Japan Aviation Electronics Industry, Limited

Akitoshi Sakaue

Yutaka Takezawa

Mitsunori Sato

Yutaro Kogawa

Mitsutoshi Naito

Kenji Matsumoto

Hiroshi Okumura

Yuta Hasegawa

Naoki Iwao

In a gravure plate for wiring printing on which a recessed portion defining a wiring pattern is formed on a plate surface, a projecting portion for reducing a volume of the recessed portion is formed on a bottom surface of the recessed portion. A contour of the projecting portion in cross section parallel to the plate surface has a semicircular arc shape, which protrudes toward one side in one direction that is parallel to the plate surface, on the one side. The recessed portion has a side wall that is composed of a plane orthogonal to the plate surface and faces the projecting portion at a distance of 15 μm or less without coming into contact with the projecting portion. The contour of the projecting portion has a semicircular arc shape, which protrudes toward the side wall, also on a side closer to the side wall.

Gravure plate for wiring printing

In printed wiring that is formed, on a surface of a base member. by a film of cured electrically conductive ink and that includes: a wavy line; a first wiring element located at one side of both sides sandwiching the wavy line in a width direction; and a second wiring element located at the other side of the both sides and adjacently to the wavy line; a surplus wavy line is provided which is another wavy line, which extends along the wavy line adjacently to the wavy line between the wavy line and the first wiring element, and which is connected to the wavy line to have the same potential.

Printed wiring

In printed wiring that is formed on a surface of a base member by a film of cured electrically conductive ink and that includes: a wavy line; a first wiring element located at one side of both sides sandwiching the wavy line in a width direction; and a second wiring element located at the other side of the both sides and adjacently to the wavy line; a surplus wavy line is provided which is another wavy line, which extends along the wavy line adjacently to the wavy line between the wavy line and the first wiring element, and which is connected to the wavy line to have the same potential.

A wiring board includes a conductor pattern formed on a board, and an insulating film that covers at least part of the conductor pattern. A first insulating film is provided in a first region on the board, the first region covering at least part of the conductor pattern and having a first border segment. A second insulating film is provided in a second region on the board, the second region covering at least part of the first region and having a second border segment. The second border segment is located outside the first region, and the shortest distance from any point belonging to the second border segment to the first border segment is not more than 400 μm.

Wiring board

In printed wiring that is formed, on a surface of a base member, by a film of cured electrically conductive ink and that includes: a wavy line; a first wiring element located at one side of both sides sandwiching the wavy line in a width direction; and a second wiring element located at the other side of the both sides and adjacently to the wavy line; a surplus wavy line is provided which is another wavy line, which extends along the wavy line adjacently to the wavy line between the wavy line and the first wiring element, and which is connected to the wavy line to have the same potential.

A wiring board includes a conductor pattern formed on a board, and an insulating film that covers at least part of the conductor pattern. A first insulating film is provided in a first region on the board, the first region covering at least part of the conductor pattern and having a first border segment. A second insulating film is provided in a second region on the board, the second region covering at least part of the first region and having a second border segment. The second border segment is located outside the first region, and the shortest distance from any point belonging to the second border segment to the first border segment is not more than 400 &#x3bc;m.

Method of producing wiring board that includes dual-layered insulating film

Provided is a wiring board including a fine-wire pattern made of cured conductive ink formed on a board surface, wherein assuming that two orthogonal directions on the board surface are directions X and Y, a line width of another fine wire that is included in the fine-wire pattern, passes through another point on the board surface not aligned in the direction X but aligned in the direction Y with one intersection where three or more fine wires included in the fine-wire pattern are centered at one spot, and does not form another intersection where three or more fine wires are centered at one spot at said another point is 1.5 times or more a minimum line width of the fine wires included in the fine-wire pattern.

Wiring board production method and wiring board

A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape with line segments connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment.

Printed wiring line, electronic device, touch panel, gravure plate, printed wiring line formation method, touch panel production method, and electronic device production method

A wiring structure that includes first wiring parts which are formed of conductive wires and second wiring parts which are formed of thicker conductive wires than the conductive wires of the first wiring parts and are connected to the first wiring parts is formed by offset printing which includes the following processes. First printing process: First conductive ink for forming the first wiring parts is transferred from a first blanket to a base. Second printing process: Second conductive ink for forming the second wiring parts is transferred from a second blanket, which is different from the first blanket, to the base.

Wiring structure manufacturing method and wiring structure

A touch panel comprises, a substrate, a layered structure formed in a sensing region defined on one side of the substrate, the layered structure including at least a first conductor layer made of a first hardened conductive ink, a second conductor layer made of a second hardened conductive ink and an insulating layer disposed therebetween, and an external connection terminal formed outside the sensing region on the one side of the substrate, wherein the external connection terminal comprises a first terminal layer made of the first hardened conductive ink and a second terminal layer made of the second hardened conductive ink, such that the first terminal layer and the second terminal layer are directly overlaid on each other.

Touch panel including a layered structure with first and second mesh terminal layers directly overlaid on each other and touch panel production method

A touch panel includes two ground wires. One end portion (an end portion X) of one of the two ground wires and one end portion (an end portion Y) of the other of the two ground wires form a gap. When the touch panel is viewed from front, the following condition as an example is satisfied: a line segment Zintersects at least one of the two ground wires. The line segment Zis a line segment which connects any one point Pon a first line segment and any one point Qon a second line segment, the first line segment connecting a site of the end portion Xand a site of the end portion Ywhich are located on two sides of an outer gate of the gap, the second line segment connecting a site of the end portion Xand a site of the end portion Y

Touch panel having high resistance to static electricity

A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape in which line segments are connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment.

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Tokyo, Japan

Akitoshi Sakaue