Seiko Epson Corporation

Epson Toyocom Corporation

Akitoshi Hara

Katsuo Ishikawa

Yukihiro Tonegawa

Yoshihiro Kobayashi

Shojiro Kitamura

Eiichi Sato

Masayuki Matsunaga

Atsushi Ono

Tadashi Komiyama

A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view.

Piezoelectric device with a package including a convex part

An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin. The mounting surface includes: an exposed surface of the resin between the first and second substrates, and side surfaces of the first and second substrates adjacent to the exposed surface. The first electrode is disposed at an end of the first surface adjacent to the mounting surface and electrically coupled to the electric element. The second electrode is disposed at an end of the second surface adjacent to the mounting surface.

Electronic device, electronic module, and methods for manufacturing the same

An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin. The mounting surface includes: an exposed surface of the resin between the first and second substrates, and side surfaces of the first and second substrates adjacent to the exposed surface. The first electrode is disposed at an end of the first surface adjacent to the mounting surface and electrically coupled to the electric element. The second electrode is disposed at an end of the second surface adjacent to the mounting surface and electrically coupled to the electric element.

A piezoelectric resonator includes a piezoelectric resonator element having a resonating arm and a metal film that is formed on the resonating arm; a package including a bottom part on which the piezoelectric resonator element is fixed and a frame wall that surrounds the bottom part, and having an opening above the bottom part; and a lid including a frame in which a through hole is provided and an optically transparent part that has an upper face and a lower face of the frame and is disposed at the through hole, the through hole penetrating a front face and a back face, the lower face of the optically transparent part being disposed so as to oppose the metal film, and the lid closing the opening of the package such that the lid overlaps with the bottom part and the frame wall, the through hole having a curved inner wall face whose curved face is coupled with at least one of the front face and the back face at least one opening edge of the front face and the back face and a vertical inner wall face that is provided vertical to the front face and the back face and in a part of a thickness direction of the frame, and the optically transparent part being provided so as to contact closely with at least a part of the vertical inner wall face and at least a part of the curved inner wall face.

Piezoelectric resonator, manufacturing method thereof and lid for piezoelectric resonator

A piezoelectric resonator includes a piezoelectric resonator element having a base portion and a resonating arm extending from the base portion, a package including a bottom to which the piezoelectric resonator element is fixed and a frame wall that surrounds the bottom and having an opening above the bottom, and a lid for closing the opening of the package. In this piezoelectric resonator, the lid includes a main body having a through-hole formed therein, a flange formed to surround a periphery of the main body and to be thinner than the main body, and an optically transparent member located in the through-hole. The flange has a joining portion with an upper end surface of the frame wall, and the main body projects in a direction from the flange to the bottom in a thickness direction. Also, the through-hole is at a position displaced in a first direction approaching a first end of the main body from a center of the main body. Also, the flange is joined with the frame wall such that a clearance between the first end and the joining portion of the flange nearest to the first end is larger than a clearance between a second end in a second direction opposite to the first direction of the main body and the joining portion of the flange nearest to the second end.

Piezoelectric resonator and manufacturing method therefor

Piezoelectric device

Certain embodiments of the present invention relate to a method for manufacturing a semiconductor chip, a method for manufacturing a semiconductor device, a semiconductor chip, a semiconductor device, a connection substrate and an electronic apparatus, in which semiconductor chips stacked in layers are electrically connected to one another without using wires. In one embodiment, after an electrodeis formed on a surfaceof a first semiconductor chipa holeis formed from an opposite surfacethereof until a tungsten layerof the electrodeis exposed. A protrusionis formed by etching on a surfaceof a second semiconductor chipand thereafter an abutting electrodeis formed on an apex section of the protrusionThe first semiconductor chipand the second semiconductor chipare stacked on top of the other such that the abutting electrodecontacts the electrodeAs a result, the path between the electrodes becomes shorter and therefore signal delays are inhibited or prevented. Also, there are no restrictions on the area of semiconductor chips to be stacked. As a result, semiconductor chips having the same area can be stacked in layers, and thus the size of the semiconductor devicecan be reduced.

Methods for manufacturing semiconductor chips, methods for manufacturing semiconductor devices, semiconductor chips, semiconductor devices, connection substrates and electronic devices

After a silicon oxide film is formed on a semiconductor wafer, pattern formation alignment marks are provided in the chip formation areas and through-holes for stacking are formed in each chip formation area using an alignment mark as reference in order to improve accuracy in vertically stacking semiconductor chips. Next, after forming elements, wiring and electrode parts on the semiconductor wafer, the semiconductor wafer is cut along the chip formation area and is divided into semiconductor chips. Then, the divided semiconductor chips, as many as needed, are stacked by matching the through-holes.

Method of fabricating semiconductor device

In a semiconductor device is provided a semiconductor element 22 encapsulated in a package 26. The connection area 29 used to connect an external structure, such as a heat-dissipating plate 30 or another semiconductor device, is installed in either the die pad 23 used for mounting the semiconductor element or inner leads 24 that are electrically connected to the semiconductor element. The connection area is integrated with the external structure via linking holes 28 that have been formed in the package. By combining a packaged and completed semiconductor device with various types of external structures, it becomes possible to expand or enhance the function of the overall semiconductor device, or to lower its cost.

Semiconductor device and its manufacturing method

A semiconductor sealing mold for sealing a semiconductor element within a thermosetting resin is provided with resin inflow openings formed in oppositely and substantially symmetrically opposed relation to the active surface and back surface of a lead frame connected semiconductor element. As a result, the application of the molding process and method of encapsulation of the semiconductor element can be accomplished under conditions of uniformly applied pressure to opposite surfaces of the semiconductor element and extending outwardly in all radial directions from the center of the semiconductor element. Furthermore, since the bonding wires and lead frame leads are substantially aligned in the same radial directions from the center of the semiconductor element, damage does not occur to these wires or leads during the molding process.

Growing community of inventors

Fujimi, Japan

Akitoshi Hara