Denso Corporation

Nippon Soken, Inc.

Akitoshi Yamanaka

Jun Kondo

Tooru Taguchi

Tetsuo Fujii

Ryuichiro Abe

Minekazu Sakai

Hisanori Yokura

Fumiaki Arikawa

Yasuyuki Okuda

Shoichi Yamauchi

Hirofumi Higuchi

Tomoki Fujino

Teruo Oda

Masaki Matsui

Kiyonari Kojima

Daiji Ueda

Hideo Naruse

Hiroki Tanada

Kunihiro Onoda

Hisayoshi Ohshima

Ichiharu Kondoh

Yoshio Nakajima

Toshifumi Izumi

Tadao Ooka

A fuel injection system for use with an internal combustion engine supplies fuel to an injector (fuel injection valve) from a common rail (accumulator) through a high-pressure pipe to spray the fuel from a spray hole formed in the injector. A thin-walled portion is formed in a path member (e.g., an injector body, the high-pressure pipe, or a connector connecting the injector and the high-pressure pipe) and defined by a locally thin wall of the path member. A strain gauge (strain sensor) is affixed to the thin-walled portion to measure strain of the thin-walled portion arising from the pressure of fuel in a high-pressure fuel path.

Fuel pressure measuring device, fuel pressure measuring system, and fuel injection device

It is equipped with an injector bodywhich has formed therein high-pressure paths, andthrough which high-pressure fuel flows to a spray hole and stores therein a piezo-actuator(i.e., an opening/closing mechanism) and a back-pressure control mechanism(i.e., an opening/closing mechanism) which open or close the spray hole, a stem(i.e., an elastic body) which is installed in said bodyand elastically deformed when subjected to pressure of the high-pressure fluid, and a strain gauge(i.e., a sensing device) which converts the degree of strain occurring at the steminto an electric signal and outputs it as a measured-pressure signal. Specifically, the stain gaugeis installed on the stemthat is constructed as being separate from the body

Fuel injection valve and fuel injection device

It is equipped with an injector bodywhich has formed therein high-pressure paths, andthrough which high-pressure fuel flows to a spray hole and stores therein a piezo-actuator(i.e., an opening/closing mechanism) and a back-pressure control mechanism(i.e., an opening/closing mechanism) which open or close the spray hole, and a fuel pressure sensorinstalled in the bodyto measure the pressure of the high-pressure fuel. The bodyhas formed therein a branch pathdiverging from the high-pressure pathsandto deliver the high-pressure fuel to the fuel pressure sensor

An oscillating angular speed sensor includes a detector, a driving portion, and a separating portion. When an angular speed is generated while the detector is driven to oscillate by the driving portion, Coriolis force is applied to the detector. Therefore, the angular speed is detected based on a capacitance variation in accordance with a variation of an interval between a movable electrode and a fixed electrode of the detector. The separating portion is distanced from the detector and the driving portion, and is configured to separate a first space accommodating the detector and a second space accommodating the driving portion.

Oscillating angular speed sensor

A semiconductor device includes: a sensor including a sensor structure on a first side of the sensor and a periphery element surrounding the sensor structure; and a cap covering the sensor structure and having a second side bonded to the first side of the sensor. The cap includes a first wiring layer on the second side of the cap. The first wiring layer steps over the periphery element. The sensor further includes a sensor side connection portion, and the cap further includes a cap side connection portion. The sensor side connection portion is bonded to the cap side connection portion. At least one of the sensor side connection portion and the cap side connection portion provides an eutectic alloy so that the sensor side connection portion and the cap side connection portion are bonded to each other.

Semiconductor device and method for manufacturing the same

A fuel injector which may be employed in injecting fuel into an internal combustion engine. The fuel injector includes an injector body and a head body formed to be separate from the injector body. The head body has installed therein a fuel pressure sensor working to measure the pressure of fuel in the fuel injector and is joined detachably to the injector body. The fuel injector alternatively includes an injector body and a fuel pressure-sensing unit equipped with a fuel pressure sensor. The fuel pressure-sensing unit is installed detachably on the injector body. This structure provides enhanced productivity of the fuel injector and facilitate the ease of replacement of the fuel pressure sensor.

Fuel injector with fuel pressure sensor

An ultrasonic sensor includes a transmitting device, receiving devices arranged in an array, and a circuit device. One receiving device is configured as a reference receiving device. The circuit device includes a reference signal generator and first and second synchronous detectors. The reference signal generator generates a reference signal by using a received signal of the reference receiving device. The first synchronous detector performs synchronous detection of a received signal of one of the receiving devices based on the reference signal to detect a distance to an object. The second synchronous detector performs synchronous detection of received signals of the receiving devices except the reference receiving device based on the reference signal to detect a direction of the object.

Ultrasonic sensor with piezoelectric elements and vibration isolator

A fuel pressure sensor/sensor mount assembly in which a fuel pressure sensor is so mounted as to exposed to a high-pressure fuel path through which fuel is supplied to a fuel injector, a fuel injection apparatus equipped with a built-in fuel pressure sensor, and a pressure sensing apparatus working to measure the pressure of fuel in a fuel injector are provided. The fuel pressure sensor/sensor mount assembly is disposed between the high-pressure fuel path and the fuel injector, thus permitting the size of the fuel injector to be minimized without sacrificing the accuracy in measuring the pressure of the fuel. The fuel injection apparatus and the a pressure sensing apparatus are designed to ensure desired accuracy in measuring the pressure of the fuel.

Fuel pressure sensor/sensor mount assembly, fuel injection apparatus, and pressure sensing apparatus

A semiconductor sensor is disclosed that includes a semiconductor substrate, a sensing portion provided on the semiconductor substrate, and a pad in electrical communication with the sensing portion and provided on the semiconductor substrate. The semiconductor sensor also includes a bonding wire in electrical communication with the pad. Furthermore, the semiconductor sensor includes a cover member with a covering portion disposed over the semiconductor substrate for covering the sensing portion such that the covering portion is separated at a distance from the sensing portion. The cover member further includes a coupling portion provided on the semiconductor substrate at an area including the pad and for enabling electrical connection of the pad with the bonding wire therethrough.

Semiconductor sensor and manufacturing method therefor

A sensor includes: a semiconductor chip having a sensing portion and a first bump; a circuit chip having a second bump; and a resin film having a groove. The semiconductor chip and the circuit chip are integrated with sandwiching the resin film therebetween. The resin film includes a first space and a second space before the first bump is bonded to the second bump. The first space faces the sensing portion. The second space is disposed on a periphery of the first space. The resin film expands when the first bump is bonded to the second bump. The second space accommodates an expanded portion of the resin film. The first space provides the groove after the first bump is bonded to the second bump.

Physical quantity sensor, method for manufacturing the same, and resin film for bonding semiconductor chip and circuit chip

Before a semiconductor substrate and a base substrate is directly bonded to one another, in a protective film removing step, a contamination protective film formed on the semiconductor substrate to protect it from contamination during an ion implanting step is removed. Consequently, even when flatness of the contamination protective film is degraded during the ion implanting step or even when contaminants remain in a segregated state in the vicinity of the surface of the contamination protective film, the state of the bonding between the semiconductor substrate and the base substrate after the bonding step can be made uniform over the entire area of the bonding. As a result, a high-quality semiconductor substrate can be manufactured at low cost.

Growing community of inventors

Hekinan, Japan

Akitoshi Yamanaka