Kabushiki Kaisha Toshiba

Akiyoshi Yamada

Takashi Nishimura

Masahiro Yokota

Kazuyuki Seino

Takashi Enomoto

Hiroyuki Wada

Hirotaka Murata

Shouichi Yokoyama

After sealing layers are formed on peripheral edge parts of a front substrate and a rear substrate, the front substrate and the rear substrate are disposed to be opposed to each other. Current paths are formed in the sealing layers, and power supply is begun. An electric current, which reaches a maximum current value after a current-increasing period of 10% or more of an entire power-supply time, is supplied for a perdetermined time period. The sealing layers are heated and melted by the power supply, and peripheral parts of the front substrate and rear substrate are joined.

Method of bonding display substrates by application of an electric current to heat and melt a bonding material

The evacuated envelope of an image display apparatus has a rear substrate, a front substrate opposing the rear substrate, and a sidewall interposed between the rear and front substrates. A phosphor screen is formed on the inner surface of the front substrate. Electron-emitting elements are provided on the rear substrate. An indium layer is formed on a sealing surface lying between the front substrate and the sidewall. When the indium layer is heated and melted in a vacuum atmosphere, the front and rear substrates are sealed to each other, with the sidewall interposed between them.

Image display apparatus, method of manufacturing the same, and sealing-material applying device

The present application relates to a method of manufacturing an image display device. The manufacturing method includes a step of arranging a side wall made of metal extending along an inner peripheral edge of a front substrate or a back substrate on the inner peripheral edge in a state that the side wall is spaced from a sealing layer, a step of melting or softening the sealing layer by heating the sealing layer and the side wall, and at the same time, discharging gas from the from the side wall, and a step of pressing the side wall against the sealing layer to be bonded thereto by moving the front substrate and the back substrate in a direction such that the substrates are close to each other.

Method of manufacturing an image display device having a sealing portion which seals peripheral edges of front and back substrates

An image display apparatus includes an envelope which has a front substrate and a rear substrate opposed to each other and individually having peripheral edge portions sealed together. A sealed portion is sealed by a sealing member. the sealing member has electrical conductivity and melts when supplied with current. After the sealing member in the sealed portion is supplied with current and melted during manufacture, the current supply is stopped to cool and solidify the sealing member, whereupon the respective peripheral edge portions of the front substrate and the rear substrate are selected together.

Method of manufacturing an image display apparatus by supplying current to seal the image display apparatus

A vacuum envelope of an image display apparatus has a rear substrate and a front substrate, which are opposed to each other, and a plurality of electron emitting elements are located in the vacuum envelope. The respective peripheral portions of the front substrate and the rear substrate are sealed together with a sealing layer between them. A diffusion layer that contains a component of the sealing layer is formed on the substrate side of an interface between the sealing layer and the front substrate and/or the rear substrate.

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Fukaya, Japan

Akiyoshi Yamada