Shin-etsu Chemical Co., Ltd.

Akira Uta

Takafumi Sakamoto

Masayuki Ikeno

Munenao Hirokami

Nobuaki Matsumoto

Tetsuro Yamada

Akitsugu Fujiwara

Taiki Katayama

Kohei Masuda

Kumiko Hayashi

Tomoki Akiba

Shigeki Yasuda

A room-temperature-curable organopolysiloxane composition for an oil seal, wherein an organosilane compound containing a specific organo-oxymethyl group and represented by formula (1) below and/or a partial hydrolysis condensate of said compound is used as a curing agent (crosslinking agent), and an organic compound having a guanidine skeleton is added in combination as a curing catalyst. In the formula, each Ris independently a C1-12 unsubstituted or substituted monovalent hydrocarbon group, Ris a C1-12 unsubstituted or substituted monovalent hydrocarbon group, Y is a hydrolyzable group, and n is 0, 1 or 2. It is thus possible to obtain a cured product having good rubber properties, adhesiveness, and engine oil resistance after curing even without containing a metal-based catalyst:

Room-temperature-curable organopolysiloxane composition for oil seal, and automotive part

This organopolysiloxane composition, when cured at room temperature by moisture in the atmosphere, provides a silicone rubber cured product having good self-adhesiveness to a magnesium alloy. The organopolysiloxane composition contains (A) an organopolysiloxane having a hydroxy group and/or a hydrolysable silyl group at both ends of the molecular chain, (B) an organic silicon compound other than (A) and (C), having at least three hydrolysable groups bonded to a silicon atom per molecule, and/or a partial hydrolysis-condensation product thereof, and (C) a silane coupling agent having a specific molecular structure having a carboxylic acid silyl ester bond. Furthermore, a novel compound, having an alkoxysilyl group and a carboxylic acid silyl ester group per molecule, can have improved adhesiveness/bonding properties with respect to a base material due to the effect of carboxylic acid after hydrolysis thereof.

Organopolysiloxane composition, and organic silicon compound and production method therefor

A room-temperature-curable organopolysiloxane composition; a structure obtained from the composition; and a method for assessing the cured state of the composition are provided. The room-temperature-curable organopolysiloxane composition, which changes in color with the progress of curing from the uncured state, comprises the following ingredients: (A) 100 parts by mass of one or more organopolysiloxanes represented by formula (1)HO(SiRO)H&#x2003;&#x2003;(1)and/or formula (2) (with variables as defined herein); (B) 0.1-50 parts by mass of an organosilicon compound having at least three silicon-atom-bonded hydrolyzable groups in the molecule, which is not any of ingredients (A), (C), and (D), and/or a product of the partial hydrolytic condensation of the organosilicon compound; (C) 0.01-20 parts by mass of a curing catalyst; (D) 0.1-10 parts by mass of a silane coupling agent; and (E) 0.01-10 parts by mass of a pH indicator.

Room-temperature-curable organopolysiloxane composition, structure, and method for assessing cured state of said composition

This dealcoholization room-temperature curable organopolysiloxane composition contains (A) a diorganopolysiloxane having a silicon atom-bonded hydroxy group and/or a hydrolyzable silyl group at both ends of the molecular chain, and has a coefficient of viscosity of 20-1,000,000 mPa&#xb7;s, (B) an organopolysiloxane which is a partial (co-)hydrolysis-condensation product of a hydrolyzable organosilane compound having one or more silicon atom-bonded alkenyl groups and 1-3 silicon atom-bonded alkoxy groups, per molecule, (C) a hydrolyzable organosilane compound having one or more phenylene backbones and two or more amino groups, per molecule, and/or a partial hydrolysis-condensation product thereof. The dealcoholization room-temperature curable organopolysiloxane composition has good curability and storage stability even when the composition does not contain a metal catalyst, is less toxic to the human body and is environmentally friendly, is cost-competitive, and has good rubber physical properties and adhesiveness after being cured.

Dealcoholization room-temperature curable organopolysiloxane composition, and article sealed by cured product of same

Provided is a thermoplastic elastomer comprising a mesogen-silicon compound (co)polymer which is represented by formula (1) below and has a number average molecular weight of 1,000-500,000. The thermoplastic elastomer has transparency and rubber properties (rubber elasticity) and can be (repeatedly) molded thermally and reversibly, and thus can be suitably used in potting materials or various sealing materials. In formula (1), Ar represents a mesogenic group selected from among structures represented by formula (2) below, a represents an integer of 0.5-1, b represents a number of 0-0.5 (a and b respectively represent the ratio of the number of respective repeating units to the sum of all the repeating units in the molecule, and a+b=1), Ris a monovalent hydrocarbon group that does not contain a C1-8 aliphatic unsaturated bond, and Ris a hydrogen atom, &#x2014;Si(CH), &#x2014;Si(CH)(OH), &#x2014;Si(CH)(CH&#x2550;CH) or &#x2014;Si(CH)(CH&#x2014;CH&#x2550;CH). 

Mesogen-silicon compound (co)polymer and thermoplastic elastomer

Provided is a heat dissipation material comprising a mesogen/silicon compound (co)polymer having a number average molecular weight of 1,000-500,000, represented by general formula (1). (Ar is a mesogen group selected from the structure represented by the following formulas. a represents a positive number from 0.5 to 1, b represents a number from 0 to 0.5 (with the caveat that a and b each represent the ratio of each number of repeating units in molecules, and a+b=1). Ris independently a monovalent hydrocarbon group which does not independently include a Caliphatic unsaturated bond. Ris independently a hydrogen atom, &#x2014;Si(CH), &#x2014;Si(CH)(OH), &#x2014;Si(CH)(CH&#x2550;CH) or &#x2014;Si(CH)(CH&#x2014;CH&#x2550;CH)). This heat dissipation material has excellent thermal conductivity, and further shows good thermoplastic properties and has excellent moldability, and hence can be suitably used as a resin material for heat dissipation materials and semiconductor devices and electronic parts in particular.

Heat dissipation material

Provided is an alkoxysilyl-vinylene group-containing silicon compound represented by the following general formula (1): wherein each of Rand Rindependently represents a monovalent hydrocarbon group having 1 to 20 carbon atoms; R represents a monovalent hydrocarbon group having an organic functional group(s) and 1 to 30 carbon atoms; and n represents an integer of 1 to 3. The alkoxy groups in the novel organic silicon compound of the invention have a dramatically improved hydrolyzability. Further, a high adhesion or adhesiveness; and a fast adhesiveness can be exhibited by adding the novel organic silicon compound to a room temperature curable organopolysiloxane.

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Annaka, Japan

Akira Uta