Hitachi, Ltd.

Hitachi Displays, Ltd.

Panasonic Liquid Crystal Display Co., Ltd.

Hitachi Consumer Electronics Co., Ltd.

Showa Denko Materials Co., Ltd.

Hitachi Automotive Systems, Ltd.

Resonac Corporation

Akitoyo Konno

Ikuo Hiyama

Tsunenori Yamamoto

Makoto Tsumura

Tatsuki Inuzuka

Daisuke Kajita

Hiroshi Sasaki

Katsumi Kondo

Yoshifumi Sekiguchi

Yoshinori Aono

Takashi Naito

Hiroki Kaneko

Yuka Utsumi

Tatsuya Miyake

Taigo Onodera

Yasushi Tomioka

Toshiaki Tanaka

Makoto Abe

Shingo Ishihara

Eiichi Ide

Shinichi Tachizono

Yuji Hashiba

Shinichi Komura

Masaya Adachi

Osamu Ito

Mutsuhiro Mori

Yoshiyuki Kaneko

Yoshiro Mikami

Haruo Akahoshi

Yasutaka Toyoda

Tatsuya Sugita

Hironori Suzuki

Toshiaki Ishii

Shoichi Hirota

Akihiro Miyauchi

Takuya Aoyagi

Masatoshi Wakagi

Toshiaki Morita

Takashi Ando

Hitoshi Taniguchi

Toru Masuda

Yutaka Akiba

Motomune Kodama

Shinji Sugimoto

Kaoru Katayama

Maki Ito

Norihiro Uemura

Masaru Kamoshida

Kei Yoshimura

Katsunori Azuma

Shigeru Kikuchi

Hideto Yoshinari

Tetsuya Ooshima

Susumu Edo

Masato Saito

Takeshi Miitsu

Kiyomi Nakamura

Masaharu Matsuura

Katsunari Sato

Tomokazu Tanase

Takahiro Ikabata

Takashi Nogawa

Hiroshi Houzouji

Keita Yuguchi

The present invention provides a highly reliable multilayered glass panel and an encapsulating material for achieving the highly reliable multilayered glass panel. The encapsulating material includes lead-free low melting glass particles containing vanadium oxide and tellurium oxide, low thermal expansion filler particles, and glass beads as a solid content. A volume fraction of the glass beads in the solid content is not less than 10% to not more than 35%, and a volume fraction of the lead-free low melting glass particles in the solid content is larger than a volume fraction of the low thermal expansion filler in the solid content.

Sealing material and multilayered glass panel using same

Provided is a box-type vehicle-mounted control device that effectively increases the amount of heat transfer from electronic components and a circuit board to a casing (base and cover) and that accordingly has achieved excellent heat dissipation property. The box-type vehicle-mounted control device includes a circuit board, a base, and a cover. In addition, a first heat radiating coating layeris formed on at least one surface of the circuit board, and a second heat radiating coating layeris formed on an inner surface of one or both of the baseand the coverfacing the first heat radiating coating layer

Box-type vehicle-mounted control device

The lead-free glass composition contains vanadium oxide, tellurium oxide, alkali metal oxide, iron oxide, barium oxide, and tungsten oxide while containing substantially no phosphorus oxide, and further contains at least one of additional components including yttrium oxide, lanthanum oxide, cerium oxide, erbium oxide, ytterbium oxide, aluminum oxide, and gallium oxide. A content of the tellurium oxide is equal to or more than 25 mol %, and equal to or less than 43 mol % in terms of oxide TeO. A content of the alkali metal oxide is equal to or more than 4 mol %, and equal to or less than 27 mol % in terms of oxide RO (R: alkali metal element).

Lead-free glass composition, and glass composite material, glass paste, and sealing structure body containing the same

An object of the invention is to provide a power converter that can be reduced in size. To achieve this, a power converter according to the invention includes: water passages arranged radially from an assumed central axis, each being trapezoid-shaped in cross section; and power modules placed between the water passages such that each of the power modules is sandwiched from both surfaces thereof by the water passages. Each of the power modules has an output terminal and positive and negative terminals on an end face located in a centrifugal direction side with respect to the assumed central axis. Any of the power modules and an adjacent one of the power modules are set in a front-back inverted manner.

Power converter having water passages for cooling power modules

Provided is a semiconductor device with high reliability. In order to solve the above problems, according to the present invention, the semiconductor device includes a heat dissipating substrate, an insulating substrate arranged on the heat dissipating substrate and having a wiring layer, a plurality of semiconductor elements arranged on the insulating substrate, a conductive block electrically connected to a front surface electrode of the semiconductor element, and a terminal electrode, in which the conductive block has a convex portion, and the convex portion is bonded to the insulating substrate.

Semiconductor device

A heat-dissipating structure is formed by bonding a first member and a second member, each being any of a metal, ceramic, and semiconductor, via a die bonding member; or a semiconductor module formed by bonding a semiconductor chip, a metal wire, a ceramic insulating substrate, and a heat-dissipating base substrate including metal, with a die bonding member interposed between each. At least one of the die bonding members includes a lead-free low-melting-point glass composition and metal particles. The lead-free low-melting-point glass composition accounts for 78 mol % or more in terms of the total of the oxides V2O5, TeO2, and Ag2O serving as main ingredients. The content of each of TeO2 and Ag2O is 1 to 2 times the content of V2O5, and at least one of BaO, WO3, and P2O5 is included as accessory ingredients, and at least one of Y2O3, La2O3, and Al2O3 is included as additional ingredients.

Heat-dissipating structure and semiconductor module using same

A first conductive pattern includes: a first feeding point for supplying a potential to the first conductive pattern located at one end thereof; one or more diode elements located over the first conductive pattern; and a plurality of switching elements over the first conductive pattern on the opposite side to the first feeding point with the diode elements in between. A second conductive pattern includes a second feeding point that is provided in proximity to the first feeding point and supplies a potential different from that for the first conductive pattern to the second conductive pattern. The plurality of the switching elements is electrically connected with the second conductive pattern through a plurality of bonding wires. The second conductive pattern is provided with a slit pattern that defines an area of connection of the plurality of the bonding wires with the second conductive pattern over the second conductive pattern.

Power transistor module

An object of the present invention is to provide a semiconductor module that can improve the dissipation of heat from semiconductor elements toward a cooling body. A semiconductor module of the present invention includes a plurality of resin-molded semiconductor devices that are mounted on a single metal base and are electrically connected. The plurality of semiconductor devices each have a structure in which a metal heat dissipation plate, which is formed on a surface of an insulating substrate on the side opposite to a semiconductor-element-mount surface, is exposed from a resin mold, and the metal heat dissipation plate is embedded in each opening provided in the metal base, so that the rear surface of the metal heat dissipation plate becomes a plane to be disposed on a cooling body.

Semiconductor module having an embedded metal heat dissipation plate

An adhesive sheetincluding a binderand adhesive particlesmixed in the binderin which the adhesive particleincludes an inorganic particleand a polymer, the inorganic particleis chemically bonded with the polymer, a portion of the adhesive particlesis exposed to the surface of the binder, the refractive index of the inorganic particleis higher than the refractive index of the binder, and the adhesion of the adhesive particlelarger than the adhesion of the inorganic particle. An adhesive sheet having high refractive index and high adhesion, as well as an optical member and an organic member and an organic light emission device can be provided.

Adhesive sheet, as well as optical member and organic light emission device using the same

An organic light-emitting device including a first substrate, a second substrate, a light drawing-out layer disposed between the first substrate and the second substrate, a transparent electrode disposed between the light drawing-out layer and the first substrate, a reflection electrode disposed between the transparent electrode and the first substrate, and a first light-emitting unit disposed between the transparent electrode and the reflection electrode. The first light-emitting unit includes a first light-emitting layer that emits a first light-emitting color. In the organic light-emitting device, relations of the equation L&#x2267;&#x3bb;/4 and the equation Lcos &#x3b8;=&#x3bb;(&#xbc;+n/2) are satisfied, wherein Lis an optical length from a light-emitting point in the first light-emitting layer to the reflection electrode, &#x3bb;is a wavelength at the longer wavelength side, having an intensity of 1% of the maximum intensity of a light-emitting spectrum of the first light-emitting color, &#x3bb;is a wavelength at the shorter wavelength side, having an intensity of 1% of the maximum intensity of the light-emitting spectrum of the first light-emitting color, n is an integer not less than 0, and 0 &#x3c;&#x3b8;&#x2266;60.

Organic light-emitting device and light source apparatus using same

A power semiconductor device is provided in which reliability can be improved when the parallel number of semiconductor devices increases. When a bonding face on collector electrode is on an upper side, and a bonding face on emitter electrode is on a lower side, a collector electrode joint region as a joint region between a collector trace and a collector electrode on a chip mounted substrate and an emitter electrode joint region as a joint region between an emitter trace and an emitter electrode are located at a same position in an up-and-down direction and are adjacent in a right-and-left direction at an interval of 2 mm or more and 4 mm or less.

Power device having a specific range of distances between collector and emitter electrodes

An organic light-emitting diode in accordance with the present invention includes: a reflective electrode; an organic layer formed on the reflective electrode; a transparent electrode formed on the organic layer; a transparent resin layer formed on the transparent electrode; and an encapsulation glass formed on the transparent resin layer. The organic layer includes a light-emitting point. Cone- or pyramid-shaped transparent resin structures are provided in the transparent resin layer in such a manner that each of the cone- or pyramid-shaped transparent resin structures splays from the transparent resin layer toward the encapsulation glass in a normal direction of the encapsulation glass. A refractive index of the transparent resin layer is 1.3 times or more to 1.6 times or less as high as that of the cone- or pyramid-shaped transparent resin structures.

Organic light-emitting diode and light source device including same

In a liquid crystal display device and a video display device using the same, for suppressing light unevenness at the end of a display region, the video display device is provided with a liquid crystal display device and a housing configured to support the liquid crystal display device, wherein the liquid crystal display device includes a liquid crystal panel, a first frame and a liquid crystal support member which interpose the liquid crystal panel therebetween, a light guide plate which is disposed at the liquid crystal support member on a side opposite to a side where the liquid crystal panel is disposed, and a light source which is disposed at a side surface of the light guide plate, and wherein a cushion member is disposed between the liquid crystal support member and the light guide plate.

Liquid crystal display device and video display device using the same

A liquid crystal display apparatus includes a white color light source and a coloring light source, a detection circuit which detects a brightness of an input image signal, an image quality processing calculation circuit, a light source control circuit, and an image control circuit. The coloring light source includes a blue light source. The image quality processing calculation circuit outputs to the light source control circuit a light source control signal for (1) increasing a light intensity of the coloring light source when an average luminance of the input image signal is detected to be higher than a predetermined luminance based on a detection result of the detection circuit, and for (2) turning-on only the white color light source without turning-on the coloring light source when the average luminance of the input image signal is detected to be lower than the predetermined luminance.

Liquid crystal display apparatus capable of maintaining high color purity

A lighting system has light-emitting diodes as light sources mounted on a circuit board, in which the light-emitting diodes include a red light-emitting diode, blue light-emitting diode and a green light-emitting diode, the light-emitting diodes are constituted of one single unit including one for each of the red, blue and green light-emitting diodes, and the one single unit is repeatedly arranged as plural pieces on the same circuit board, and each of the red, blue and green light-emitting diodes is individually connected electrically to emit a light.

Lighting system and liquid crystal display using the same

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Hitachi, Japan

Akitoyo Konno