Seiko Epson Corporation

Sony Corporation

Sony Semiconductor Solutions Corporation

Akiyoshi Aoyagi

Katsuhiro Tomoda

Ken Kikuchi

Toshihiko Watanabe

Gyongsok Song

Masato Doi

Hirokazu Nakayama

Masaru Fujii

Hiroshi Asami

Hiizu Ohtorii

Masakuni Shiozawa

Yoshimichi Harada

Masami Okita

Yoichi Ohshige

Eizo Okamoto

Norifumi Hoshino

Toshihiro Sawamoto

Hirohisa Nakayama

Makio Iida

Shiro Sato

A mounting substrate according to an embodiment of the present technology includes: a wiring substrate (); a plurality of light-emitting elements () arranged in a matrix on the wiring substrate; and a plurality of drive ICs () that are arranged in a matrix on the wiring substrate, and control light emission of the light-emitting elements. The light-emitting elements and the drive ICs are mounted on a same surface. The wiring substrate includes a plurality of first wiring lines () on a mounting surface where the light-emitting elements and the dive ICs are mounted. The first wiring lines electrically couple the light-emitting elements to the drive ICs.

Mounting substrate and electronic apparatus

Provided is a display device and an electronic apparatus that prevent the occurrence of failure in the connection between a mounting substrate and an electronic component. The display device includes an interconnection layer provided on a support substrate, a plurality of insulating layers provided above the interconnection layer, an opening provided in parts of the insulating layers, and a metal layer electrically connected to the interconnection layer and filling the opening up to a height below a layer surface of the insulating layer.

Display device and electronic apparatus

A mounting substrate according to an embodiment of the present technology includes: a wiring substrate (); a fine L/S layer () formed in contact with a top surface of the wiring substrate; and a plurality of elements () arranged in a matrix on a top surface of the fine L/S layer. The wiring substrate includes a plurality of first wiring lines (SigB, Gate), and a plurality of vias () arranged at a period corresponding to an integral multiple of an arrangement period of the plurality of element, and two or more of the vias are provided for each of the first wiring lines. Two or more adjacent ones of the elements on the fine L/S layer are electrically coupled to common one of the vias through one or more second wiring lines ().

A mounting substrate according to an embodiment of the present technology includes: a wiring substrate (); a plurality of light-emitting elements () arranged in a matrix on the wiring substrate; and a plurality of drive ICs () that are arranged in a matrix on the wiring substrate, and control light emission of the light-emitting elements. The light-emitting elements and the drive ICs are mounted on a same surface. The wiring substrate includes a plurality of first wiring lines () on a mounting surface whre the light-emitting elements and the dive ICs are mounted. The first wiring lines electrically couple the light-emitting elements to the drive ICs.

To provide a display body device and a display apparatus that allow for improvement of an electrostatic withstanding voltage, a display body deviceE includes: a wiring substrate; a light-emitting elementand a drive ICthat are disposed on the wiring substrate; and a wiring patternthat is disposed on an outermost side, and is at least partially exposed and has a potential equal to a ground of each of the light-emitting elementand the drive IC

Display body device and display apparatus with improved electrostatic withstanding voltage

When display panels are arranged to form a tiled-type display apparatus, the precision of the spaces between adjacent display panels is to be increased, and display quality is to be enhanced. A display apparatus includes display panels and space forming members. Pixels are arranged on the display panels. Space forming members are disposed between a display panel and a display panel, and form a space between the display panels. As spaces are formed by the space forming members, the spaces between the display panels are prevented from changing. Thus, appearances of joints are also prevented.

Display apparatus, display module, and display member

There is provided a mounting substrate that makes a seam more inconspicuous when a plurality of mounting substrates are tiled, and an electronic apparatus including the mounting substrate. The mounting substrate includes a wiring substrate, a plurality of pixels () arranged in a matrix in a pixel region of the wiring substrate, and a plurality of drivers (A) that are disposed in the pixel region and select the pixels in units of two or more pixels. Each of the pixels includes an optical element that emits or receives light, and a pixel circuit that controls light emission or light reception of the optical element. One or more of the plurality of drivers are assigned to each pixel row or every plurality of pixel rows.

A purpose of the present disclosure is to provide an optical unit that is capable of effectively sealing one or a plurality of optical devices even without a special material, a special structure, etc. In an optical unit of the present disclosure, the sealing section () includes: a circular seal section () surrounding one or a plurality of optical devices () on a wiring substrate from an in-plane direction of the wiring substrate; and an inside filling section () with which inside of the seal section () is filled and that seals the one or plurality of optical devices (). The optical devices () are each a light emitting unit, a light receiving device, an image sensor, an X-ray sensor, or a power generating device. The seal section () and the inside filling section () are each configured of a cured thermosetting resin. The inside filling section () has light transmittance that is higher than light transmittance of the seal section (). The inside filling section () has a modulus of elasticity that is smaller than a modulus of elasticity of the seal section ().

Method for manufacturing an optical unit and electronic apparatus

A purpose of the present invention is to provide an optical unit that is capable of effectively sealing one or a plurality of optical devices even without a special material, a special structure, etc. In an optical unit of the present invention, the sealing section () includes: a circular seal section () surrounding one or a plurality of optical devices () on a wiring substrate from an in-plane direction of the wiring substrate; and an inside filling section () with which inside of the seal section () is filled and that seals the one or plurality of optical devices (). The optical devices () are each a light emitting unit, a light receiving device, an image sensor, an X-ray sensor, or a power generating device. The seal section () and the inside filling section () are each configured of a cured thermosetting resin. The inside filling section () has light transmittance that is higher than light transmittance of the seal section (). The inside filling section () has a modulus of elasticity that is smaller than a modulus of elasticity of the seal section ().

Optical unit and electronic apparatus

A display panel includes: a mounting substrate including light-emitting elements that are mounted for each pixel on a wiring substrate, in which the light-emitting elements have different luminescence wavelengths from each other; and a counter substrate provided in opposition to a surface, of the mounting substrate, on which the pixels are disposed, and including a light-shielding layer and a light diffusion layer. The light-shielding layer is provided on a surface, of a light transmissive substrate, that faces the pixels and has apertures at respective positions that face the light-emitting elements. The light diffusion layer blocks up the apertures, is provided on a surface, of the light-shielding layer, that faces the pixels, is at least in contact with end edges of the respective apertures, and forms a gap together with the light-emitting elements between the light diffusion layer and the light-emitting elements.

Display panel and display unit

A mounting substrate includes: a wiring substrate; and a plurality of optical elements mounted on a mounting surface of the wiring substrate, and each having a first electrode and a second electrode. The wiring substrate includes a support substrate, a plurality of first wires, and a plurality of second wires. The first wires and the second wires are provided within a layer between the support substrate and the mounting surface. The first wires are electrically connected with the first electrodes. The second wires are electrically connected with the second electrodes, and each have cross-sectional area larger than cross-sectional area of each of the first wires.

Mounting substrate and optical unit

A mounting board includes two or more metal layers including the outermost metal layer, and a plurality of metal portions, both of which are formed on a substrate. The plurality of metal portions are formed between a first metal layer of the two or more metal layers and a second metal layer of the two or more metal layers, the first metal layer being the outermost metal layer and the second metal layer being different from the outermost metal layer. The second metal layer includes a plurality of first wiring layers extending in a first direction in a plane. The first metal layer is arranged in zigzags in a second direction intersecting with the first direction and includes a plurality of contact pads connected correspondingly to the plurality of first wiring layers through the metal portions.

Mounting board and display device

Disclosed herein is a substrate with chip mounted thereon, including: a solder pattern having a plan-view shape in which projected parts are projected radially from a central part; and a chip fixed in the state of being aligned to the central part of the solder pattern.

Substrate with chips mounted thereon, method of manufacturing substrate with chips mounted thereon, display, and method of manufacturing display

Herein disclosed an electronic component having a passivation layer in which an opening that exposes a part of a pad electrode is formed, an underlying metal layer formed on the pad electrode and the passivation layer, and a barrier metal layer formed on the underlying metal layer for an external connection electrode, the electronic component including a recess or/and a projection configured to be provided under the barrier metal layer outside or/and inside the opening, the underlying metal layer being formed on the recess or/and the projection and having a surface shape that follows the recess or/and the projection.

Electronic component, semiconductor device employing same, and method for manufacturing electronic component

A method of manufacturing a semiconductor device includes: forming a protective film including an opening on a wiring board having an interconnect pattern so that the protective film has an uneven surface and a part of the interconnect pattern is exposed in the opening; and mounting a semiconductor chip including an electrode on the wiring board so that the part of the interconnect pattern exposed in the opening faces and is electrically connected with the electrode. The protective film is formed so that a recess of the uneven surface does not pierce the protective film.

Growing community of inventors

Kanagawa, Japan

Akiyoshi Aoyagi