Tdk Corporation

Akitoshi Yoshii

Hideki Kaneko

Shinya Ito

Atsushi Takeda

Norihisa Ando

Toshihiro Iguchi

Taisuke Ahiko

Kazuyuki Hasebe

Akihiro Masuda

Kenya Tamaki

Akira Goshima

Takashi Kamiya

Tatsuya Kojima

Katsumi Kobayashi

Satoshi Takagi

Sunao Masuda

Shinya Onodera

Kazushige Ito

Takashi Aoki

Kazuhiko Kikuchi

Makoto Takahashi

Akira Sato

Masaaki Togashi

Akira Sasaki

Ken Aburakawa

Masayuki Okabe

Takaki Shinkawa

Shirou Ootsuki

Takashi Komatsu

Takaaki Sato

Naruki Kataoka

Kayou Kusano

Kyohei Takata

Hiromi Kikuchi

Kenichi Inoue

Masanori Yamamoto

Ken Morita

Takehisa Tamura

Kouji Tanaka

Yuichi Nagai

Yoshiki Satou

Yutaka Miura

Tomohiro Sogabe

Hideki Yokoyama

Yasushi Izumibe

Yasuhiro Okui

Shintarou Kon

Keiko Kubo

Hiroki Saitoh

Tooru Suda

Tsuyoshi Takashima

Masumi Miyairi

Akio Kikuchi

Miki Kimura

Hiroki Houchi

Masauki Okabe

Kazuharu Satoh

Toshiki Otsuki

Nobutaka Kai

Satoru Kindaichi

Natsumi Kato

Takai Shinkawa

An electronic component including a case including an accommodation part having an opening; a ceramic element arranged in the accommodation part; a metal terminal including an electrode connecting part connecting to the ceramic element, a mounting part exposed out of the accommodation part, and a terminal arm part connecting the electrode connecting part and the mounting part; a case cover including a closing plate part covering the opening, and a case cover lateral side portion extending in a depth direction of the accommodation part from a circumference of the closing plate part and at least partially facing against an accommodation side wall of the accommodation part; and a mold resin filling the accommodation part.

Electronic component including accommodation part having opening

The electronic device includes: a case including a recessed portion and an opening edge portion of the recessed portion; a ceramic element arranged in the recessed portion, having a first main surface and a second main surface facing each other, and including a first electrode portion formed on the first main surface and a second electrode portion formed on the second main surface; a first metal terminal including a first mounting portion, arranged in the opening edge portion and approximately horizontal with respect to the first main surface and the second main surface, and a first electrode connection portion connected to the first electrode portion; and a second metal terminal including a second mounting portion, arranged in the opening edge portion and approximately horizontal with respect to the first main surface and the second main surface, and a second electrode connection portion connected to the second electrode portion.

Electronic device with a ceramic element and surface-mount terminals

An electronic device includes a case, a ceramic element, a first metal terminal, and a second metal terminal. The case includes a recess and a case lower surface facing opposite to its opening. The ceramic element is disposed in the recess and includes first and second main surfaces opposing to each other, a first electrode portion formed on the first main surface, and a second electrode portion formed on the second main surface. The first metal terminal includes a first mounting portion disposed on the case lower surface and being substantially parallel to the first and second main surfaces and a first electrode connection portion connected to the first electrode portion. The second metal terminal includes a second mounting portion disposed on the case lower surface and being substantially parallel to the first and second main surfaces and a second electrode connection portion connected to the second electrode portion.

Electronic device having first and second metal terminals

An electronic device includes: a ceramic element including a first electrode portion and a second electrode portion; a first metal terminal including a first external connection portion and a first electrode connection portion connected to the first electrode portion through solder; and a second metal terminal including a second external connection portion and a second electrode connection portion connected to the second electrode portion through solder. The first electrode connection portion includes a first solder stopper formed by undulation of at least a part of a facing surface of the first electrode connection portion facing the first electrode portion to control a range of an adhesion region of solder to the first electrode portion. The second electrode connection portion includes a second solder stopper that is formed by undulation of at least a part of a facing surface of the second electrode connection portion facing the second electrode portion.

Electronic device having ceramic element and metal terminals

Each of a plurality of internal electrodes is electrically connected to a corresponding external electrode of a plurality of external electrodes. A plurality of auxiliary internal electrodes are disposed in the same layer as the plurality of internal electrodes to be located between each of a pair of side surfaces and the plurality of internal electrodes. Each of the plurality of external electrodes includes a pair of side surface electrode portions disposed on the pair of side surfaces and including a conductive resin layer. Each of the plurality of auxiliary internal electrodes is electrically connected to the external electrode to which the internal electrode located in the same layer is not electrically connected, and is located between the conductive resin layer to which the internal electrode located in the same layer is not electrically connected and the internal electrode located in the same layer.

Electronic component

An electronic component having a case including an accommodation part having an opening; a ceramic element in the accommodation part with first and second main faces facing each other, a first and second electrode formed to the first and second main face, respectively; a first metal terminal including a first electrode connecting part connecting to the first electrode, a first mounting part exposed out of the accommodation part through the opening, and a first terminal arm part connecting the first electrode connecting part and the first mounting part; a second metal terminal including a second electrode connecting part connecting to the second electrode, a second mounting part exposed out of the accommodation part through the opening, and a second terminal arm part connecting the second electrode connecting part and the second mounting part; and an insulation member between the first electrode and the second terminal arm part.

A plurality of external electrodes are disposed on both ends of an element body. Each of the plurality of external electrodes includes a pair of electrode portions disposed on a pair of side surfaces and including a conductive resin layer. For each of the two conductive resin layers located on the same side surface, one conductive resin layer includes an edge opposing another conductive resin layer. The conductive resin layer includes a first region and a second region. The first region included a plurality of metal particles of a first content and a resin. The second region includes a plurality of metal particles of a second content smaller than the first content and a resin. The second region is located closer to the edge of the conductive resin layer than the first region, and includes the edge of the conductive resin layer.

An external electrode is disposed on an end of the element body in the first direction. The external electrode includes a pair of first electrode portions disposed on the pair of second side surfaces and including a conductive resin layer. Each of the pair of second side surfaces includes a region exposed from the external electrode. An insulating film is disposed on the element body. The insulating film includes film portions disposed on the pair of second side surfaces. Each of the film portions covers an edge of the conductive resin layer and the region of each of the second side surfaces along the edge of the conductive resin layer.

A plurality of electronic elementsare arranged in a second direction Dorthogonal to a first direction Dwhich is a facing direction of external electrodesandforming a pair in the first electronic element groupA and the second electronic element groupB. The first electronic element group SA and the second electronic element groupB are disposed side by side in the first direction D. The first terminalis disposed between the first electronic element groupA and the second electronic element groupB in the first direction D. The second terminalsandare disposed at positions with the first electronic element groupA and the second electronic element groupB respectively interposed between the second terminals and the first terminalin the first direction D

A ceramic electronic component with metal terminals comprising a chip component of approximately parallelepiped shape having a pair of terminal electrodes, and a pair of metal terminal parts provided in accordance with the terminal electrodes. The terminal electrode is formed by wrapping around a part of side faces from an end face of the chip component. The metal terminal part comprises a connecting part connecting to the terminal electrode and including a connecting face extending approximately parallel to the end face, plurality of joint parts connecting to the connecting part and including a joint face extending in a different direction of the connecting face, and plurality of mounting parts connecting to the joint parts and including a mounting part upper face extending approximately parallel to any one of the side faces which is different direction of the joint face by taking predetermined spaces.

Ceramic electronic component with metal terminal

A multilayer ceramic electronic device comprising a lamination in which an internal electrode layerand a dielectric layerare laminated alternatively, wherein the dielectric layeris comprised of a dielectric ceramic composition including a main component represented by a general formula of ABOand a rare-earth component R, and segregation phasesincluding the rare-earth component R are present in the dielectric layer. When the dielectric layeris separated to six areas by dividing the dielectric layersandwiched by a pair of the internal dielectric layersin the thickness direction, there are the R segregation phases present in two neighboring areasrespectively adjacent to the pair of the internal electrode layersin the dielectric layerat a ratio of double or more compared with the R segregation phases present in two central areaslocated at a substantially center in the dielectric layer

Multilayer ceramic electronic device

A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed.

Ceramic electronic component with metal terminals

A ceramic electronic component comprising; including a chip component of approximately rectangular parallelepiped, a first metal terminal portion having a first flat plate portion facing a first end face, at least a pair of first fitting arm portions connected to the first flat plate portion, having a first engagement projection engaging with a first wraparound portion holding the first wraparound portion in between, and a first mounting portion connected to the first flat plate portion and extending approximately parallel to one side face, and a second metal terminal portion having a second flat plate portion facing the second end face, at least a pair of second fitting arm portions connected to the second flat plate portion, having a second engagement projection engaging with a second wraparound portion, holding the second wraparound portion in between, and a second mounting portion extending approximately parallel to one side face.

Ceramic electronic component

Dielectric ceramic composition comprising a compound shown by a general formula {A(RE)}-BOand has a tungsten bronze-type structure. In the formula, 'A' is at least one selected from a group comprising Ba, Ca, Sr and Mg, 'B' is at least one selected from Nb and Ta, &#x201c;RE&#x201d; is at least one selected from Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, and said &#x201c;x&#x201d; and &#x201c;y&#x201d; satisfies 0&#x3c;x&#x3c;1 and y&#x3c;1.000, respectively. The dielectric ceramic composition further comprises an oxide of at least one selected from V, Mo, Fe, W, Mn and Cr.

Dielectric ceramic composition and electronic device

A dielectric ceramic composition comprising a compound shown by a general formula {A(RE)}-DOhaving tungsten bronze-type structure and an oxide of 'M'. 'A' is at least one selected from Ba, Ca, Sr and Mg, &#x201c;D&#x201d; is at least one selected from Nb and Ta, &#x201c;RE&#x201d; is at least one selected from Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, &#x201c;x&#x201d; and &#x201c;y&#x201d; satisfies 0&#x3c;x&#x3c;1 and y&#x3e;0, respectively and said &#x201c;M&#x201d; is at least one selected from Al, Si, B and Li. It is preferable to further comprise Mg oxide.

Growing community of inventors

Tokyo, Japan

Akitoshi Yoshii