Yamaha Hatsudoki Kabushiki Kaisha

Hitachi High-Tech Corporation

Hitachi-High-Technologies Corporation

Akito Tanokuchi

Seiichiro Kanno

Tsutomu Yanagida

Kei Shibayama

Naoki Sakamoto

Kazuyoshi Ohyama

Shigeru Haneda

Masashi Shibahara

Mikio Tokuyama

Eiichi Hazaki

Osamu Yamada

Yasuyuki Momoi

Koichiro Takeuchi

Yoshinori Kano

Yutaka Chida

A charged particle beam device suppresses sample deformation caused by placing a sample on a suctioning surface of an electrostatic chuck mechanism, the sample having a temperature different from the suctioning surface. The charged particle beam device includes the electrostatic chuck mechanism; a stage which moves a sample, which is to be irradiated with a charged particle beam, relative to an irradiation position of the charged particle beam; an insulating body which is disposed on the stage and constitutes a dielectric layer of the electrostatic chuck; a first support member which supports the insulating body on the stage; a ring-shaped electrode which encloses the surroundings of the sample and is installed on the insulating body in a contactless manner, and to which a predetermined voltage is applied; and a second support member which supports the ring-shaped electrode.

Charged particle beam device

A charged particle beam device suppresses sample deformation caused by placing a sample on a suctioning surface of an electrostatic chuck mechanism, the sample having a temperature different from the suctioning surface. The charged particle beam device includes the electrostatic chuck mechanism; a stage () which moves a sample, which is to be irradiated with a charged particle beam, relative to an irradiation position of the charged particle beam; an insulating body () which is disposed on the stage and constitutes a dielectric layer of the electrostatic chuck; a first support member () which supports the insulating body on the stage; a ring-shaped electrode () which encloses the surroundings of the sample and is installed on the insulating body in a contactless manner, and to which a predetermined voltage is applied; and a second support member () which supports the ring-shaped electrode.

The purpose of the present invention is to provide a charged particle beam device which suppresses sample deformation caused by placing a sample on a suctioning surface of an electrostatic chuck mechanism, the sample having a temperature different from the suctioning surface. Proposed is a charged particle beam device which has an electrostatic chuck mechanism, the charged particle beam device being provided with: a stage () which moves a sample, which is to be irradiated with a charged particle beam, relative to an irradiation position of the charged particle beam; an insulating body () which is disposed on the stage and constitutes a dielectric layer of the electrostatic chuck; a first support member () which supports the insulating body on the stage; a ring-shaped electrode () which encloses the surroundings of the sample and is installed on the insulating body in a contactless manner, and to which a predetermined voltage is applied; and a second support member () which supports the ring-shaped electrode.

The invention provides a component supply device which is small and can supply electronic components efficiently. The component supply devicemounts a component supply tape T and exposes the electronic components out of the component supply tape T to provide to a component installation devicewhich mounts the electronic components on a circuit board. The component supply devicehas a replenishment devicewhich replenishes a new component supply tape (Tb) when a preceding component supply tape Ta runs out, and a sensor S which detects the run-out of the preceding component supply tape Ta. The replenishment devicehas a reel holding sectionon which reelswound with the component supply tape T are inserted, and a standby sectionof the component supply tape T. When the sensor S detects that the preceding component supply tape Ta runs out and issues a detection signal, the component supply tape T is moved from the standby section to be replenished.

Component supply device and component installation device

A component supply device loaded with a component supply tape for exposing and supplying an electronic component from the component supply tape with respect to a component mounting device mounting the electronic component on a substrate includes a replenishing unit performing replenishment of a new component supply tape when a preceding component supply tape is exhausted and a sensor senses exhaustion of the preceding component supply tape while a confluent portion where a channel for the preceding component supply tape and a channel for the new component supply tape join with each other is formed between the sensor and the replenishing unit. A buckling prevention mechanism moves in response to an operation of the preceding component supply tape or the new component supply tape for preventing buckling when the new component supply tape is transported to the component supply device by the replenishing unit is arranged on the confluent portion.

Component supply device and component mounting device

A component feeding device transports a tape (a component feeding tape) in which electronic components are stored with some transportation device, and exposes the components. Transportation of the component feeding tape may be performed by fitting a sprocket with a feed hole of the component feeding tape. It has been found that sprocket does not necessarily fit with the feed hole of the component feeding tape. It has been found that this phenomenon takes place in a case of driving at least two or more sprockets with a driving device. When the sprocket does not fit with the feed hole, transportation of the tape is not correctly performed, but exerts an undesirable influence such as reduction of mounting efficiency on feeding of the components and subsequent mounting of the components. One feature resides in rendering a backlash of an upstream-side sprocket larger than a backlash of a downstream-side sprocket.

Component feeding device, and component mounting device

In order to provide a stage apparatus with high speed stability in addition to being able to achieve positioning with a high degree of accuracy, and a sample observation apparatus, such as an optical microscope and a scanning electron microscope, including the stage apparatus, the stage apparatus and the sample observation apparatus of the present invention correct a command voltage value of standard waveform data or an output timing of a command voltage value such that a difference between a first time history response and a second time history response is reduced to zero, the first time history response for displacement or speed when the stage mechanism is driven with use of the standard waveform data showing the command voltage value at each predetermined time and the second time history response for displacement or speed when a speed of the stage mechanism is constant, to be set as drive waveform data to be outputted to a drive unit of the stage mechanism.

Stage apparatus and sample observation apparatus

A stage comprises a linear guide rail () for guiding a movable table (), a driven bar (), a linear drive actuator in contact with the driven bar () to transmit driving force to the driven bar (), and parallel plate springs () for holding opposite ends of the driven bar (). A drive transmitting surface of the linear drive actuator is provided so as to be separated from the movable table (), and this prevents the accuracy of positioning from being reduced. Also, the parallel springs () reduce deforming forces applied to sections supporting the driven bar (), and this prevents the driven bar from being damaged. The configuration makes the stage highly accurate and highly reliable.

Growing community of inventors

Tokyo, Japan

Akito Tanokuchi