Nikon Corporation

Akitoshi Kawai

Fuminori Hayano

Nobukatsu Machii

Hirotomo Yashima

Manabu Komatsu

Kazumasa Endo

Hiromasa Shibata

Hisashi Tazawa

Tsuneo Hasegawa

Daisaku Mochida

Toru Yoshikawa

Kurata Honma

A measurement processing device used for an x-ray inspection apparatus that detects an x-ray passing through a specimen with a detection unit to sequentially inspect a plurality of specimens on the basis of an acquired transmission image, includes a setting unit that sets a region to be inspected on a portion of the specimen; a determination unit that determines the non-defectiveness of the region to be inspected by using a transmission image of the x-ray that passed through the region to be inspected; a correction unit that performs a correction on the region to be inspected on the basis of a determination result by the determination unit; and a display control unit that displays the corrected region to be inspected corrected by the correction unit.

Measurement processing device, measurement processing method, measurement processing program, and method for manufacturing structure

A measurement processing device used for an X-ray inspection device includes: a region information acquisition unit that acquires first region information based on X-rays passing through a first region that is a part of a first specimen; a storage unit that stores second region information related to a second region of a second specimen, the second region being larger than the first region; and a determination unit that determines whether or not a region corresponding to the first region is included in the second region, based on the first region information and the second region information.

Measurement processing device, x-ray inspection device, measurement processing method, measurement processing program, and structure manufacturing method

A measurement processing device used for an x-ray inspection apparatus that detects an x-ray passing through a predetermined region of a specimen placed on a placement unit to perform an inspection on the shape of the predetermined region of the specimen includes: a setting unit that sets a three-dimensional region to be detected on the specimen; and a sliced-region selection unit that sets a plurality of sliced regions on the region to be detected, calculates, for each of the plurality of sliced regions, an amount of displacement of the predetermined region that is required to detect the region to be detected when the plurality of sliced regions is regarded as the predetermined region, and selects a sliced region for the inspection from among the plurality of sliced regions on the basis of each of the calculated amounts of displacement.

Measurement processing device, x-ray inspection apparatus, method for manufacturing structure, measurement processing method, x-ray inspection method, measurement processing program, and x-ray inspection program

Measurement processing device, X-ray inspection device, measurement processing method, measurement processing program, and structure manufacturing method

A defect inspecting apparatus inspects defects of a sample having a pattern formed on the surface. The defect inspecting apparatus is provided with a stage which has a sample placed thereon and linearly moves and turns; a light source; an illuminating optical system, which selects a discretionary wavelength region from the light source and epi-illuminates the sample surface through a polarizer and an objective lens; a detecting optical system, which obtains a pupil image, by passing through reflection light applied by the illuminating optical system from the surface of the sample through the objective lens and an analyzer which satisfies the cross-nichols conditions with the polarizer; and a detecting section which detects defects of the sample by comparing the obtained pupil image with a previously stored pupil image. Conformity of the pattern on a substrate to be inspected can be judged in a short time.

Polarized light defect detection in pupil images

This invention relates to a wafer inspection apparatus having various types of structures for realizing a reduction in convey time of a selected wafer as an inspection target, an improvement in operability, or the like. In particular, this wafer inspection apparatus has a first convey system and a second convey system. The first convey system is movable in a direction perpendicular to a wafer convey reference surface and has a plurality of arm portions operable independently of each other. The second convey system has a plurality of rotary arm portions that are movable in the direction perpendicular to the wafer convey reference surface. Thus, a structure in which the wafer convey time is shorter than in a conventional wafer inspection apparatus is realized. This wafer inspection apparatus also has a lifting unit with a specific structure, thus realizing an improvement in operability of the apparatus or the like.

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Yokohama, Japan

Akitoshi Kawai