Fogale Nanotech

Unity Semiconductor Corporation

Nanotec Solution

Fogale Sensors

Alain Courteville

Gilles Fresquet

Philippe Gastaldo

Wolfgang Alexander Iff

Didier Roziere

Charankumar Godavarthi

Christian Neel

Sylvain Petitgrand

Jérôme Porque

Michael Schöbitz

Yacine Chakour

A method for characterizing structures etched in a substrate, such as a wafer is disclosed. A bottom of the structure is embedded in the substrate, the substrate having a top side in which the structures are etched and a bottom side opposite to the top side. The method includes the following steps: illuminating the bottom of at least one structure with an illumination beam issued from a light source emitting light with a wavelength adapted to be transmitted through the substrate, acquiring, with an imaging device positioned on the bottom side of said substrate, at least one image of a bottom of the at least one structure through the substrate, and measuring at least one data, called lateral data, relating to a lateral dimension of the bottom of the at least one HAR structure from the at least one acquired image. A system implementing such a method is also disclosed.

Method and a system for characterising structures through a substrate

A device for interface shape of an optical element including at least one low-coherence light source, at least one optical sensor, an interferometric device illuminated by the light source and configured for shaping at least one measurement beam and at least two reference beams, directing one measurement beam to the element to pass through the interfaces, and directing the light from at least two interfaces to the sensor or sensors, each sensor globally configured for detecting at least two interference signals resulting respectively from interferences between the measurement beam reflected by one of the at least two interfaces and one of the reference beams; the measurement device also including a positioner for positioning a coherence area at the level of each interface and a digital processor for producing, from the interference signals, an item of information of the shape of each interface according to a field of view.

Device and method for measuring interfaces of an optical element

A device and method for measuring a surface of an object, including at least one light source, at least one optical sensor, and an interferometry device having a measurement arm and a reference arm, the former directing light from each light source towards the surface of the object and directing light from the surface towards each optical sensor; the measurement device, in an interferometry configuration, illuminating the reference arm and the measurement arm with each light source and directing the light from the measurement arm and the reference arm towards each optical sensor to form an interference signal; the measurement device, in an imaging configuration illuminating at least the measurement arm and directing the light from the measurement arm towards the optical sensor to form an image of the surface; the measurement device including a digital processor producing, from the interference signal and the image, information on the surface.

Device and method for imaging and interferometry measurements

A method for characterizing a structure etched in a first substrate surface, the structure extending along a longitudinal direction, z, into the substrate, the method implemented by a system including a light source emitting an illumination beam with a wavelength transmitted through the substrate, and an imaging device positioned to face a second substrate surface opposite the first surface, the method including illuminating at least one structure with the illumination beam, subsequently positioning an object plane of the imaging device at at least two different longitudinal positions; acquiring at least one image of the structure at each of the longitudinal positions, the images being acquired through the substrate; measuring data relating to a lateral dimension of the structure from each acquired image at each of the longitudinal positions; and determining longitudinal data relating to a longitudinal shape of the structure from the lateral data of at least two longitudinal positions.

Method and a system for characterizing structures through a substrate

A method for characterizing structures etched in a substrate, such as a wafer is disclosed. The method includes the following steps: illuminating the bottom of at least one structure with an illumination beam issued from a light source emitting light with a wavelength adapted to be transmitted through the substrate, acquiring, with an imaging device positioned on the bottom side of said substrate, at least one image of a bottom of the at least one structure through the substrate, and measuring at least one data, called lateral data, relating to a lateral dimension of the bottom of the at least one HAR structure from the at least one acquired image. A system implementing such a method is also disclosed.

A measurement device, for measuring the shape of an interface to be measured of an optical element having a plurality of interfaces, the device including a measurement apparatus with at least one interferometric sensor illuminated by a low-coherence source, for directing a measurement beam towards the optical element to pass through the plurality of interfaces, and to detect an interference signal resulting from interferences between the measured measurement beam reflected by the interface and a reference beam, a positioning apparatus configured for relative positioning of a coherence area of the interferometric sensor at the level of the interface to be measured, and a digital processor for producing, based on the interference signal, an item of shape information of the interface to be measured according to a field of view.

Apparatus provided with a capacitive detection and electric line(s) in the capacitive detection zone

A low-coherence interferometer apparatus for determining information on interfaces of an object including: a polychromatic light source; an optical system generating a measurement optical beam and a reference optical beam; a delay line introducing a variable optical delay between the optical beams; detection optics combining the beams, and producing a spectral signal representative of an optical-power spectral density of the resulting interference signal; a control and processing module acquiring a plurality of spectral signals for a plurality of optical delays, determining, for each spectral signal, optical retardation information between interfering beams within a spectral measurement range, analyse the variation in the retardations, and assign the optical retardation determined on the basis of the different spectral signals to interface curves, corresponding to straight lines with positive, negative, zero or almost-zero gradient, depending on the respective optical delay of the acquisition of the spectral signals, and to deduce information of the object.

Low-coherence reflectometry method and device employing time-frequency detection

A device for the detection of objects for a robot, provided for equipping said robot, including:

Multi-distance detection device for a robot, and robot equipped with such (a) device(s)

A method is provided for inspecting the surface of an object such as a wafer having tridimensional structures, using a confocal chromatic device with a plurality of optical measurement channels and a chromatic lens allowing optical wavelengths of a broadband light source to be focused at different axial distances defining a chromatic measurement range. The method includes a step of obtaining an intensity information corresponding to the intensity of the light actually focused on an interface of the object within the chromatic measurement range at a plurality of measurement points on the object by measuring a total intensity over the full spectrum of the light collected by at least some of the optical measurement channels in a confocal configuration.

Method for 2D/3D inspection of an object such as a wafer

A confocal chromatic device for inspecting the surface of an object such as a wafer, including a plurality of optical measurement channels with collection apertures arranged for collecting the light reflected by the object through a chromatic lens at a plurality of measurement points, the plurality of optical measurement channels including optical measurement channels with an intensity detector for measuring a total intensity of the collected light. A method is also provided for inspecting the surface of an object such as a wafer including tridimensional structures.

Chromatic confocal device and method for 2D/3D inspection of an object such as a wafer

A confocal chromatic device is provided for inspecting the surface of an object such as a wafer, including a plurality of optical measurement channels with collection apertures arranged for collecting the light reflected by the object through a chromatic lens at a plurality of measurement points, and a magnifying lens arranged for introducing a variable or changeable scaling factor between the spatial repartition of the collection apertures and the measurement points. A method is also provided for inspecting the surface of an object such as a wafer including tridimensional structures.

Chromatic confocal device and method for 2D/3D inspection of an object such as a wafer with variable spatial resolution

A method for measuring the heights of patterns of an object, including: a light emission, the light includes a propagation mode of interest for at least one wavelength of interest, an illumination of the surface of the object by the light, a reflection of the light by the surface of the object, a collection of the reflected light, a division of the wavefront of the reflected light into division components, by at least one pattern of the illuminated surface, a filtering of the collected light, including a modal filtering removing all modes other than the propagation mode of interest, for the wavelengths of interest, and from the filtered light, and for the wavelengths of interest, an extraction of information about phase differences between the division components.

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Congénies, France

Alain Courteville