Mitsubishi Denki Kabushiki Kaisha

Akira Yao

Tetsurou Ogushi

Masaaki Murakami

Hiromi Seko

Takeshi Okamoto

Hiroaki Ishikawa

Hisaaki Yamakage

Eiichi Ozaki

Kazuyoshi Yabuchi

Hiromitsu Masumoto

Inner peripheral grooves for transporting a liquid of a working fluid in the longitudinal direction of a first wick are provided along the first wick which transports the liquid contained in the evaporator to a heating portion in the evaporator by capillary force, and a liquid supply portion for supplying the liquid of the working fluid is further provided to the inner peripheral grooves. Therefore, the liquid of the working fluid can be efficiently supplied to the inner peripheral surface of the first wick with a simple structure, so that a loop type heat pipe which can be constantly stably operated can be obtained.

Loop type heat pipe

An evaporator includes a container, a wick provided in contact with an inner peripheral surface of said container and formed such that (1) if the number of pores per unit volume is fixed, the diameter of pores is varied, or (2) if the diameters of pores are formed substantially uniformly, the number of pores is varied, a sump having said wick as its inner wall surface and connected to a liquid pipe for supplying a liquid-phase working fluid, and a vapor channel formed in a contact surface of said container with respect to said wick so as to guide a gas-phase working fluid into a vapor pipe connected to an end portion of said container.

Evaporator and loop-type heat pipe using the same

An interface portion structure and a reinforcing structure for flexible thermal joints. A member having a high thermal conductivity represented by bundled graphite fibers is used as a thermal conductor for heat transfer from a heat source to a heat sink. The thermal conductor is provided with auxiliary thermal conductors at its interface portions in order to suppress thermal resistance on a face for conducting heat between the thermal conductor and the heat source or heat sink, and a conduction cross-sectional area is increased by the auxiliary thermal conductors. To suppress thermal resistance, a heat conduction face is cut slantwise or metallized, and adhesive agent is disused.

Interface portion structure and reinforcing structure of flexible

A sandwiched honeycomb panel with built in heat pipes includes a radiating fin which is integral with an envelope having a heat pipe formed therein. A heat block may be used in place of the radiating fin.

Honeycomb sandwich panel with built in heat pipes

A heat pipe comprising a hermetic shell tube, a heat conveying fluid within the shell tube and a plurality of capillary circumferential or axial grooves provided entirely of an inner surface of the shell. A capillary axial channel structure which includes axially extending plates defining a U-shaped or V-shaped channels therebetween circumferential grooves and having an opening defining therein a meniscus of the heat conveying fluid in the liquid phase at least in the evaporator section and the condenser section. The capillary axial channel structure may comprise an inner tube for defining a tubular, axially extending capillary space therebetween. The inner tube has open ends disposed within the evaporation and condensation sections for allowing the heat conveying fluid to flow therethrough.

Heat pipe

A heat transport system is disclosed which comprises an evaporator, a condenser, an accumulator, switching means and connecting pipe therethrough. The switching means changes the operation mode from the first mode to the second mode alternatively. In the first mode, cooled liquid flows into the accumulator. In the second mode, the capillary pressure occurring in the evaporator leads the liquid in the accumulator to the evaporator. By switching the first mode and the second mode alternatively, the heat is transported from the evaporator to the condenser. Because of the operation of the capillary pressure, the heat transport system of the present invention can work even in gravity-free environments.

Growing community of inventors

Tokyo, Japan

Akira Yao