Micron Technology Incorporated

Alaa N Ali

Kelvin Aik Boo Tan

Srinivasa Anuradha Bulusu

Akshaya Venkatakrishnan

Wen Wei Lum

Implementations described herein relate to various apparatuses and integrated assemblies. In some implementations, an apparatus may include a substrate having a first surface and a second surface that is on an opposite side of the substrate with respect to the first surface. The apparatus may include an integrated circuit disposed on the substrate. The apparatus may include a decoupling capacitor configured to stabilize an input voltage supplied to the integrated circuit, wherein all electrodes of the decoupling capacitor are entirely within a region between the first surface and the second surface.

Capacitor having electrodes formed within a substrate

Methods of reusing and/or repurposing microelectronic devices are disclosed. A method may include receiving an indication of a selected secondary application for a microelectronic device and accessing health information for the microelectronic device. The method may further include determining whether the microelectronic device is fit for the selected secondary application responsive to the health information. Associated devices and systems are also disclosed.

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San Jose, CA, United States of America

Alaa N Ali