Hitachi, Ltd.

Other

Lg Electronics Inc.

Renesas Technology Corp.

Akira Yamagiwa

Ryoichi Kurihara

Toshitsugu Takekuma

Kenichi Ishibashi

Takehisa Hayashi

Toshio Hatada

Takao Ohba

Akira Tanaka

Hideki Osaka

Hitoshi Matsushima

Toshihiro Okabe

Tetsuya Hayashida

Ikuo Yoshida

Satoshi Imasu

Masao Inoue

Shinobu Takeura

Tsutomu Goto

Hiroshi Inouye

Takashi Moriyama

Kenji Kashiwagi

Yasuhiro Uemura

Masakazu Sakaue

Yoshihiro Kondou

Toshitsuqu Takekuma

Tadakatsu Nakajima

Kanji Otsuka

Toshiro Takahashi

Motohiro Sato

Noboru Masuda

Tsuyoshi Watanabe

Heikichi Kuwahara

Toshio Doi

Yuji Shirai

Takashi Maruyama

Mikihiro Tanaka

Kiyokazu Arai

Yutaka Watanabe

Kazuji Yamada

Shigeo Ohashi

Koji Matsuda

Hiroshi Inoue

Kenichi Kurosawa

Takashi Matsumoto

Naoki Hamanaka

Hiroshi Ito

Munehisa Kishimoto

Akira Masaki

Yoshihiro Miyazaki

Mitsugu Kusunoki

Masaya Umemura

Masabumi Shibata

Nobuo Tamba

Shinichiro Yamaguchi

Hideki Murayama

Kazuo Koide

Shinichi Suzuki

Kazunori Nakajima

Michiharu Honda

Mitsuo Asai

Susumu Iwai

Soichi Takaya

Yasuhiro Ishii

Bunichi Fujita

Hiroichi Shinohara

Toyohiko Komatsu

Seiichi Kawashima

Toshiki Iino

Kazumichi Yamamoto

Masahiro Kitano

Sako Ishikawa

Masatoshi Kawashima

Yuuji Shirai

Mikio Yamagishi

Hitoshi Yoshidome

Toshihiro Komatsu

Tatsuhiro Aida

Toshihiro Komatu

Tetsuro Honma

Shingeo Ohashi

Takeshi Miyazaki

Isokazu Matsuzaki

Katsumi Yabe

Nobuaki Ejima

A signal transmitting circuit includes a circuit block having a driving circuit and an intra-block transmission line for transmitting a signal from the driving circuit, a circuit block having a receiving circuit and an intra-block transmission line for transmitting the signal to said receiving circuit, and a main interblock transmission line for propagating a signal between the driving and receiving circuit blocks. The inter-block transmission line is terminated by a resistor having substantially the same impedance as the interblock transmission line. The intra-block transmission lines are provided with a resistance element having a resistance substantially equal to a value derived by subtracting half of an impedance of the inter-block transmission line from an impedance of the intra-block transmission line, to lower signal amplitude and suppress reflections of a signal at branch points along the main interblock transmission line, thereby enabling a high-speed signal transfer.

Signal transmitting device suited to fast signal transmission

Disclosed herein is an improved logic module used for logic emulation along with an enhanced logic emulation board subject to logic verification. The logic module has a plurality of programmable LSIs capable of programming logic and a plurality of switching LSIs capable of programming connections, the LSIs being mounted on one or both sides of a board. Peripheral portions of the board carry connectors for electrical connection to the outside. There are two types of data lines: those directly coupling the connectors to the programmable LSIs, and those linking the connectors to the programmable LSIs via the switching LSIs. The programmable and switching LSIs constitute a crossbar connection arrangement. The logic emulation board has connectors for connection to a logic emulation module, and lands for supporting LSIs targeted for development. Pins of the connectors and the lands are interconnected on a one-to-one basis. Also disclosed here is an upgraded module structure permitting a multiple-stage module setup together with an advanced cooling structure for modules.

Logic emulation module and logic emulation board

An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.

Process for mounting electronic device and semiconductor device

A signal transmission system includes a first circuit block having a first output circuit for producing a first signal, a plurality of second circuit blocks each including a first receiving circuit for receiving the first signal, and transmission lines connected between the first circuit block and the second circuit blocks, wherein the first circuit block further includes a second output circuit for producing a second signal, and wherein each of the second circuit blocks further includes a second receiving circuit for receiving the second signal, the first receiving circuit latching the first signal in synchronism with the second signal, removing the unsuccessfulness in the signal transmission and reception due to the propagation delay of signals between circuits.

Signal transmission system

A fast transfer bus system capable of fast data transfer with no reflection at branch points. Four LSIs having constant-impedance interfaces are connected via two variable resistors each having three signal terminals. A variable impedance LSI is connected between these variable resistors. When the LSIs connected to the variable resistor do not work as a bus driver, three variable resistance elements in each variable resistor are set to have a value of &frac13; of the characteristic impedance Zo of connection lines, and are connected in a Y-letter shape. When one of LSIs connected to the variable resistor works as a bus driver, the values of the variable resistance elements are set to low impedance or Zo.

Branch bus system for inter-LSI data transmission

In a printed board mounting method using a directional coupling bus for a high-speed data transfer, multi-bit data are transferred between nodes at a low cost. For this purpose, to transfer multi-bit data by directional coupling, a one-bit multi-coupling wiring network is vertically configured in a multilayered printed board. This minimizes the width of an area occupied by each bit along a wiring direction of the board to thereby implement a multi-bit configuration.

Directional coupling bus system using printed board

Growing community of inventors

Hadano, Japan

Akira Yamagiwa