Mitsubishi Gas Chemical Company, Inc.

Borg-warner Chemicals, Inc.

Akitoshi Sugio

Masanobu Masu

Masao Okabe

Eiichi Yonemitsu

Masaharu Kimura

Tomotaka Furusawa

Toshikazu Umemura

Takao Kawaki

Mutsuhiko Takeda

Katsumasa Tanaka

Masatugu Matunaga

Norio Sayama

Akira Amemiya

Akikazu Amagai

Toshihiko Kobayashi

Yukio Sasaki

Hiroyuki Urabe

Tadashi Kunii

Kiyokazu Kawaguchi

Kozo Ishiyama

Chiharu Nishizawa

Katsushige Hayashi

Takanari Nawata

Makoto Mizutani

Keiun Ko

Takeo Suzumori

Akihiko Konishi

Masatsugu Matsunaga

Yoshiharu Ohtsuki

Yoshiharu Otuki

Eiji Ukita

Makoto Kobayashi

Tetsuya Abe

Osamu Kondo

Masahito Watanabe

Akira Ito

Masaki Nagata

Masamichi Mizukami

Michio Ohba

Hidechika Wakabayashi

Tetsuo Tomita

Shizuo Togo

Ryozo Kawai

Isamu Masumoto

Michael K Rinehart

Koichi Nakano

Muneo Ito

Tadashi Shimomura

Kazuharu Ogasawara

Zenpei Mizutani

Tadashi Yoshii

Hidenori Kimpara

Yukiya Masuda

Atsuo Kuramoto

Yoshihiro Ono

William O Dalton

Yoshihiko Sekine

Zempei Mizutani

Atuo Kuramoto

Tsukasa Sawai

Akira Amamiya

Toshikazu Umenura

Takeo Kawaki

Hiroshi Nakai

Tatsuhiko Kurihara

Akio Hasebe

Tamaki Kamimura

Kazuyoshi Taka

A polarizing film comprising a polyvinyl alcohol-type film and a dichroic dye, a metallic ion and boric acid incorporated therein, and a process for producing the same, which comprises adsorbing a dichroic dye on a polyvinyl alcohol-type film, stretching the film substantially in one direction, immersing the stretched film in an aqueous solution containing a metallic ion and boric acid.

Process for producing a polarizing film

A photosensitive polyimide precursor composed of the structural units (A) represented by the following general formula (I) and the structural units (B) represented by the following general formula (II), in which the ratio of the molar quantity of the structural units (A) to the sum of the molar quantity of the structural units (A) and that of the structural units (B) is 0.01 or greater, and having a viscosity of 100 cP or above as measured at 25.degree. C. in the state of a 10% by weight solution in N-methylpyrrolidone: ##STR1## wherein R.sub.1 represents a tetravalent aromatic hydrocarbon residue; R.sub.2 represents a divalent aromatic hydrocarbon residue; X, identical or different represents a halogen or an alkyl group; and m represents 0 or an integer from 1 to 4. The photosensitivity of the present photosensitive polyimide precursor is about 20 to 100 times that of conventional products. After heat dehydration cyclization, it shows a heat resistance of 400.degree. C. or above.

Photosensitive polyimide precursor

A humidity-sensing component composition includes a metallic oxide and a chalcogen oxyacid salt represented by a general formula A.sub.x B.sub.y O.sub.z where A is one of an alkali metal and an alkaline earth metal, B is one of sulphur, selenium, and tellurium, O is oxygen, x is 1 to 2, y 1 to 5, and z 2 to 7. The chalcogen oxyacid salt is blended by an amount of 0.01 to 99.99 mol % in the metallic oxide with the sum of the metallic oxide and the chalcogen oxyacid salt as a reference. The metallic oxide and the chalcogen oxyacid salt are sintered under an atmosphere of molecular oxygen.

Humidity-sensing component composition

A membrane for gas separation which comprises a silylated polyphenylene ether is disclosed. Said silylated polyphenylene ether contains a constituting unit containing an organosilane or siloxane group represented by the following formula in at least a part of the repeating unit thereof: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 each represents a hydrogen atom or a group of the formula --Si(R.sub.5)(R.sub.6)(R.sub.7), wherein R.sub.5, R.sub.6 and R.sub.7 each represents an alkyl group; l and n each represents 0 or an integer from 1 to 3; and m represent an integer of from 1 to 3; with the proviso that R.sub.1, R.sub.2, R.sub.3 and R.sub.4 do not simultaneously represent hydrogen atoms.

Silylated polyphenylene ether membrane for gas separation

A polyphenylene ether resin composition having excellent fire retardancy comprising

Polyphenylene ether resin composition having excellent fire retardancy

The photosensitive polyimide precursor of the invention has a recurring unit represented by the following general formula [I]: ##STR1## (R.sub.1 represents a tetravalent aromatic hydrocarbon residue; R.sub.2 and R.sub.3 each represent a divalent aromatic or aliphatic hydrocarbon residue; and R.sub.4 represents a divalent aromatic hydrocarbon residue represented by ##STR2## wherein R.sub.5, R.sub.6, R.sub.7, R.sub.8, R.sub.9, R.sub.10, R.sub.11 and R.sub.12, identical or different, each represent hydrogen atom, a halogen group or an alkyl group). The photosensitive polyimide precursor of the invention has a viscosity of 50 centipoises or above as measured at 23.degree. C. in the state of a 10% (by weight) solution in N,N-dimethylacetamide. Its photosensitivity is as high as about 20-100 times that of prior products. After heat cyclization, it exhibits a heat resistance of 400.degree. C. or above. The photosensitive polyimide precursor of the invention can be produced by subjecting a tetracarboxylic acid dianhydride and a diamino compound to a polycondensation reaction in an organic polar solvent.

Photosensitive polyimide precursor and process for producing the same

A polyphenylene ether resin composition comprising

Polyphenylene ether resin composition

A polyphenylene ether resin composition containing (A) a polyphenylene ether resin, (B) an aromatic polyester resin, and (C) a phenoxy resin. The resin composition may further contain (D) an unsaturated carboxylic acid or (E) a vinyl copolymer derived from a styrene compound and an alpha,beta-unsaturated dicarboxylic acid anhydride as comonomer components. The resin composition has excellent mechanical strength, solvent resistance, oil resistance and moldability.

Novel polyphenylene ether resin composition

A polyphenylene ether resin composition comprising:

Polyphenylene ether resin composition suitable for electroless plating

A curable resin composition comprising (a) a polyphenylene resin, (b) a maleimide compound and/or a cyanate ester compound and (c) at least one compound selected from the group consisting of compounds having one or more acryloyl, methacryloyl, acryloxy or methacryloxy groups is disclosed. The curable resin composition can give a cured resin having resistance to heat, solvent and moisture and adhering property.

Curable resin composition

Growing community of inventors

Ohmiya, Japan

Akitoshi Sugio