National Institute of Advanced Industrial Science and Technology

Adv Antest Corporation

Akito Endo

Jun Akedo

Takeshi Tanaka

Toshiaki Hayakawa

Hiroki Tsuda

Bunichi Kakinuma

Provided are a structure for which ink wettability/spreadability in the width direction of a line drawn on a substrate is limited and a high aspect ratio can be achieved, a manufacturing method for said structure, and a line pattern. The present invention provides a structure comprising: a droplet overlapping solidification layer obtained by droplets sloping and continuously overlapping each other in the direction of movement of a substrate and solidifying, a droplet flow solidified layer obtained by the droplets flowing on the droplet overlapping solidification layer and continuously being solidified without the droplets overlapping, and recesses formed at the boundary region between the droplet overlapping solidification layer and the droplet flow solidified layer.

Structure formed on substrate, structure manufacturing method and line pattern

A pattern printing apparatus comprising an ink output section including a nozzle that drops ink and a heating section that heats a preheating target region; a driving section that moves the substrate relative to the ink output section; and a control section that controls the driving section. The control section causes the substrate to move relative to the ink output section such that the preheating target region is positioned in a progression path of the drawing target region and causes a pattern formed by the ink to be drawn, and when switching an extension direction of the pattern being drawn, the control section causes the preheating target region to move to an end portion of the pattern drawn before the switching and causing the preheating target region to be heated.

Pattern printing apparatus, pattern printing method, and test apparatus

Disclosed herein is a fine and thick wiring drawn at high speed in such a manner that a region on the substrate, on which region the liquid droplet is scheduled to impact, is heated beforehand, and that immediately after the impact of the liquid droplet on the substrate, the liquid droplet is promptly solidified so as thereby to suppress the spread of the liquid droplet due to the wettability of the liquid droplet to the substrate, and also to suppress the clogging of the nozzle due to the heating of the substrate. Thereby, even in the case where a liquid droplet having a larger volume than before is used, high-speed drawing of a thick and fine wiring having a line width approximately equal to the liquid droplet size is realized independently of the substrate material.

Growing community of inventors

Tsukuba, Japan

Akito Endo