Carl Zeiss Smt Gmbh

Carl Zeiss Industrielle Messtechnik Gmbh

Carl-zeiss-smt Ag

Carl Zeiss Microscopy Gmbh

Aksel Goehnermeier

Toralf Gruner

Michael Totzeck

Jochen Hetzler

Wolfgang Singer

Daniel Kraehmer

Markus Schwab

Johannes Wangler

Damian Fiolka

Heiko Feldmann

Ulrich Loering

Alexandra Pazidis

Dirk Hellweg

Nils Dieckmann

Markus Brotsack

Markus Zenzinger

Hans-Juergen Mann

Jens Kugler

Bernhard Gellrich

Ulrich Weber

Johannes Ruoff

Bernhard Geuppert

Stefan Xalter

Armin Schoeppach

Franz Sorg

Stefan Hembacher

Helmut Beierl

Ralf Mueller

Guido Limbach

Frank Widulle

Philipp Jester

Peter Meyer

Tammo Uitterdijk

Markus Deguenther

Michael Patra

Markus Hauf

David R Shafer

Thomas Engel

Dominik Seitz

Markus Seesselberg

Frank Schlesener

Ingo Saenger

Guenter Rudolph

Thomas Schicketanz

Christoph Zaczek

Sonja Schneider

Vladimir Kamenov

Franz-Josef Stickel

Jochen Weber

Ulrich Schoenhoff

Olaf Dittmann

Oliver Natt

Arif Kazi

Christian Dietrich

Johann Trenkler

Norbert Kerwien

Gisela Von Blanckenhagen

Payam Tayebati

Tilmann Heil

Gerd Reisinger

Ole Fluegge

Stefan Kraus

Alexander Sauerhoefer

Michael Thier

Gordon Doering

Birgit Kuerz

Gerhard Focht

Ferdinand Bader

Dietrich Imkamp

Rong Dong

Christoph-Hilmar Graf Vom Hagen

Andreas Ebser

Andreas Moebius

Marc Bienert

A system for optical measurement of an object includes a radiation generating device, a capturing device, and an evaluation device. The radiation generating device is configured to emit electromagnetic radiation onto the object. The capturing device includes an image sensor. The capturing device is configured to capture a measurement image as a result of an exposure of the image sensor with radiation returned from the object. The capturing device is configured to vary a focus setting (D) during the exposure. The evaluation device is configured to determine coordinates of at least one location on the object based on the captured measurement image.

System and method for optical object coordinate determination

A probing element for measuring at least one measurement object is provided. The probing element includes at least one first optical sensor configured to generate at least one first sensor signal depending on a fine shape of at least one surface of the measurement object, at least one second sensor configured to generate at least one second sensor signal depending on at least one of a coarse shape of the measurement object, and a distance to the measurement object. The at least one first optical sensor has a first measurement region and the at least one second sensor has a second measurement region. The at least one first optical sensor is at least partly integrated in the at least one second sensor to permit the first measurement region and the second measurement region to at least partly overlap.

Probing element and coordinate measuring machine for measuring at least one measurement object

The invention relates to a device for optical examination of a specimen with a cryo-immersion objective, having a stative, to which the cryo-immersion objective is fixed, wherein the cryo-immersion objective has a plurality of optical components, in particular lenses, and wherein the cryo-immersion objective has an optical front component which is in contact during operation with a coolable immersion liquid, having a specimen carrier for a specimen to be examined, having means for providing a cooled immersion liquid between the optical front component and the specimen to be examined on or against the specimen carrier. The device is characterized in that insulating means are present for interrupting a heat transition between the stative and the optical front component. The invention also relates to a method for examining a specimen, wherein with a device according to the invention a plurality of microscopic images are recorded, wherein for each of the individual images a different offset between a main housing and a separate housing is set. Finally the invention relates to a method for transferring a device according to the invention into an operation-ready state, wherein the components, cooled in operation, of the cryo-immersion objective, in particular the optical front component, are cooled with a coolant, in particular with liquid nitrogen, wherein the immersion liquid is cooled with a coolant, in particular with liquid nitrogen, and wherein thereafter the cooled components of the cryo-immersion objective are brought into contact with the immersion liquid.

Device for optical examination of a specimen, method for examining a specimen and method for transferring a device into an operation-ready state

Coordinate measuring machine, comprising an optical sensor for capturing image data of a workpiece. The optical sensor comprises a lens, which defines an optical axis, and an illumination device for illuminating the workpiece. The illumination device comprises a diffusely radiating luminous body and an optical filter having a plurality of separate light passages. Light emitted by the luminous body enters the filter on an underside thereof, passes through the light passages and emerges again from the filter on an opposite top side thereof. Each of the light passages transmits only light rays that form an angle smaller than a predefined limiting angle with a longitudinal axis of the respective light passage. The lens and the filter are inclined relative to one another in such a way that a normal vector aligned perpendicularly to the top side of the filter forms an inclination angle other than&#xb0; with the optical axis.

Coordinate measuring machine having an improved optical sensing system and related method

A projection exposure tool for microlithography for imaging mask structures of an image-providing substrate onto a substrate to be structured includes a measuring apparatus configured to determine a relative position of measurement structures disposed on a surface of one of the substrates in relation to one another in at least one lateral direction with respect to the substrate surface and to thereby simultaneously measure a number of measurement structures disposed laterally offset in relation to one another.

Projection exposure tool for microlithography and method for microlithographic imaging

A multilayer mirror for reflecting extreme ultraviolet (EUV) radiation, the mirror has a substrate and a stack of layers formed on the substrate. The stack of layers comprises layers including a low index material and a high index material, the low index material having a lower real part of the refractive index than the high index material at a given operating wavelength &#x3bb;. The mirror provides a first peak of reflectivity of 20% or more at a first wavelength &#x3bb;in a first wavelength band extending from 6 nm to 7 nm and a second peak of reflectivity of 20% or more at a second wavelength &#x3bb;in a second wavelength band extending from 12.5 nm to 15 nm.

Multilayer mirror

A method and a measuring machine for determining dimensional properties of a measurement object each use a workpiece table and a camera having an image sensor and an imaging optics. The imaging optics exhibits aberrations and is configured to be focused on a plurality of different working positions relative to the workpiece table. The aberrations are minimized by using first calibration values provided for a defined working position. A first working distance of the camera relative to a region of interest is determined. Subsequently, the imaging optics is focused, using the first working distance and using second calibration values that represent an image field curvature of the camera, such that the region of interest is substantially brought into a defined working position. Subsequently, the image recording and image evaluation take place to determine measurement values that represent the dimensional properties of the measurement object in the region of interest.

Method and measuring machine for determining dimensional properties of a measurement object

A method of lithographically transferring a pattern on a light sensitive surface in a multiple exposure process comprises the following steps:

Method of lithographically transferring a pattern on a light sensitive surface and illumination system of a microlithographic projection exposure apparatus

A measuring apparatus and method for determining dimensional characteristics of a measurement object use a sensor head in order to register desired measurement points on the measurement object. The sensor head comprises a polychromatic light source for generating light having various wavelengths of light, a spectrometer, and an optical system having at least one lens element. The optical system produces a first defined range of color dependent foci and a second defined range of color dependent foci in front of the at least one lens element. The spectrometer generates a first spectral information when the measurement object is in the first defined range, and it generates a second spectral information when the measurement object is in the second defined range. An evaluation unit exploits the first spectral range in a coarse measurement mode, and it exploits the second spectral range in a fine measurement mode.

Measuring apparatus and method for determining dimensional characteristics of a measurement object

The disclosure relates to a projection exposure apparatus for EUV microlithography which includes an illumination system for illuminating a pattern, and a projection objective for imaging the pattern onto a light-sensitive substrate. The projection objective has a pupil plane with an obscuration. The illumination system generates light with an angular distribution having an illumination pole which extends over a range of polar angles and a range of azimuth angles and within which the light intensity is greater than an illumination pole minimum value. From the illumination pole toward large polar angles a dark zone is excluded within which the light intensity is less than the illumination pole minimum value, and which has in regions a form corresponding to the form of the obscuration of the pupil plane.

Projection exposure apparatus for EUV microlithography and method for microlithographic exposure

The disclosure provides a projection exposure method for exposing a radiation-sensitive substrate with at least one image of a pattern of a mask. The mask has a first pattern area with a first subpattern, and at least one second pattern area, arranged laterally offset from the first pattern area, with a second subpattern. The first subpattern is irradiated during a first illumination time interval with a first angular distribution, adapted to the first subpattern, of the illumination radiation. Thereafter, the second subpattern is irradiated during the second illumination time interval with a second angular distribution, adapted to the second subpattern, of the illumination radiation, said second angular distribution differing from the first angular distribution.

Projection exposure method and projection exposure system therefor

A projection objective for applications in microlithography, a microlithography projection exposure apparatus with a projection objective, a microlithographic manufacturing method for microstructured components, and a component manufactured using such a manufacturing method are disclosed. The projection objective includes an optical component configured so that, during use of the projection objective, the optical component generates a stray light component in the exposure field of the projection objective which adapts a parameter of the projection objective to a parameter of a second projection objective. The parameter is the stray light component at the exposure field of the projection objective and/or a variation of the stray light component at the exposure field of the projection objective. The parameter of the second projection objective is a stray light component at an exposure field of the second projection objective and/or a variation of the stray light component at the exposure field of the second projection objective. The second projection objective is different from the projection objective.

Projection objective for microlithography with stray light compensation and related methods

Growing community of inventors

Essingen-Lauterburg, Germany

Aksel Goehnermeier