Kabushiki Kaisha Toshiba

Toshiba Electronic Devices & Storage Corporation

Akito Shimizu

Hiroaki Kishi

Yoshihisa Imori

Tomohiko Imada

Morihiko Ikemizu

Yasuhisa Shintoku

Atsushi Hosokawa

Kumiko Karouji

Shinya Shimamura

A semiconductor device includes a molded body and an interconnection layer. The molded body includes a semiconductor chip, at least one terminal body disposed around the semiconductor chip and a resin member provided between the semiconductor chip and the terminal body. The molded body has a first surface, a second surface opposite to the first surface and a side surface connected to the first and second surfaces. The interconnection layer is provided on the first surface of the molded body. The interconnection layer includes an interconnect electrically connecting the semiconductor chip and the terminal body. The terminal body has first and second contact surfaces. The first contact surface is exposed at the first or second surface of the molded body. The second contact surface is connected to the first contact surface and exposed at the side surface of the molded body.

Semiconductor device and method for manufacturing same

According to one embodiment, a semiconductor device includes a first semiconductor chip, a heat dissipation member provided on one surface of the first semiconductor chip and connected to the first semiconductor chip, and a sealing resin sealing the first semiconductor chip and the heat dissipation member. The heat dissipation member includes mutually interlaced metal fibers and a thermosetting resin.

Semiconductor device

A semiconductor package comprises a resin material, a semiconductor chip in the resin material, and a metal member in the resin material. The metal member has a first surface that faces the semiconductor chip and a second surface that is opposed to the first surface. The first surface of the metal member has a plurality of first recess portions formed thereon. The first recess portions extend into the metal member and have an opening width that is less than a bottom width.

Semiconductor package

Growing community of inventors

Yokohama Kanagawa, Japan

Akito Shimizu