Murata Manufacturing Co., Ltd.

Akitaka Doi

Shinichi Yamaguchi

Shoichiro Suzuki

Taisuke Kanzaki

Kosuke Onishi

Satoshi Muramatsu

Masatoshi Yanagihara

Takehisa Sasabayashi

Akito Mori

Kazuhisa Uchida

Kotaro Shimizu

Yoko Okabe

A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.

Multilayer ceramic electronic component

A multilayer ceramic capacitor includes dielectric layers and internal electrode layers. Internal electrode layers adjacent to a first main surface define first main surface-side internal electrode layers, and internal electrode layers adjacent to the second main surface define second main surface-side internal electrode layers, first solid solution layers including a second metal as a solid solution is provided at interfaces between the first main surface-side internal electrode layers and the dielectric layers, the interfaces being in the first main surface-side internal electrode layers, and second solid solution layers including the second metal as a solid solution is provided at interfaces between the second main surface-side internal electrode layers and the dielectric layers, the interfaces being in the second main surface-side internal electrode layers. A concentration of the second metal in the second solid solution layer is higher than that of the second metal in the first solid solution layer.

Multilayer ceramic capacitor and mounting structure of multilayer ceramic capacitor

An electronic component includes a multilayer body including inner electrodes and dielectric layers alternately stacked, and an outer electrode electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite to each other in a stacking direction, first and second side surfaces opposite to each other in a width direction, and first and second end surfaces opposite to each other in a length direction. The outer electrode includes first outer electrodes disposed on the first and second end surfaces, and at least one second outer electrode disposed on at least one of the first and second side surfaces. The at least one second outer electrode is directly connected to the inner electrodes at positions spaced away from the at least one of the first or second side surface toward the inside of the multilayer body.

Electronic component

A multilayer ceramic capacitor includes a multilayer body and a pair of external electrodes at both ends of the multilayer body in a length direction and covering a pair of end surfaces, and connected to internal electrode layers. The pair of external electrodes each include a first external electrode layer covering each of the end surfaces and connected to the internal electrode layers, a second external electrode layer on the first external electrode layer, and a plated layer on the second external electrode layer, the first external electrode layer includes Ni and dielectric particles, the second external electrode layer includes Cu and glass, and a metal group including at least one of Sn, In, Ga, Zn, Bi, Pb, Fe, V, Y, or Cu is included at an interface between the first and second external electrode layers.

Multilayer ceramic capacitor

A multilayer ceramic capacitor includes a laminate including a dielectric ceramic layer and first and second electrode layers laminated in a lamination direction, and first and second external electrodes respectively connected to the first and second internal electrode layers. The laminate includes a central layer portion, a peripheral layer portion sandwiching the central layer portion, and a side margin sandwiching the central layer portion and the peripheral layer portion. The first and second internal electrode layers and the first and second external electrodes include Ni. In a cross section including the lamination direction and a width direction, a Ni content of the peripheral layer portion is larger at a surface portion than at a central portion in a thickness direction, and a Ni content of the side margin is larger at a surface portion than at a central portion in a thickness direction of the side margin.

A multilayer ceramic capacitor includes a ceramic body including a stack of dielectric layers and internal electrodes, and an external electrode electrically connected to each of the internal electrodes and provided at each of both end surfaces of the ceramic body. The external electrode includes a metal layer and a plating layer on the metal layer. In a cross section of the metal layer that is obtained by cutting the external electrode along a plane parallel to a side surface at a central position in a width direction, the metal layer includes a dielectric material at an area ratio of about 20% or more, and includes cavities at an area ratio of about 5% or more and about 20% or less, the cavities having an average diameter of about 0.5 &#x3bc;m or more and about 1.5 &#x3bc;m or less, and having a maximum diameter of about 5.0 &#x3bc;m or less.

A multilayer ceramic capacitor having inner electrodes with a Ni-Metal A alloy, the Metal A being selected from Fe, V, Y, and Cu and dissolved in the Ni to form a solid solution. The percentage of the Metal A with respect to the total amount of Metal A and Ni in near-surface regions located at a depth of 2 nm from a surface of the inner electrode in contact with an adjacent ceramic dielectric layer is 1.4 or more atom %, and XA&#x2212;YA&#x2265;1.0, where XA represents the atomic percentage of Metal A in the near-surface regions and YA represents the atomic percentage of Metal A in mid-thickness regions of the inner electrodes. A method for producing a multilayer ceramic capacitor includes annealing the ceramic multilayer body under specific conditions to thereby increase, in the inner electrodes, the percentage of Metal A in the near-surface regions.

Multilayer ceramic capacitor and method for producing the same

A multilayer ceramic capacitor having inner electrodes containing at least one metal selected from Cu, Ag, Pd, Pt, Rh, Ir, Ru, and Os in an amount of 0.1 atom % or more that is dissolved in Ni and Sn to form a solid solution. The percentage of Sn with respect to the total amount of Ni and Sn in near-surface regions each located at a depth of 2 nm from a surface of the inner electrode in contact with an adjacent ceramic dielectric layer is 1.4 or more atom %, and X&#x2212;Y&#x2265;1.0, where X represents the atomic percentage of Sn in the near-surface regions and Y represents the atomic percentage of Sn in mid-thickness regions of the inner electrodes. A method for producing a multilayer ceramic capacitor includes annealing the ceramic multilayer body to increase, in the inner electrodes, the percentage of Sn in the near-surface regions.

A laminated ceramic capacitor that includes a ceramic laminated body having a stacked plurality of ceramic dielectric layers and a plurality of internal electrodes opposed to each other with the ceramic dielectric layers interposed therebetween, and external electrodes on the outer surface of the ceramic laminated body and electrically connected to the internal electrodes. The internal electrodes contain Ni and Sn, a proportion of the Sn/(Ni+Sn) ratio is 0.001 or more in molar ratio is 75% or more in a region of the internal electrode at a depth of 20 nm from a surface opposed to the ceramic dielectric layer, and the proportion of the Sn/(Ni+Sn) ratio is 0.001 or more in molar ratio is less than 40% in a central region in a thickness direction of the internal electrode.

Laminated ceramic capacitor and method for manufacturing laminated ceramic capacitor

A laminated ceramic capacitor having internal electrodes configured such that Sn is dissolved in Ni, and, in a region of each of the internal electrodes at a depth of 2 nm from a surface thereof facing a ceramic dielectric layer, a CV value representing variation of a Sn/(Ni+Sn) ratio (ratio of number of atoms) is less than or equal to 32%. As a conductive paste for forming the internal electrodes, a conductive paste containing a Ni powder and a tin oxide powder which is represented by SnO or SnOand has a specific surface area of more than or equal to 10 m/g as determined by a BET method is used, or a conductive paste containing a Ni&#x2014;Sn alloy powder is used, or a conductive paste containing a Ni&#x2014;Sn alloy powder and a tin oxide powder which is represented by SnO or SnOand has a specific surface area of more than or equal to 10 m/g is used.

A multilayer ceramic capacitor that includes an internal electrode containing at least one kind of metal A selected from the group consisting of In, Ga, Zn, Bi, and Pb and dissolved in Ni to form a solid solution. The internal electrode has a ratio of A of 1.4 atomic percent or more to a total amount of A and Ni in a near-interface region located to a depth of 2 nm from a surface of the internal electrode facing a corresponding ceramic dielectric layer. A relation between a value X of atomic percent representing the ratio of A in the near-interface region and a value Y of atomic percent representing the ratio of A in a central region in a thickness direction of the internal electrode is X&#x2212;Y&#x2267;1.0. Such a multilayer capacitor is formed by annealing a ceramic stack under a predetermined condition to increase the ratio of metal A in the near-interface region of the internal electrode.

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Akitaka Doi