Murata Manufacturing Co., Ltd.

Akiyoshi Moriyasu

Makoto Fujita

Toshikazu Funahara

Tadashi Kani

Yasuyuki Morishima

Masao Yonezawa

A quartz oscillator is constructed to achieve a better yield when being mass-produced, by providing a margin of strength for each of the substrates thereof while reducing the thickness of the quartz oscillator devices. A box-shaped circuit substrate is provided for mounting thereon circuit components having different heights from one another. The bottom plate of a recess in this circuit substrate has a level difference, and is constituted of a region where the thickness of the bottom plate is relatively larger and a region where the thickness of the bottom plate is relatively smaller. High-profile circuit components are mounted on the region where the thickness of the bottom plate is smaller, while low-profile components are mounted on the region where the thickness of the bottom plate is larger. By thus increasing the thickness of one portion of the bottom plate of the circuit substrate, the bending strength of the circuit substrate is improved.

Electronic component module and piezoelectric oscillator device

A compact quartz oscillator includes a quartz vibrator that is integrally mounted on a circuit substrate. In the quartz oscillator, flux residue can be easily washed away. A cavity is defined in the approximate center of the circuit substrate. Within the cavity, circuit components defining an oscillation circuit, a temperature-compensating circuit, and other such circuits are surface-mounted preferably via reflow soldering. Connection electrodes are disposed at the four corners of walls surrounding the cavity. The connection electrodes are bonded to electrodes of the quartz vibrator mounted on the circuit substrate preferably via reflow soldering. Recesses are provided in the top surfaces of the walls. With the recesses, clearances are created between the circuit substrate and the quartz vibrator. As a result, in order to wash away flux residue.

Piezoelectric oscillator

A high degree of freedom of design and high density mounting are achieved with a laminated electronic part having a structure such that the occurrence of floating capacitance can be restrained. The laminated electronic part is formed of a first layer and a second layer which are joined to each other with a third layer sandwiched therebetween. The first and second layers may be formed of dielectrics having substantially different respective dielectric constants, and the third layer is formed of a dielectric having a dielectric constant lower than that of the first and second layers, or an insulator. Connecting conductors are provided inside the third layer. A through-conductor inside the first layer can be connected to a through-conductor inside the second, for example, layer via the connecting conductor inside the third layer.

Laminated electronic part

An electronic component includes a substrate having chip parts. First lead terminals and second lead terminals are led out from one end of the substrate toward an outside. The first lead terminal has a holding portion at an intermediate portion. The second lead terminal has a connecting portion for connecting to the substrate and an inserting portion for inserting to the hole of an external circuit board. The connecting portion and the inserting portion of the second lead terminal is connected with an oblique portion. The holding portion of the first lead terminal is in a same plane perpendicular to the surface of the substrate with a boundary portion between the oblique portion and the inserting portion of the second lead terminal.

Growing community of inventors

Moriyama, Japan

Akiyoshi Moriyasu