Nokia Technologies Oy

Nokia Solutions and Networks Oy

Akshat Agarwal

Ian Davis

Diarmuid O'Connell

Nicholas M Jeffers

Oliver Burns

Rudi O'Reilly Meehan

Nick Jeffers

Olivier Burns

Nicholas Jeffers

Rudi O'reilly Meehan

A microphone apparatus including: a casing; a composite material located within the casing, the composite material including at least in part conductive particles, the composite material configured to alter an internal impedance based on a surface disturbance transmitted by an acoustic wave, and wherein the microphone apparatus is configured to be coupled to a surface that transmitted the acoustic wave.

Microphone apparatus

Examples of the disclosure relate to an apparatus for sensing biometric parameters. The apparatus may comprise heat transfer means configured to transfer heat from a first location to a location proximate to a subject's sweat glands. The apparatus may also comprise sweat transfer means configured to transfer sweat from the location proximate to a subject's sweat glands to one or more sensors wherein the one or more sensors are configured to sense one or more biometric parameters from the subject's sweat.

Apparatus for sensing biometric parameters

Aspects of the present disclosure may relate to an apparatus, a method, and non-transitory computer-readable storage medium configured for tuning radio frequency elements. In some aspects, the aspects may relate to at least one radio frequency element, at least one wireless charging, one or more channels configured to run between a first portion at least substantially adjacent to the at least one wireless charging coil and a second portion at least substantially adjacent to the at least one radio frequency element, and a dielectric fluid disposed within the one or more channels.

Tuning radio frequency elements

Methods, apparatuses, and computer program products are disclosed for providing a multiphase pumping mechanism configured for multiphase cooling of electrical charging circuitry. In the context of an apparatus, the apparatus includes a thermoelectric cooling device having first and second opposed surfaces and a fluid circulation path having first and second branches in thermal communication with the first and second surfaces, respectively, of the thermoelectric cooling device. The fluid circulation path is configured to control flow of fluid therethrough such that the fluid alternately flows through the first and second branches. The first branch of the fluid circulation path is also configured to be in a thermal communication with at least one first component of a mobile electronic device in order to absorb heat and correspondingly cool the at least one first component of the mobile electronic device.

Method, apparatus, and computer program product for multiphase cooling of a mobile electronic device

An apparatus and method is provided including: modulating or modifying light output by one or more light sources, wherein the light output is for use in rendering content in a first direction using a display, wherein the display has at least one curved portion, wherein the modulating or modifying of the light output by the one or more light sources modulates or modifies said light within said at least one curved portion such that said content is rendered in the first direction.

Apparatus and method for modulating light output using a display

A charging apparatus for inductive charging. The charging apparatus comprises one or more charging coils configured to transfer power to a mobile apparatus and at least one flexible diaphragm configured so that movement of the flexible diaphragm directs air flow towards the mobile apparatus. At least one of, the one or more charging coils or actuating circuitry for actuating the one or more charging coils are mounted on the flexible diaphragm.

Charging apparatus with flexible diaphragm for cooling

Examples of the disclosure relate to vapour chambers. Examples of the disclosure can provide an apparatus comprising: at least a first vapour chamber portion and a second vapour chamber portion wherein the vapour chamber portions comprise walls housing an internal volume where the internal volume is configured to enable vapour flow; at least one hinge formed from walls of the first vapour chamber portion and walls of the second vapour chamber portion and configured to enable the first vapour chamber portion to be moved relative to the second vapour chamber portion; and wherein the hinge is thermally conductive and configured to enable heat to be transferred from the first vapour chamber portion to the second vapour chamber portion.

Vapour chamber

An apparatus including a first member; a first array of flexible actuators connected to the first member, where each of the flexible actuators includes a piezoelectric member and an extension on the piezoelectric member; and a first flexible membrane connected to the first array of flexible actuators. Each of the piezoelectric members is configured to be activated to move their respective extensions. Each of the extensions, when moved by their respective piezoelectric members, is configured to move the first flexible membrane.

Piezoelectric speaker

A speaker apparatus is provided in order to both receive and dissipate heat and to provide acoustic absorption for sound waves propagating through a speaker cavity. The speaker apparatus includes a speaker and a speaker cavity configured to receive sound waves emitted by the speaker for propagation through the speaker cavity. The speaker apparatus also includes a heat dissipation structure disposed at least partially within the speaker cavity. The heat dissipation structure includes a thermally conductive mesh that at least partially fills the speaker cavity. The heat dissipation structure further includes an active element configured to direct heat generated by a component into the thermally conductive mesh for dissipation therein. The thermally conductive mesh is configured to provide acoustic absorption for the sound waves propagating through the speaker cavity.

Speaker apparatus having a heat dissipation structure including an active element

There is disclosed a method of manufacturing an enclosure for an integrated circuit having at least one optical component and at least one electronic component, the method comprising the steps of providing at least one thermal contact connected to at least one of the components, and forming a heat sink that is integral with the enclosure, wherein the at least one thermal contact comprises electrically and thermally conductive metal suitable for transferring heat from the at least one component to the heat sink. There is also disclosed a package comprising an enclosure and an integrated circuit.

Package, and method of manufacturing a package comprising an enclosure and an integrated circuit

A speaker apparatus is provided in order to both receive and dissipate heat and to provide acoustic absorption for sound waves propagating through a speaker cavity. The speaker apparatus includes a speaker and a speaker cavity configured to receive sound waves emitted by the speaker for propagation through the speaker cavity. The speaker apparatus also includes a heat dissipation structure disposed at least partially within the speaker cavity. The heat dissipation structure includes a heat pipe or a heat sink configured to receive heat from a component that generates heat. The heat dissipation structure is configured to provide acoustic absorption for the sound waves propagating through the speaker cavity.

Growing community of inventors

Donate, Ireland

Akshat Agarwal