Tokyo Electron Limited

Akiyoshi Mitsumori

Shin Yamaguchi

Kohei Otsuki

Yoshiyuki Kikuchi

Koichi Murakami

Takehiko Arita

Akira Ishikawa

Atsushi Matsuura

Koji Kamata

A temperature adjustment method includes adjusting a temperature of a placing table on which a target object is placed. The placing table is divided into regions and equipped with temperature detectors. The regions are set along a placing surface of the placing table. The temperature detectors are disposed in the regions, respectively. The placing table is equipped with heat exchange chambers each configured to perform heat exchange by a coolant. The heat exchange chambers are disposed in the regions, respectively. The adjusting of the temperature of the placing table includes adjusting a pressure of the coolant such that the temperature of the placing table reaches a first temperature range; and individually adjusting, after the adjusting of the pressure of the coolant, flow rates of the coolant supplied to the heat exchange chambers, respectively, such that all of temperatures measured by the temperature detectors reach the first temperature range.

Temperature adjustment method

A heat exchange unit performs heat exchange using a coolant and is disposed inside a placing table and equipped with heat exchange chambers. The heat exchange chambers are disposed in regions, respectively, set on the placing table. The regions are set along a placing surface of the placing table. A chiller device circulates the coolant with respect to the heat exchange chambers. A temperature detection device includes temperature detectors. The temperature detectors are disposed in the regions, respectively, between the respective heat exchange chambers and the placing surface. A control device controls the chiller device to adjust a pressure of the coolant such that a temperature of the placing table reaches a first temperature range, and controls the chiller device to individually adjust flow rates of the coolant supplied to the heat exchange chambers, respectively, such that all of temperatures measured by the temperature detectors reach the first temperature range.

Temperature adjustment system

Energy consumption of a temperature control unit can be reduced. A flexible pipeincludes a bellows pipemade of a metal and an inner tube. The inner tubeis provided at an inner side of the bellows pipe, and an inner surface of the inner tube where a fluid flows is smooth. The inner surface of the inner tubewhere the fluid flows may be smoother than a surface of a braided body. Further, the inner tubemay be made of, for example, a conductive material. An inner side of the inner tubewhere the fluid flows may be coated with a conductive film.

Flexible pipe and temperature control system

An electrostatic chuck of an embodiment includes a base, a dielectric layer, and a chuck main body. The dielectric layer is provided on the base, and is fixed to the base. The chuck main body is mounted on the dielectric layer. The chuck main body has a ceramic main body, a first electrode, a second electrode, and a third electrode. The ceramic main body has a substrate mounting region. The first electrode is provided in the substrate mounting region. The second electrode and the third electrode form a bipolar electrode. The second electrode and the third electrode are provided in the ceramic main body, and are provided between the first electrode and the dielectric layer.

Electrostatic chuck and plasma processing apparatus

A cooling table includes a first portion, a second portion, a first path, a second path and a third path. An electrostatic chuck is provided on the first portion, and the first portion is provided on the second portion. The first path is provided within the first portion, and the second path is provided within the second portion. The third path is connected to the first path and the second path. A chiller unit is connected to the first path and the second path. The first path is extended within the first portion along the electrostatic chuck, and the second path is extended within the second portion along the electrostatic chuck. A coolant outputted from the chiller unit passes through the first path, the third path and the second path in sequence, and then is inputted to the chiller unit.

Processing apparatus for processing target object

The step of removing the reaction product includes a step of loading a dummy wafer on the loading table, a step of increasing the temperature of the loading table, and a step of removing the reaction product after increasing the temperature of the loading table. In the step of increasing the temperature of the loading table, the temperature of the loading table is increased by opening an expansion valve between an output terminal of a condenser and an input terminal of the heat exchange unit, inputting heat to the loading table, opening a flow dividing valve between an output terminal of a compressor and the input terminal of the heat exchange unit, and adjusting an opening degree of the flow dividing valve.

Cleaning method

A cooling system configured to circulate a coolant under a placing surface of a placing table includes a heat exchange unit within the placing table and configured to perform a heat exchange by the coolant via the placing surface; a chiller unit connected to the heat exchange unit. The heat exchange unit comprises a reservoir chamber configured to store the coolant; and an evaporation chamber configured to evaporate the coolant stored in the reservoir chamber. The reservoir chamber is connected to the chiller unit and communicates with the evaporation chamber. The evaporation chamber is connected to the chiller unit, extended along the placing surface and includes discharge holes. The discharge holes are arranged such that the coolant is discharged toward a heat transfer wall as a placing surface-side inner wall of the evaporation chamber. The discharge holes are dispersed within the placing surface.

Cooling system

A plasma processing apparatus includes a partition plate, an antenna, and a high frequency power supply. The partition plate has a plurality of holes and partitions an inside of the processing container into a plasma generation chamber and a processing chamber. The antenna generates plasma of the plasma excitation gas supplied into the plasma generation chamber. The high frequency power supply generates plasma of a precoating gas supplied into the plasma generation chamber and introduced into the processing chamber through the plurality of holes of the partition plate. The plasma processing apparatus performs a precoating on a surface of a partition plate on a side of the processing chamber by causing the high frequency power supply to generate plasma of the precoating gas before a plasma processing using the plasma of the plasma excitation gas is performed.

Plasma processing apparatus and precoating method

In an embodiment, there is provided a method of operating an electrostatic chuck of a plasma processing apparatus. The electrostatic chuck has a base, a dielectric layer formed on the base, and a chuck main body mounted on the dielectric layer. In the method, a temperature difference between the temperature of the base and the temperature of the chuck main body is reduced in a state in which the chuck main body is attracted to the dielectric layer with a relatively small electrostatic attractive force. In a case where the temperature difference between the temperature of the base and the temperature of the chuck main body becomes equal to or less than a predetermined value, the chuck main body is fixed to the base via the dielectric layer by a relatively large electrostatic attractive force.

Method of operating electrostatic chuck of plasma processing apparatus

A processing apparatus includes a chamber main body; a stage having therein a first passage for coolant and a space communicating with the first passage; a first pipeline having a first end portion inserted into the space to be connected to the first passage and a second end portion connected to a coolant supply mechanism; and a first sealing member provided at a gap between a wall surface confining the space and the first end portion. A second passage having one end and the other end is formed within the stage. The one end of the second passage is connected to the gap. The first sealing member is contacted with the wall surface at a side of the first passage with respect to the second passage. The processing apparatus comprises a second pipeline connected to the other end thereof; and a detecting device connected to the second pipeline.

Processing apparatus for target object and inspection method for processing apparatus

A processing systemincludes a heat insulating pipe, a temperature measuring device, and a control device. The heat insulating pipehas an inner pipe and an outer pipe. An airtight space is formed between the inner pipe and the outer pipe. A fluid having a temperature lower than that of an indoor space in which the heat insulating pipeis placed is flown within the inner pipe. The temperature measuring devicemeasures a temperature of a surface of the heat insulating pipe. The control deviceis controls a pressure within the airtight space by controlling an exhaust deviceconfigured to exhaust a gas within the airtight space based on the temperature of the surface of the heat insulating pipeand a dew-point temperature calculated from a humidity and the temperature of the indoor space.

Heat insulating pipe system and processing system

A temperature control method includes cooling an upper electrode and increasing a temperature of the upper electrode. A path having an inlet and an outlet is formed within the upper electrode. The upper electrode constitutes an evaporator. A compressor, a condenser and an expansion valve are connected in sequence between the outlet and the inlet of the path. A flow dividing valve is connected between an output of the compressor and the inlet to bypass the condenser and the expansion valve. In the cooling of the upper electrode, a coolant is supplied into the path via the compressor, the condenser and the expansion valve. In the increasing of the temperature of the upper electrode, the flow dividing valve is opened and the upper electrode is heated.

Growing community of inventors

Miyagi, Japan

Akiyoshi Mitsumori