents. The first layer is dye loaded PMMA layer covered by a dye-in-photoresist. The dye can be selected to filter any desired spectral region.

Growing community of inventors

Rochester, NY, United States of America

Alain E Perregaux