Canon Kabushiki Kaisha

Akira Yane

Kento Tsuda

Takeshi Murakami

Masaaki Takahashi

Daisuke Kurihara

Takahiro Kojima

Masayuki Morohashi

Daisuke Tanaka

Takayuki Hori

A conductive resin composition which has high conductivity and a low water absorption rate, in which thermal decomposition of a polyacetal resin is reduced, and which causes no problems in practical use in injection molding applications, and a resin molded body and an article each including the conductive resin composition. The conductive resin composition includes: a polyacetal serving as a main component; carbon black; graphite; and an oxazoline group-containing compound and a reaction product thereof.

Conductive resin composition, resin molded body, and article

A resin molded article including an ethylene vinyl acetate copolymer resin and carbon black as primary components. After the resin molded article is heated from 25 degrees Celsius to 100 degrees Celsius and then cooled to 25 degrees Celsius, the shrinkage factor of the resin molded article at 25 degrees Celsius cooled after heated to 100 degrees Celsius relative to the resin molded article at 25 degrees Celsius before heated is less than or equal to 2.0%.

Resin molded article and manufacturing method thereof

A resin composition containing a resin, a magnetic powder, a first non-magnetic powder with a water-soluble content in the range of 0.1% to 0.5%, and a second non-magnetic powder with a water-soluble content of 0.05% or less.

Resin composition, resin molded body, and article

A resin molded product whose main component consists of an ethylene-vinyl acetate copolymer resin and carbon black. The ethylene-vinyl acetate copolymer resin has an MFR of 0.5 g/10 min or more and 20 g/10 min or less. The carbon black has an average primary particle diameter of 55 nm or more and 100 nm or less and a DBP oil absorption amount of 100 mL/100 g or more and 300 mL/100 g or less. The content of vinyl acetate is 2.9 parts by mass or more and 12.3 parts by mass or less based on 100 parts by mass of the main component. The resin molded product has a surface resistivity of 720 &#x3a9;/&#x25a1; or less.

Resin molded product, resin laminate, cartridge, image-forming apparatus, method for manufacturing resin molded product, method for manufacturing resin laminate, and method for manufacturing cartridge

A resin member includes a base material and a resin molded body disposed on the base material, the resin molded body containing a main component constituted by an ethylene-vinyl acetate copolymer resin and a carbon black. The resin molded body has two or more peaks within a range of 25&#xb0; C. to 80&#xb0; C. in an endothermic curve obtained through measurement performed by heating from 25&#xb0; C. to 150&#xb0; C. at 5&#xb0; C./min with a differential scanning calorimetry (DSC) apparatus.

Resin member, resin molded body, cartridge, image forming apparatus, and method for manufacturing resin member

A method for producing an electrically conductive seamless tube includes (1) preparing an electrically conductive resin composition containing a thermoplastic resin and an electrically conductive filler, (2) preparing a cylindrical extruding die including a cylindrical slit, at least one circumferential distribution channel communicating with the slit and distributing the resin composition that is plasticized in a circumferential direction of the slit, and at least one lead-in path that leads the plasticized resin composition into the circumferential distribution channel, the lead-in path containing a line mixer; (3) introducing the plasticized resin composition into the lead-in path toward the circumferential distribution channel; (4) introducing the plasticized resin composition flowing through the lead-in path into the circumferential distribution channel toward the slit; and (5) introducing the resin composition flowing through the circumferential distribution channel into the slit and extruding the resin composition from an outlet of the slit into a cylindrical shape.

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Tokyo, Japan

Akira Yane