Ngk Insulators, Inc.

Akiyoshi Hattori

Kazuhiro Nobori

Yutaka Mori

Tomoyuki Fujii

Tetsuya Kawajiri

Masaki Ishikawa

Yuji Akatsuka

Ikuhisa Morioka

Taiji Kiku

Takahiro Takahashi

Keiichi Nakamura

Takeru Torigoe

Tomohisa Mizoguchi

Koji Ueda

Hitoshi Nishio

A ceramic material that has a high resistivity and high corrosion resistance according to the present invention contains magnesium-aluminum oxynitride and has a carbon content of 0.005 to 0.275 mass %.

Ceramic material having high resistivity and high corrosion resistance, and wafer placement table

A wafer mounting table includes a first electrode and a second electrode buried inside of a ceramic substrate having a wafer mounting surface so as to be parallel to the wafer mounting surface with the first electrode closer to the wafer mounting surface than the second electrode. The wafer mounting table includes a conductive section that electrically conducts the first electrode and the second electrode. The conductive section is such that a plurality of circular members comprised of plate-shaped metal meshes parallel to the wafer mounting surface are stacked between the first electrode and the second electrode.

Wafer mounting table and method of manufacturing the same

A bonding agent is provided which includes a flux containing either calcium aluminate or calcium oxide and aluminum oxide and aluminum nitride powder.

Bonding agent, aluminum nitride composite body, and manufacturing method of the same

An electrostatic chuck with a heater includes: a base formed of a sintered body containing alumina; an ESC electrode provided in an upper portion side in the base; and a resistance heating body embedded in a lower portion side in the base. The base is composed of a dielectric layer from the ESC electrode to an upper surface of the base, and of a support member from the ESC electrode to a lower surface of the base. In the support member, a carbon content differs between an ESC electrode neighborhood in contact with the dielectric layer and a lower region below the ESC electrode neighborhood, a carbon content in the dielectric layer is 100 wt ppm or less, the carbon content in the ESC electrode neighborhood is 0.13 wt % or less, the carbon content in the lower region is 0.03 wt % or more and 0.5 wt % or less, and the carbon content in the ESC electrode neighborhood is smaller than the carbon content in the lower region. The resistance heating body contains niobium or platinum.

Electrostatic chuck with heater and manufacturing method thereof

An electrostatic chuck heater is provided including a base which is formed by applying conductive paste containing a binder to upper and lower surfaces of an alumina sintered body to print an electrostatic electrode and heater electrode, calcining the alumina sintered body, arranging alumina powder above the electrostatic electrode and alumina powder below the heater electrode, and pressing the alumina powder and alumina sintered body in the above state for pressure sintering. The diffusion area ratio of the conductive material near the electrostatic electrode in the dielectric layer is set to not more than 0.25%.

Electrostatic chuck heater

An electrostatic chuck with a heater including: a base which is composed of a sintered body containing alumina, an electrode disposed in an upper part of the base, and a resistance heating element embedded in a lower part of the base. The base includes a dielectric layer between the electrode and an upper surface of the base and a supporting member between the electrode and a lower surface of the base. The dielectric layer has a carbon content of not more than 100 ppm, and the supporting member has a carbon content of 0.03 to 0.25 wt %. Moreover, the resistance heating element is formed into a coil and mainly composed of niobium.

Electrostatic chuck with heater

An electrostatic chuck includes a base. The base has a support portion made of alumina ceramics, and a surface portion made of yttria ceramics. The surface portion forms at least a substrate mounting surface and side surface of the base on a surface of the support portion. Carbon contents in alumina ceramics of the support portion and yttria ceramics of the surface portion are 0.05 wt % or less.

An electrostatic chuck includes a base, and includes an electrode embedded in the base in parallel to a substrate mounting surface of the base. A terminal loaded into a terminal hole drilled into a back surface of the base toward the electrode is bonded to the electrode having a protruded portion with a substantially conical trapezoidal shape, which is formed on a flat surface on the terminal side of the electrode toward the terminal hole. In the protruded portion, an angle made by the flat surface on the terminal side of the electrode and an inclined surface of the protruded portion is 40&#xb0; or less, and a distance from the flat surface of the electrode to a terminal-bonding surface of the protruded portion is 0.01 to 0.8 mm.

Electrostatic chuck and manufacturing method thereof

An alumina sintered body comprises an alumina substrate having a first main surface and a second main surface opposing each other, an embedded film electrode made of a metal and embedded in the alumina substrate at a depth Hof 0.4 mm or less from a first main surface SF, and an embedded terminal formed of a metal, embedded in the alumina substrate nearer a second main surface SFside than the embedded electrode. The embedded terminal is in contact with the embedded electrode and a film thickness Hof the embedded electrode is 25 &#x3bc;m or less.

Alumina sintered body

A corrosion-resistant member, which is exposed to a corrosive environment is provided. The corrosion-resistant member is made of a corrosion-resistant material that contains at least one of an oxide of calcium and aluminum, and a calcium aluminum oxide. The corrosion-resistant material includes a rare earth element in an amount of less than 5 wt %.

Corrosion-resistant member and producing method thereof

An aluminum nitride substrate comprises a planar sintered aluminum nitride body containing carbon including free carbon and a substantially planar electrode buried in the sintered aluminum nitride body. The sintered aluminum nitride body includes a work mounting portion for placing a work thereon and a base layer having the electrode buried therein. The average concentration of free carbon in the work mounting portion different from the average concentration of free carbon in the base layer.

Aluminum nitride substrate and production method

An object of the present invention is to provide a ceramic susceptor for considerably reducing the count number of metal atoms on the surface of a semiconductor after the semiconductor is treated, specifically to 1&#xd7;10atoms/cmor lower. It is provided a ceramic susceptorhaving a face for mounting semiconductorwherein each of metal elements other than metal element(s) constituting the ceramic material has a count number of 1&#xd7;10atoms/cmor lower. It is further provided a method of cleaning a ceramic susceptorhaving a facefor mounting semiconductor, wherein the susceptor is cleaned using a complexing agent capable of forming a complex with a metal element.

Ceramic susceptor and a method of cleaning the same

An object of the present invention is to provide a joined structure effective for preventing crack formation after thermal cycles. The joined structure has a ceramic member, a metal memberto be joined, and a metal fixed memberfixed to the ceramic memberand having an exposed faceexposed along the joining faceof the ceramic member. A joining layeris provided between the ceramic memberand the metal memberand between the exposed faceof the fixed memberand the metal member. The joining layerhas thicker and thinner portionsand. Alternatively, the joining layerhas a maximum thickness of 0.15 mm or more.

Joined structures of ceramics

A bonding member is provided, including, a ceramic member having a concave portion, a metal member having a convex portion corresponding to the concave portion of the ceramic member. A first bonding material joins a bottom portion of the concave portion of the ceramic member and a tip portion of the convex portion of the metal member. The first bonding material has a porous structure, including particles and a brazing filler metal, and covers a corner between tip and side portions of the metal member. A second bonding material including a brazing filler metal joins the side portion of the concave portion of the ceramic member and the side portion of the convex portion of the metal member.

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Nagoya, Japan

Akiyoshi Hattori