Hitachi Chemical Company, Ltd.

Akitoshi Tanimoto

Hiroshi Matsutani

Shingo Tahara

Yu Aoki

Shigeru Nobe

Kei Kasuya

Takumi Ueno

Shigeki Katogi

Ken Nanaumi

Yukihiko Yamashita

Alexandre Nicolas

Kouichi Abe

The invention provides a photosensitive resin composition comprising (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound that generates an acid by light, and (C) an acrylic resin having a group that crosslinks with the component (A), as well as a method for manufacturing a patterned cured film, and an electronic component prepared therewith.

Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component

Disclosed is a photosensitive resin composition comprising (A) an alkali-soluble resin having a structural unit represented by the following formula (1), (B) a compound that generates an acid by light, (C) a thermal crosslinking agent, and (D) an acryl resin having a structural unit represented by the following formula (2): wherein Rrepresents a hydrogen atom or a methyl group; Rrepresents an alkyl group having 1 to 10 carbon atoms, or the like; and a represents an integer of 0 to 3, b represents an integer of 1 to 3, and the total of a and b is 5 or less, and wherein Rrepresents a hydrogen atom or a methyl group; and Rrepresents a hydroxyalkyl group having 2 to 20 carbon atoms.

Photosensitive resin composition, method for producing patterned cured film, semiconductor element and electronic device

There is provided a photosensitive resin composition containing (A) an alkali-soluble resin, (B) a compound which generates an acid when exposed to light, (C) a thermal crosslinking agent, and (D) a nitrogen-containing aromatic compound represented by the following formula (1): wherein Rrepresents a hydrogen atom or a hydrocarbon group; Rrepresents a hydrogen atom, an amino group or a phenyl group; and A and B each independently represent a nitrogen atom, or a carbon atom and a hydrogen atom bonded thereto.

The positive-type photosensitive resin composition according to the present invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound that produces an acid by light, a thermal crosslinking agent, and a silane compound having at least one functional group selected from an epoxy group and a sulfide group.

Positive photosensitive resin composition, method of creating resist pattern, and electronic component

The positive tone photosensitive composition of the invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound producing an acid by light, a thermal crosslinking agent and an acrylic resin. It is possible to provide a positive tone photosensitive composition that can be developed with an aqueous alkali solution, has sufficiently high sensitivity and resolution, and can form a resist pattern with excellent adhesiveness and thermal shock resistance.

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Hitachi, Japan

Akitoshi Tanimoto