Applied Materials, Inc.

Al DiFrancesco

Jeffrey C Hudgens

Tetsuya Ishikawa

Mohsen Salek

Frederik W Freerks

Tim Leong

James R Ciulik

Timothy Y Wang

The present invention generally provides a robot blade which provides a plurality of semi-conductive or conductive contacts disposed at least partially on the surface of the blade to support a substrate above the blade. The contacts are preferably located inwardly from the edge of the blade and toward the center of the blade to provide a collection area on the blade to capture any particles which may form. The blade is preferably made of a semi-conductive material, such as alumina or other semi-conductive material, to provide an electrical flow path through the contact(s) to discharge any electrical charge which may build up on the substrate during processing.

Robot blade for semiconductor processing equipment

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Cupertino, CA, United States of America

Al DiFrancesco