Intel Corporation

Akshay Mathkar

Nachiket R Raravikar

James Chris Matayabas, Jr

Dingying David Xu

Embodiments describe high aspect ratio and fine pitch interconnects for a semiconductor package, such as a package-on-package structure. In an embodiment, the interconnects are formed with a no-slump solder paste. In an embodiment, the no-slump solder paste is printed in an uncured state, and is then cured with a liquid phase sintering process. After being cured, the no-slump solder paste will not reflow at typical processing temperatures, such as those below approximately 400&#xb0; C. According to embodiments, the no-slump solder paste includes Cu particles or spheres, a solder matrix component, a polymeric delivery vehicle, and a solvent. In an embodiment, the liquid phase sintering produces a shell of intermetallic compounds around the Cu spheres. In an embodiment, the sintering process builds a conductive metallic network through the no-slump solder paste.

LPS solder paste based low cost fine pitch pop interconnect solutions

Space transformer including a substrate and a perforated plate disposed on the substrate. The substrate includes conductive traces and an array of conductive probe pins extend outwardly from anchor points on the substrate. The pins are electrically coupled to at least one of the conductive traces on the substrate as an interface between an E-testing apparatus and a DUT. The perforated plate may be affixed to a surface of the substrate and includes an array of perforations through which the conductive pins may pass. The perforated plate may provide one or more of lateral pin support and protection to the underlying substrate and/or traces. The perforated plate may include a metal sheet. A polymeric material may be disposed on at least a sidewall of the perforations to electrically isolate the metal sheet from the conductive probe pins.

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Tempe, AZ, United States of America

Akshay Mathkar