Yamaha Corporation

Akiyoshi Sato

Tsuyoshi Okami

Kunito Takahashi

A sound output device includes: a speaker unit that has a sound emitting portion; an attaching member by which the speaker unit is attached to an object; a separating member that is provided between the speaker unit and the attaching member to separate the speaker unit from the attaching member; and a sealing member that is provided between the speaker unit and the attaching member to reduce a sound that is emitted from a side of the speaker unit opposite to the sound emitting portion and is transmitted to a sound emitting portion side. The attaching member has a first portion on a side of the sound emitting portion of the speaker unit, and the first portion of the attaching member has an opening that corresponds to the sound emitting portion.

Sound output device

A sound output assembly includes an enclosure, a circuit board disposed in the enclosure, and including signal processing circuitry, and a speaker assembly. The speaker assembly includes a main body disposed inside the enclosure, and a supporting member configured to support the main body and having (i) a first portion fixed to the main body such that the first portion of the supporting member and the main body are formed as one body and (ii) a second portion fixed to the circuit board or to the enclosure. The main body includes an acoustic diaphragm in accordance with a signal supplied from the signal processing circuitry. The supporting member is configured to dampen vibration of the main body.

Sound output assembly

A sound output assembly includes an enclosure, a speaker assembly disposed inside the enclosure, and a supporting member having at least a first end fixed to the enclosure such that the at least the first end of the supporting member and the enclosure are formed as one body. The speaker assembly includes an acoustic diaphragm configured to produce a sound by vibrating in accordance with a sound signal. The supporting member is configured to support the speaker assembly and to dampen vibration of the speaker assembly.

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Hamamatsu, Japan

Akiyoshi Sato