Sharp Kabushiki Kaisha Corporation

Akiteru Deguchi

Masahiro Murakami

Yoshihisa Amano

Masahiko Kushino

Hitoshi Azuma

Mitsuyoshi Yamashita

Atsushi Maehara

Shikio Yoshida

Kenichi Kumano

A top panel, which is disposed to face a module board with an electronic component therebetween, includes a resin layer and a metal layer, and has an insulating characteristic. The metal layer includes a metal layer formed at a front side of the resin layer and a metal layer formed at a rear side of the resin layer. With this structure, in reflow soldering performed in mounting a semiconductor module on a main board, warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the front side of the resin layer is cancelled by warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the rear side of the resin layer, whereby warp of the top panel is eliminated. This helps prevent the electronic component adhered to the top panel with adhesive from being pressed down to or pulled up from the module board due to warp of the top panel.

Semiconductor module

Provided is an electronic component module which has high reliability and is capable of suppressing reduction in handling performance of a mounting machine. An electronic component module includes a plurality of electronic components mounted on a top surface of a module substrate, a planar top plate covering the electronic components, and a top plate holding member for holding the top plate. The plurality of electronic components include a quartz resonator, and a RF-IC which has a height smaller than that of the quartz resonator and is disposed on the top surface of the module substrate so as to be side by side with the quartz resonator. In addition, the top plate is fixed to the quartz resonator, and the top plate holding member for holding the top plate is disposed between the RF-IC and the top plate.

Electronic component module

In a conventional content transmission system, there has been a problem that it takes a long time from when a user, who tries to start viewing and listening of content, issues a command to a receiver by using a remote controller or the like until when the user can actually view and listen to the content from content viewing and listening equipment (content starting time). To this end, a content transmission system according to the present invention has a transmitter and a receiver including a human sensor and has a configuration that the state of the receiver is changed corresponding to a detection result of the human sensor so as to reduce the content starting time and power consumption.

Content transmission system

A wireless transmission system for transmitting a picture data between a transmitter and a receiver by wireless communication is provided. Each of the receiver and the transmitter is equipped with a directional antenna and a non-directional antenna. A communication of the picture data is performed by using the directional antennas, and a communication of a control data indicating a reception status of the picture data is performed by using the non-directional antennas. The transmitter controls an intensity of a signal radiated from the directional antenna of the transmitter based on the control data so that the intensity becomes a minimum intensity that can transmit the picture data.

Wireless transmission system

A digital signal processor for handling, as a digital signal, data to be transmitted or received and a analog signal processor for handling the data as an analog signal are so arranged as to be spatially separate from each other, and a converter circuit which performs signal format conversion between the digital signal and the analog signal is provided on the analog signal processor side between the digital signal processor and the analog signal processor.

Radio communication device

A data transmission apparatus transmits data signals 'S' and 'S' containing identical serial data &#x201c;ds&#x201d; in two frequency bands, and a data reception apparatus receives those data signals &#x201c;S&#x201d; and &#x201c;S.&#x201d; Parallel data &#x201c;dpl&#x201d; and &#x201c;dpl&#x201d; obtained from the data signals &#x201c;S&#x201d; and &#x201c;S&#x201d; is subjected to selection or synthesis in a subcarrier selection/demodulation circuit so as to be demodulated into serial data &#x201c;dsx,&#x201d; which is then outputted to a MAC section.

Growing community of inventors

Yamatokoriyama, Japan

Akiteru Deguchi